56 Flash Memory 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Sector Size (Words)	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Toggle Bit	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Reverse Pinout	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	No. of Sectors/Size	Command User Interface	Terminal Finish	Ready or Busy	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Endurance	Width	Qualification	Maximum Write Cycle Time (tWC)	Boot Block	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	Page Size (words)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Maximum Standby Current	Length	Common Flash Interface	Maximum Access Time	Programming Voltage (V)	Data Polling
S29GL512T11TFIV10	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	85 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3		260			18.4 mm		110 ns	2.7
S29GL512T10GHI010	Infineon Technologies	FLASH	INDUSTRIAL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8			.8 mm	85 Cel			32MX16	32M	-40 Cel					BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm				536870912 bit	2.7 V								9 mm		100 ns	2.7
S29GL512T12TFVV10	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	105 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		120 ns	2.7
S29GL512T10TFA020	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	85 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V	CAN ALSO BE ORGANISED AS 512MX1		e3					18.4 mm		100 ns	2.7
S29GL512S12TFIV10	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	64K	80 mA	67108864 words	3	YES	3/3.3	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			64MX8	64M	-40 Cel	512	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified			536870912 bit	2.7 V		16	e3			NOR TYPE	.0001 Amp	18.4 mm	YES	120 ns	2.7	YES
S29GL512T10TFI030	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	85 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		100 ns	2.7
S29GL512T10TFI013	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	85 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		100 ns	2.7
S29GL512T12TFVV23	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	105 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		120 ns	2.7
S29GL512T13TFNV10	Infineon Technologies	FLASH	AUTOMOTIVE	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	125 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		130 ns	2.7
MBM29QM12DH70PCN	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING	PARALLEL		4K,32K	60 mA	8388608 words		YES	1.8,3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56						Not Qualified		BOTTOM/TOP	134217728 bit			8				NOR TYPE	.000005 Amp		YES	70 ns		YES
S29GL512T11TFIV20	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS			33554432 words	3			16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		8			.5 mm	85 Cel			32MX16	32M	-40 Cel			MATTE TIN		DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm				536870912 bit	2.7 V			e3					18.4 mm		110 ns	2.7
S29PL032J60BFW153	Infineon Technologies	FLASH	OTHER	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	2097152 words	3	YES	3/3.3	16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			2MX16	2M	-25 Cel	16,62	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	33554432 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	60 ns	3	YES
S29PL127J60TFW130	Infineon Technologies	FLASH	OTHER	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-25 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL127J70BFI131	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	BGA80,8X12,32		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J70TFI011	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING	PARALLEL		4K,32K	70 mA	8388608 words		YES	1.8,3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	TIN SILVER COPPER	YES	DUAL	R-PDSO-G56	3					Not Qualified		BOTTOM/TOP	134217728 bit			8	e1	40	260	NOR TYPE	.000005 Amp		YES	70 ns	3	YES
S29PL064J60BFI151	Infineon Technologies	FLASH	INDUSTRIAL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	4194304 words	3	YES	3/3.3	16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			4MX16	4M	-40 Cel	16,126	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	67108864 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	60 ns	3	YES
S29PL127J65BFI132	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	BGA80,8X12,32		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	65 ns	3	YES
S29PL127J70TFW133	Infineon Technologies	FLASH	OTHER	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-25 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL032J55BFI150	Infineon Technologies	FLASH	INDUSTRIAL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	2097152 words	3	YES	3/3.3	16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			2MX16	2M	-40 Cel	16,62	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	33554432 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	55 ns	3	YES
S29PL127J60TFI133	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL032J70BFW150	Infineon Technologies	FLASH	OTHER	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	2097152 words	3	YES	3/3.3	16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			2MX16	2M	-25 Cel	16,62	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	33554432 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	70 ns	3	YES
S29PL127J70TFI080	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3			NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J60TFW081	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-25 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00006 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL064J60BFI153	Infineon Technologies	FLASH	INDUSTRIAL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	4194304 words	3	YES	3/3.3	16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			4MX16	4M	-40 Cel	16,126	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	67108864 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	60 ns	3	YES
S29PL127J70TFW010	Infineon Technologies	FLASH	OTHER	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING	PARALLEL		4K,32K	70 mA	8388608 words		YES	1.8,3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-25 Cel	16,254	YES	TIN SILVER COPPER	YES	DUAL	R-PDSO-G56	3					Not Qualified		BOTTOM/TOP	134217728 bit			8	e1	40	260	NOR TYPE	.000005 Amp		YES	70 ns	3	YES
S29PL127J65TFW133	Infineon Technologies	FLASH	OTHER	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-25 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	65 ns	3	YES
S29PL127J60TFI132	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL032J60BFW15	Infineon Technologies	FLASH	OTHER	56	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	2097152 words	3	YES	3/3.3	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA56,8X8,32		Flash Memories		.8 mm	85 Cel			2MX16	2M	-25 Cel	16,62	YES	TIN SILVER COPPER	YES	BOTTOM	R-PBGA-B56	3	3.6 V	1.2 mm		7 mm	Not Qualified		BOTTOM/TOP	33554432 bit	2.7 V		8	e1	40	260	NOR TYPE	.000005 Amp	9 mm	YES	60 ns	3	YES
S29PL127J70TFA082	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J80TFW093	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	1.8	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-25 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		1.95 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00008 ms	BOTTOM/TOP	134217728 bit	1.65 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	80 ns	1.8	YES
S29PL127J70TFI083	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J80TFI090	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	1.8	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	1.95 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00008 ms	BOTTOM/TOP	134217728 bit	1.65 V	TOP AND BOTTOM BOOT BLOCK	8	e3			NOR TYPE	.000005 Amp	18.4 mm	YES	80 ns	1.8	YES
S29PL127J70BFI083	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J80TFA093	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	1.8	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		1.95 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00008 ms	BOTTOM/TOP	134217728 bit	1.65 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	80 ns	1.8	YES
S29PL127J70TFW080	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-25 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J60BFI081	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00006 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
AM29LV640ML11REIN	Infineon Technologies	FLASH		56	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	64K	60 mA	4194304 words	3.3	YES		16	SMALL OUTLINE, THIN PROFILE	TSSOP56,.8,20	8		20	.5 mm	85 Cel	NO	3-STATE	4MX16	4M	-40 Cel	128	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00011 ms		67108864 bit	3 V		4/8				NOR TYPE	.000005 Amp	18.4 mm	YES	110 ns	3.3	YES
S29PL127J60TFA081	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00006 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL127J70BFI080	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J60TFA082	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00006 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL127J70BFI082	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00007 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	70 ns	3	YES
S29PL127J60BFW082	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-25 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		3.6 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00006 ms	BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL127J80TFA091	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	1.8	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-40 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		1.95 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00008 ms	BOTTOM/TOP	134217728 bit	1.65 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	80 ns	1.8	YES
S29PL64J60BFW15	Infineon Technologies	FLASH	OTHER	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS			4194304 words	3			16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.8 mm	85 Cel			4MX16	4M	-25 Cel					BOTTOM	R-PBGA-B56		3.6 V	1 mm		7 mm	Not Qualified		BOTTOM/TOP	67108864 bit	2.7 V						NOR TYPE		9 mm		60 ns	3
S29PL127J65TFI130	Infineon Technologies	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20		Flash Memories		.5 mm	85 Cel			8MX16	8M	-40 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	65 ns	3	YES
S29PL127J60BFW132	Infineon Technologies	FLASH	OTHER	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	3	YES	3/3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	BGA80,8X12,32		Flash Memories		.5 mm	85 Cel			8MX16	8M	-25 Cel	16,254	YES	MATTE TIN	YES	DUAL	R-PDSO-G56	3	3.6 V	1.2 mm		14 mm	Not Qualified		BOTTOM/TOP	134217728 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8	e3	40	260	NOR TYPE	.000005 Amp	18.4 mm	YES	60 ns	3	YES
S29PL127J80TFW092	Infineon Technologies	FLASH		56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	8388608 words	1.8	YES		16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.8,20			20	.5 mm	85 Cel		3-STATE	8MX16	8M	-25 Cel	16,254	YES		YES	DUAL	R-PDSO-G56		1.95 V	1.2 mm	100000 Write/Erase Cycles	14 mm		.00008 ms	BOTTOM/TOP	134217728 bit	1.65 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	18.4 mm	YES	80 ns	1.8	YES
S29PL064J55BFA101	Infineon Technologies	FLASH		56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	PARALLEL	ASYNCHRONOUS	4K,32K	70 mA	4194304 words	3	YES		16	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,8X8,32			20	.8 mm	85 Cel		3-STATE	4MX16	4M	-40 Cel	16,126	YES		YES	BOTTOM	R-PBGA-B56		3.6 V	1 mm	100000 Write/Erase Cycles	7 mm		.000055 ms	BOTTOM/TOP	67108864 bit	2.7 V	TOP AND BOTTOM BOOT BLOCK	8				NOR TYPE	.000005 Amp	9 mm	YES	55 ns	3	YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.