Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
4194304 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
67108864 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
10K ERASE/PROGRAM CYCLES |
NOR TYPE |
16.5862 mm |
150 ns |
12 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
26 mA |
2097152 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
TOP |
33554432 bit |
1.65 V |
4 |
e0 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
4194304 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
67108864 bit |
NOR TYPE |
.000005 Amp |
YES |
85 ns |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
8K,4K,16K,32K |
50 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
85 Cel |
64KX16 |
64K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
Not Qualified |
BOTTOM |
1048576 bit |
e0 |
NOR TYPE |
.0001 Amp |
50 ns |
YES |
||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
MOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
90 ns |
12 |
NO |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
e1 |
NOR TYPE |
7 mm |
100 ns |
1.8 |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
26 mA |
2097152 words |
2 |
YES |
2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
TOP |
33554432 bit |
1.8 V |
4 |
e0 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
85 ns |
1.8 |
YES |
||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
26 mA |
2097152 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
4 |
e0 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
NOR TYPE |
7 mm |
120 ns |
1.8 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
TOP |
33554432 bit |
1.8 V |
e1 |
NOR TYPE |
7 mm |
85 ns |
1.8 |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
2097152 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
TOP |
33554432 bit |
NOR TYPE |
.000005 Amp |
YES |
85 ns |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
2097152 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
TOP |
33554432 bit |
e0 |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
NO |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
2097152 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
33554432 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
100 ns |
12 |
NO |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
40 mA |
524288 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
8,15 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
8388608 bit |
1.65 V |
4 |
e1 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
100 ns |
1.8 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
26 mA |
2097152 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
4 |
e0 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
QUAD |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19 mm |
Not Qualified |
10 ms |
1048576 bit |
3 V |
NOR TYPE |
19.1 mm |
70 ns |
3.3 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.75 V |
NOR TYPE |
16.5862 mm |
150 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.75 V |
BULK ERASE |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
100 ns |
12 |
NO |
||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
26 mA |
2097152 words |
2 |
YES |
2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.8 V |
4 |
e0 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
85 ns |
1.8 |
YES |
||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
e1 |
NOR TYPE |
7 mm |
120 ns |
1.8 |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
QUAD |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19 mm |
Not Qualified |
10 ms |
1048576 bit |
3 V |
NOR TYPE |
19.1 mm |
12 ns |
3.3 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
NOR TYPE |
7 mm |
120 ns |
1.8 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
2097152 words |
NO |
1.8/3.3,3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
TOP |
33554432 bit |
NOR TYPE |
.000005 Amp |
YES |
100 ns |
NO |
|||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
40 mA |
524288 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
8,15 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
8388608 bit |
1.65 V |
4 |
e1 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
2MX16 |
2M |
0 Cel |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
33554432 bit |
1.65 V |
NOR TYPE |
7 mm |
100 ns |
1.8 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
MOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
16.5862 mm |
200 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
32K,128K |
15 mA |
8388608 words |
YES |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
8,62 |
YES |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
8 |
NOR TYPE |
.0001 Amp |
YES |
60 ns |
YES |
||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
MOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.75 V |
NOR TYPE |
16.5862 mm |
200 ns |
12 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
40 mA |
524288 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
8,15 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.35 mm |
7 mm |
Not Qualified |
BOTTOM |
8388608 bit |
1.65 V |
4 |
e1 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.75 V |
NOR TYPE |
16.5862 mm |
100 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,16K,32K |
50 mA |
1048576 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
QUAD |
S-PQCC-J52 |
3.6 V |
4.57 mm |
19 mm |
Not Qualified |
10 ms |
1048576 bit |
3 V |
NOR TYPE |
19.1 mm |
70 ns |
3.3 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,16K,32K |
50 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
85 Cel |
64KX16 |
64K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT BLOCK; BLOCK ERASE |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
MOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
200 ns |
12 |
NO |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,16K,32K |
20 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
1,2,1,1 |
YES |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.585 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
16.586 mm |
55 ns |
5 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
85 Cel |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.75 V |
100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT BLOCK; BLOCK ERASE |
NOR TYPE |
16.5862 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
125 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
16.5862 mm |
120 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
BULK ERASE |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
150 ns |
12 |
NO |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
40 mA |
524288 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.35 mm |
7 mm |
Not Qualified |
BOTTOM |
8388608 bit |
1.65 V |
4 |
e1 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
100 ns |
1.8 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOR TYPE |
16.5862 mm |
100 ns |
12 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
5 |
NO |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
10K ERASE/PROGRAM CYCLES |
e0 |
NOR TYPE |
.0001 Amp |
16.5862 mm |
150 ns |
12 |
NO |
|||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
COMMERCIAL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
40 mA |
524288 words |
1.8 |
YES |
1.8/2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Flash Memories |
.75 mm |
70 Cel |
512KX16 |
512K |
0 Cel |
8,15 |
YES |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B48 |
2.2 V |
1.2 mm |
7 mm |
Not Qualified |
BOTTOM |
8388608 bit |
1.65 V |
4 |
e1 |
NOR TYPE |
.000005 Amp |
7 mm |
YES |
120 ns |
1.8 |
YES |
|||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
8 |
FLATPACK |
.65 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
QUAD |
S-PQFP-G52 |
3.6 V |
2.35 mm |
10 mm |
Not Qualified |
10 ms |
1048576 bit |
3 V |
NOR TYPE |
10 mm |
70 ns |
3.3 |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
2097152 words |
NO |
1.8/3.3,3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
TOP |
33554432 bit |
e0 |
NOR TYPE |
.000005 Amp |
YES |
100 ns |
NO |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
4K,32K |
20 mA |
4194304 words |
NO |
3/3.3 |
16 |
GRID ARRAY |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
BOTTOM |
S-PBGA-B64 |
Not Qualified |
BOTTOM |
67108864 bit |
NOR TYPE |
.000005 Amp |
YES |
85 ns |
NO |
|||||||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
8K,4K,16K,32K |
50 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
85 Cel |
64KX16 |
64K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
QUAD |
S-PQCC-J44 |
Not Qualified |
BOTTOM |
1048576 bit |
e0 |
NOR TYPE |
.0001 Amp |
45 ns |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.