63 Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

NAND08GW4B3CZB1F

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

536870912 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

512MX16

512M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9.5 mm

Not Qualified

8589934592 bit

2.7 V

e1

12 mm

25000 ns

3

NAND128R4A3CZA1E

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY

70 Cel

8MX16

8M

0 Cel

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

134217728 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

15000 ns

1.8

NAND01GR3A3CZA6E

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY

85 Cel

128MX8

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e1

15000 ns

1.8

NAND01GR4A1CZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

85 Cel

64MX16

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e1

15000 ns

1.8

NAND128R3A3CZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

8

GRID ARRAY

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

134217728 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

15000 ns

1.8

NAND512R4B2CZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

12 mm

25000 ns

1.8

NAND512W4B3CZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-40 Cel

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

12 mm

35 ns

3

NAND01GR3A3BZA1

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY

70 Cel

128MX8

128M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e0

15000 ns

1.8

NAND02GW4B2AZB6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

30 mA

134217728 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9.5 mm

Not Qualified

2147483648 bit

2.7 V

1K

e0

.00005 Amp

12 mm

35 ns

3

NO

NAND01GR4A1AZB1F

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K

15 mA

67108864 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX16

64M

0 Cel

8K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

8.5 mm

Not Qualified

1073741824 bit

1.7 V

256

e1

.0001 Amp

15 mm

15000 ns

1.8

NO

NAND512R3A0DZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY

85 Cel

64MX8

64M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

536870912 bit

1.65 V

e0

SLC NAND TYPE

15000 ns

1.8

NAND256W4A1DZA1

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY

70 Cel

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

3.6 V

Not Qualified

268435456 bit

2.7 V

e0

12000 ns

3

NAND01GR4A0DZA1F

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

70 Cel

64MX16

64M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e1

15000 ns

1.8

NAND02GR3B3CZB6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9.5 mm

Not Qualified

2147483648 bit

1.7 V

e0

12 mm

35 ns

1.8

NAND01GR3A1DZA1T

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY

70 Cel

128MX8

128M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e0

15000 ns

1.8

NAND01GW3B2BZA1

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

128MX8

128M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9.5 mm

Not Qualified

1073741824 bit

2.7 V

e0

12 mm

35 ns

3

NAND01GR3A2DZA6E

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY

85 Cel

128MX8

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e1

15000 ns

1.8

NAND512W4A2AZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K

20 mA

33554432 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9 mm

Not Qualified

536870912 bit

2.7 V

256

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.00005 Amp

11 mm

12000 ns

3

NO

NAND08GR4B3CZB6

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

536870912 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX16

512M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9.5 mm

Not Qualified

8589934592 bit

1.7 V

e0

12 mm

25000 ns

1.8

NAND08GW3B3BZB6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1073741824 words

3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX8

1G

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9.5 mm

Not Qualified

8589934592 bit

2.7 V

e0

12 mm

25000 ns

3

NAND02GR4B2DZA6F

STMicroelectronics

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

20 mA

134217728 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

2147483648 bit

1K

.00005 Amp

NO

NAND512R3A1DZA1E

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY

70 Cel

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

536870912 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

15000 ns

1.8

NAND01GR3A2CZB6E

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9 mm

Not Qualified

1073741824 bit

1.7 V

e1

SLC NAND TYPE

11 mm

35 ns

1.8

NAND01GR4A0BZB1T

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX16

64M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9 mm

Not Qualified

1073741824 bit

1.7 V

e0

SLC NAND TYPE

11 mm

35 ns

1.8

NAND08GR4B3CZC1E

STMicroelectronics

FLASH

COMMERCIAL

63

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

536870912 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

512MX16

512M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

1.4 mm

8.5 mm

Not Qualified

8589934592 bit

1.7 V

e1

15 mm

35 ns

1.8

NAND512R4A0AZA1

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K

15 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9 mm

Not Qualified

536870912 bit

1.7 V

256

e0

SLC NAND TYPE

.00005 Amp

11 mm

35 ns

1.8

NO

NAND512R3B2AZA6

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

15 mA

67108864 words

1.8

NO

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX8

64M

-40 Cel

512

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

2K

e0

.00005 Amp

12 mm

25000 ns

1.8

NO

NAND01GR4A2AZA6

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

8.5 mm

Not Qualified

1073741824 bit

1.7 V

e0

15 mm

15000 ns

1.8

NAND512R4B3BZA1F

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

12 mm

35 ns

1.8

NAND01GR3B2AZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

15 mA

134217728 words

1.8

NO

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9.5 mm

Not Qualified

1073741824 bit

1.7 V

2K

e0

.00005 Amp

12 mm

35 ns

1.8

NO

NAND02GW3B2AZB6

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

268435456 words

3

NO

3/3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9.5 mm

Not Qualified

2147483648 bit

2.7 V

2K

e0

.00005 Amp

12 mm

35 ns

3

NO

NAND01GR4A1BZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

85 Cel

64MX16

64M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e0

15000 ns

1.8

NAND02GW3B2AZB1F

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

268435456 words

3

NO

3/3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

256MX8

256M

0 Cel

2K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9.5 mm

Not Qualified

2147483648 bit

2.7 V

2K

e1

.00005 Amp

12 mm

25000 ns

3

NO

NAND512W3B2AZA1

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

30 mA

67108864 words

3

NO

3/3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX8

64M

0 Cel

512

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

2.7 V

2K

e0

.00005 Amp

12 mm

25000 ns

3

NO

NAND512R3A2AZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K

15 mA

67108864 words

1.8

NO

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX8

64M

-40 Cel

4K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9 mm

Not Qualified

536870912 bit

1.7 V

512

e0

SLC NAND TYPE

.00005 Amp

11 mm

35 ns

1.8

NO

NAND512R4A0AZA6

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K

15 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

4K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9 mm

Not Qualified

536870912 bit

1.7 V

256

e0

SLC NAND TYPE

.00005 Amp

11 mm

35 ns

1.8

NO

NAND01GR4A1AZB1

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K

15 mA

67108864 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX16

64M

0 Cel

8K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

8.5 mm

Not Qualified

1073741824 bit

1.7 V

256

e0

.0001 Amp

15 mm

15000 ns

1.8

NO

NAND512W3A0BZA1F

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9 mm

Not Qualified

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

11 mm

35 ns

3

NAND01GW3B3CZA1E

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

128MX8

128M

0 Cel

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9.5 mm

Not Qualified

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

12 mm

35 ns

3

NAND01GR4A3BZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

85 Cel

64MX16

64M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e0

15000 ns

1.8

NAND01GW3A1AZB6F

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K

20 mA

134217728 words

3

NO

3/3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

8K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

8.5 mm

Not Qualified

1073741824 bit

2.7 V

512

e1

.0001 Amp

15 mm

12000 ns

3

NO

NAND01GW4A2CZB1

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX16

64M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B63

3.6 V

1.2 mm

9 mm

Not Qualified

1073741824 bit

2.7 V

e0

SLC NAND TYPE

11 mm

35 ns

3

NAND08GR3B3CZB1E

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1073741824 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

1GX8

1G

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9.5 mm

Not Qualified

8589934592 bit

1.7 V

e1

12 mm

25000 ns

1.8

NAND01GR4A2CZA1F

STMicroelectronics

FLASH

COMMERCIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

70 Cel

64MX16

64M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

1073741824 bit

1.65 V

e1

15000 ns

1.8

NAND01GW4B3AZA1E

STMicroelectronics

FLASH

COMMERCIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

20 mA

67108864 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX16

64M

0 Cel

1K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1.05 mm

9.5 mm

Not Qualified

1073741824 bit

2.7 V

1K

NOT SPECIFIED

NOT SPECIFIED

.00005 Amp

12 mm

35 ns

3

NO

NAND08GW4B3AZC6

STMicroelectronics

FLASH

INDUSTRIAL

63

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

20 mA

536870912 words

3

NO

3/3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX16

512M

-40 Cel

8K

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

3.6 V

1.4 mm

8.5 mm

Not Qualified

8589934592 bit

2.7 V

1K

e0

.00005 Amp

15 mm

35 ns

3

NO

NAND128R4A1DZA6E

STMicroelectronics

FLASH

INDUSTRIAL

63

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

Not Qualified

134217728 bit

1.65 V

NOT SPECIFIED

NOT SPECIFIED

15000 ns

1.8

NAND512R4B2AZA6T

STMicroelectronics

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

15 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

512

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B63

1.95 V

1.05 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

1K

e0

.00005 Amp

12 mm

25000 ns

1.8

NO

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.