Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
125 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
6 mm |
3 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.29 mm |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00008 Amp |
5.29 mm |
3 |
||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
500 ms |
268435456 bit |
2.7 V |
ALSO CONFIGURABLE AS 256M X 1 |
e3 |
10.3 mm |
3 |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
20 |
1.27 mm |
125 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
125 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
.00006 Amp |
5.28 mm |
3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
94 mA |
268435456 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
1 |
1 mm |
125 Cel |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
2147483648 bit |
1.7 V |
e1 |
30 |
260 |
NOR TYPE |
.00013 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
16777216 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
24 |
VBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
PARALLEL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE |
1 mm |
125 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3 |
1.95 V |
1 mm |
6 mm |
536870912 bit |
1.7 V |
8 mm |
96 ns |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
35 mA |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
105 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.00008 Amp |
8 mm |
3 |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
128MX8 |
128M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
3 |
2 V |
1.2 mm |
166 MHz |
6 mm |
1073741824 bit |
1.7 V |
e1 |
30 |
260 |
8 mm |
1.8 |
|||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
1.27 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0002 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
55 mA |
134217728 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
1 |
20 |
1 mm |
125 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
SPI |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0006 Amp |
8 mm |
|||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3.3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
3 V |
TOP BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
55 ns |
3 |
YES |
||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
125 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
133 MHz |
3.9 mm |
16777216 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
500 ms |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
30 |
260 |
10.3 mm |
3 |
|||||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
4K,2K,16K |
50 mA |
524288 words |
3.3 |
NO |
3/3.3 |
32 |
GRID ARRAY, LOW PROFILE |
BGA80,8X10,40 |
Flash Memories |
1 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
4,8,62 |
YES |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1.7 mm |
10 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
4 |
NOR TYPE |
.00015 Amp |
12 mm |
YES |
45 ns |
3.3 |
NO |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
85 mA |
268435456 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
256MX8 |
256M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
BOTTOM/TOP |
2147483648 bit |
2.7 V |
NOR TYPE |
.0005 Amp |
8 mm |
3 |
|||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
33554432 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
16MX4 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
108 MHz |
5.28 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
NOR TYPE |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||
Adesto Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
1 |
SMALL OUTLINE |
125 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
85 MHz |
4194304 bit |
2.5 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE |
SOP16,.4 |
1 |
1.27 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
SPI |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0002 Amp |
10.3 mm |
1.8 |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
108 MHz |
5.28 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||
Dialog Semiconductor |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
1 |
SMALL OUTLINE |
125 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
85 MHz |
16777216 bit |
2.5 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
125 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
536870912 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
Dialog Semiconductor |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
1 |
SMALL OUTLINE |
125 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
85 MHz |
16777216 bit |
2.5 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
4MX8 |
4M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
133 MHz |
3.9 mm |
33554432 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
33554432 words |
3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
125 Cel |
3-STATE |
32MX8 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
SPI |
268435456 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
500 ms |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
30 |
260 |
10.3 mm |
3 |
|||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
125 Cel |
4MX8 |
4M |
-40 Cel |
Tin (Sn) |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
33554432 bit |
2.3 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
3 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
10 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
125 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
AUTOMOTIVE |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4194304 words |
1 |
SMALL OUTLINE |
125 Cel |
4MX1 |
4M |
-40 Cel |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
85 MHz |
4194304 bit |
1.7 V |
1.8 |
||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
1.27 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.285 mm |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0002 Amp |
5.285 mm |
3 |
|||||||||||||||||||||||||
STMicroelectronics |
FLASH |
AUTOMOTIVE |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2K,16K |
40 mA |
524288 words |
3 |
NO |
2.5/3.3,3/3.3 |
32 |
FLATPACK |
QFP80,.7X.9,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX32 |
512K |
-40 Cel |
8,31 |
YES |
QUAD |
R-PQFP-G80 |
3.6 V |
3.4 mm |
14 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
20 mm |
YES |
70 ns |
3 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
268435456 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
125 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
16777216 bit |
2.3 V |
e3 |
NOR TYPE |
.00003 Amp |
5.28 mm |
3 |
||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
524288 words |
8 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
20000 Write/Erase Cycles |
85 MHz |
3.9 mm |
SPI |
4194304 bit |
1.7 V |
.000065 Amp |
4.925 mm |
||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
125 Cel |
4MX8 |
4M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
133 MHz |
3.9 mm |
33554432 bit |
2.3 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
3 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
1.8 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
1.27 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
2 V |
2.16 mm |
166 MHz |
5.285 mm |
SPI |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0002 Amp |
5.285 mm |
1.8 |
||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
16MX4 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
108 MHz |
5.28 mm |
67108864 bit |
2.7 V |
IT ALSO HAVE X1 MEMORY WIDTH |
e3 |
5.28 mm |
3 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
64MX8 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
536870912 bit |
1.7 V |
e1 |
30 |
260 |
8 mm |
1.8 |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
200 mA |
134217728 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
125 Cel |
3-STATE |
128MX8 |
128M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
1073741824 bit |
2.7 V |
NOR TYPE |
8 mm |
3 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
64MX1 |
64M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
67108864 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
125 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
166 MHz |
5.28 mm |
SPI |
134217728 bit |
2.3 V |
ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00007 Amp |
5.28 mm |
3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
125 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
108 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||||||||
Infineon Technologies |
FLASH |
AUTOMOTIVE |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
125 Cel |
64MX4 |
64M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
268435456 bit |
2.7 V |
IT ALSO HAVE MEMORY WIDTH X 1 |
NOR TYPE |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
AUTOMOTIVE |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
128MX1 |
128M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-G8 |
1 |
1.95 V |
2.16 mm |
133 MHz |
5.28 mm |
134217728 bit |
1.65 V |
e3 |
10 |
260 |
5.28 mm |
1.8 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.