RECTANGULAR Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT25QL128ABA1EW7-0SITTR

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

134217728 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

5 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

3

S25FL256SAGMFI000

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

64MX4

64M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

268435456 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

NOR TYPE

.0001 Amp

10.3 mm

3

EPCS1SI8N

Intel

CONFIGURATION MEMORY

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

131072 words

3.3

3.3

1

SMALL OUTLINE

Flash Memories

85 Cel

3-STATE

128KX8

128K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

3

3.6 V

100000 Write/Erase Cycles

40 MHz

Not Qualified

1048576 bit

2.7 V

e4

30

260

.00005 Amp

S25FS128SDSNFI100

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

100 mA

16777216 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

2

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

2 V

.8 mm

100000 Write/Erase Cycles

133 MHz

5 mm

SPI

134217728 bit

1.7 V

e3

NOR TYPE

.0003 Amp

6 mm

1.8

SDINBDG4-16G-I1

Western Digital

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

3000 Write/Erase Cycles

200 MHz

11.5 mm

137438953472 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

MTFC4GACAJCN-1MWT

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

OPEN-DRAIN

4GX8

4G

-25 Cel

NO

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

34359738368 bit

2.7 V

ALSO AVAILABE WITH TAPE AND REEL

30

260

MLC NAND TYPE

13 mm

NO

SST26VF032B-104V/SM

Microchip Technology

EEPROM

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

30 mA

4194304 words

3

8

SMALL OUTLINE

SOP8,.3

100

1.27 mm

105 Cel

4MX8

4M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000 Write/Erase Cycles

104 MHz

5.25 mm

SPI

33554432 bit

2.7 V

e3

40

260

NOR TYPE

.000045 Amp

5.26 mm

3

S25FL256SAGMFI003

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

67108864 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

64MX4

64M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

BOTTOM

268435456 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

NOR TYPE

.0001 Amp

10.3 mm

3

W25Q128JVEIM

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

4

20

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00006 Amp

8 mm

3.3

W25Q64JVZPIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

8388608 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

1

20

1.27 mm

85 Cel

3-STATE

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

133 MHz

5 mm

SPI

67108864 bit

3 V

IT ALSO OPERATES AT 2.7V @ 104MHZ

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00005 Amp

6 mm

3.3

W25Q16JLSNIG

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE

1

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

104 MHz

3.9 mm

16777216 bit

2.7 V

IT ALSO OPERATES AT FREQUENCY 50 MHZ AT SUPPLY VOLTAGE 2.3 TO 2.7 V

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

2.7

AT45DB161E-SHD-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

26 mA

16777216 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX1

16M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

85 MHz

5.24 mm

Not Qualified

SPI

16777216 bit

2.5 V

e4

NOR TYPE

.00001 Amp

5.29 mm

2.7

SST26VF032BT-104I/MF

Microchip Technology

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

4194304 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

100

1.27 mm

85 Cel

4MX8

4M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

Not Qualified

SPI

33554432 bit

2.7 V

e3

NOR TYPE

.000045 Amp

6 mm

3

S29JL032J70TFI320

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

8K,64K

45 mA

2097152 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

BOTTOM BOOT BLOCK

e3

40

260

NOR TYPE

.000005 Amp

18.4 mm

YES

70 ns

3

YES

W25Q16JVZPIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

2MX8

2M

-40 Cel

TIN

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

5 mm

16777216 bit

2.7 V

e3

6 mm

3

M25P40-VMN6TPBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

15 mA

524288 words

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

100000 Write/Erase Cycles

50 MHz

Not Qualified

SPI

4194304 bit

30

260

NOR TYPE

.00001 Amp

3

M25P16-VMN6TPBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

SPI

16777216 bit

2.7 V

30

260

NOR TYPE

.00001 Amp

4.9 mm

2.7

M25P40-VMN6TPBATR

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

524288 words

2.7

8

SMALL OUTLINE

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

50 MHz

3.9 mm

4194304 bit

2.3 V

30

260

NOR TYPE

4.9 mm

3

THGBMNG5D1LBAIT

Toshiba

FLASH

OTHER

153

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

ASYNCHRONOUS

4294967296 words

8

GRID ARRAY

85 Cel

4GX8

4G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

34359738368 bit

2.7 V

MLC NAND TYPE

2.7

SST26VF032B-104V/MF

Microchip Technology

EEPROM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

30 mA

4194304 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

100

1.27 mm

105 Cel

4MX8

4M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

104 MHz

5 mm

SPI

33554432 bit

2.7 V

e3

NOR TYPE

.000045 Amp

6 mm

3

W25Q16JVUXIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.6 mm

133 MHz

2 mm

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

3 mm

3

MX25L3233FM2I-08G

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

8

SMALL OUTLINE

SOP8,.3

4

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.23 mm

SPI

33554432 bit

2.65 V

ALSO ORGANISED AS 32MX1

e3

NOR TYPE

.00005 Amp

5.28 mm

3

W25Q80DVSNIGT

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1048576 words

3

8

SMALL OUTLINE

1

1.27 mm

85 Cel

1MX8

1M

-40 Cel

TIN

DUAL

R-PDSO-G8

3.6 V

1.75 mm

104 MHz

3.9 mm

8388608 bit

2.7 V

e3

4.85 mm

3

MX25R6435FM2IL0

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

1.8

4

SMALL OUTLINE

2

1.27 mm

85 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

3

3.6 V

2.16 mm

33 MHz

5.23 mm

67108864 bit

1.65 V

ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT

e3

5.28 mm

3

S29GL064S70TFI040

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

8MX8

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

14 mm

67108864 bit

2.7 V

e3

18.4 mm

70 ns

3

AT45DB641E-SHN-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

67108864 words

2.3

1

SMALL OUTLINE

1.27 mm

85 Cel

64MX1

64M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

3.6 V

2.16 mm

85 MHz

5.24 mm

67108864 bit

1.7 V

e4

5.29 mm

1.8

AT45DB321D-SU-SL954

Atmel

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

32MX1

32M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

66 MHz

5.24 mm

Not Qualified

SPI

33554432 bit

2.7 V

ORGANIZED AS 8192 PAGES OF 512 BYTES EACH

e3

NOR TYPE

.00001 Amp

5.29 mm

2.7

AT45DB321E-SHFHA-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE

1.27 mm

85 Cel

32MX1

32M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

3.6 V

2.16 mm

85 MHz

5.24 mm

33554432 bit

2.3 V

e4

5.29 mm

3

SDINBDG4-8G-I2

Western Digital

FLASH CARD

OTHER

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

8589934592 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

8GX8

8G

-25 Cel

BOTTOM

3.6 V

.8 mm

3000 Write/Erase Cycles

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

W25Q80DVUXIETR

Winbond Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

25 mA

1048576 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

1

20

.5 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.6 mm

100000 Write/Erase Cycles

104 MHz

2 mm

SPI

8388608 bit

2.7 V

NOR TYPE

.00005 Amp

3 mm

3

MX25V1635FM1I

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4194304 words

3

4

SMALL OUTLINE

2

1.27 mm

85 Cel

4MX4

4M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

80 MHz

3.9 mm

16777216 bit

2.3 V

ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

3

M25P128-VMF6PB

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

10000 Write/Erase Cycles

50 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

2.7

MT25QL01GBBB8ESF-0SIT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1073741824 words

3

1

SMALL OUTLINE

1.27 mm

85 Cel

1GX1

1G

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

133 MHz

7.5 mm

1073741824 bit

2.7 V

30

260

10.3 mm

3

S25FL128SAGMFI003

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

32MX4

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

AT45DB041E-SHN-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16 mA

4194304 words

3

1.8/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

3-STATE

4MX1

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

85 MHz

5.24 mm

Not Qualified

SPI

4194304 bit

2.3 V

e4

260

NOR TYPE

.00004 Amp

5.29 mm

3

S25FL128SAGMFI000

Infineon Technologies

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

100 mA

33554432 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

32MX4

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

133 MHz

7.5 mm

Not Qualified

500 ms

SPI

BOTTOM

134217728 bit

2.7 V

IT ALSO CONFIGURED AS 256M X 1

e3

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

MT29F16G08ABACAWP-ITZ:CTR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2147483648 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

2GX8

2G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

e3

SLC NAND TYPE

18.4 mm

2.7

LE25U40CMC-AH

Onsemi

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

524288 words

2.5

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

512KX8

512K

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.75 mm

100000 Write/Erase Cycles

40 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

2.3 V

e3

30

260

NOR TYPE

.00001 Amp

4.9 mm

2.7

MT29F16G08ABACAWP-ITZ:C

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2147483648 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

2GX8

2G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

e3

30

260

SLC NAND TYPE

18.4 mm

2.7

SST39SF040-55-4I-NHE

Microchip Technology

FLASH

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

4K

35 mA

524288 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

Flash Memories

100

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

128

YES

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

4194304 bit

4.5 V

e3

40

260

NOR TYPE

.0001 Amp

13.97 mm

55 ns

5

YES

AT25SF128A-SHB-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.24 mm

SPI

134217728 bit

2.7 V

e4

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000025 Amp

5.29 mm

M25P40-VMN6PB

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

524288 words

2.7

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

512KX8

512K

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.75 mm

100000 Write/Erase Cycles

50 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

2.3 V

e4

30

260

NOR TYPE

.00001 Amp

4.9 mm

3

W25Q256JVFIQ

Winbond Electronics

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3.3

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.64 mm

100000 Write/Erase Cycles

133 MHz

7.49 mm

SPI

268435456 bit

3 V

ALSO OPERATES AT 104MHZ AT 2.7-3.0V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

10.31 mm

3.3

S25FL512SAGBHIC10

Infineon Technologies

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

100 mA

64094208 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

4

Flash Memories

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

Not Qualified

SPI

512753664 bit

2.7 V

e1

260

NOR TYPE

.0003 Amp

8 mm

3

MX25L6433FM2I-08G

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

16777216 words

3

4

SMALL OUTLINE

SOP8,.3

2

20

1.27 mm

85 Cel

16MX4

16M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.23 mm

SPI

67108864 bit

2.65 V

ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT

e3

40

260

NOR TYPE

.00002 Amp

5.28 mm

3

MT29F2G08ABAEAWP-IT:E

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

268435456 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

10

.5 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

2147483648 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

NO

MT29F2G08ABAEAWP-IT:ETR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

268435456 words

3.3

NO

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

10

.5 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

2147483648 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

NO

MT25QL512ABB1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

536870912 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

512MX1

512M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

6 mm

536870912 bit

2.7 V

30

260

8 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.