Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
4194304 bit |
2.7 V |
e4 |
20 |
260 |
.00005 Amp |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18 mA |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
67108864 bit |
3 V |
2.7V TO 3V @ 104MHZ |
e3 |
30 |
260 |
NOR TYPE |
.00005 Amp |
5.28 mm |
3.3 |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
16777216 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
85 MHz |
5.24 mm |
33554432 bit |
2.3 V |
e4 |
260 |
5.29 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.41 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
16777216 bit |
2.7 V |
e4 |
20 |
260 |
.00005 Amp |
|||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
.000045 Amp |
5.26 mm |
3 |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.23 mm |
134217728 bit |
2.7 V |
IT ALSO OPERATES AT 104MHZ CLOCK FREQ |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
5.23 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
52 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
MLC NAND TYPE |
13 mm |
NO |
|||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
134217728 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00006 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
85 MHz |
5.24 mm |
33554432 bit |
2.3 V |
e4 |
5.29 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000045 Amp |
5.26 mm |
3 |
|||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 528 BYTES EACH |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
28 mA |
8388608 words |
3 |
NO |
2.5/3,3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
TOP |
134217728 bit |
2.3 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
8 |
e3 |
NOR TYPE |
.002 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
4194304 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e4 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
33554432 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3 |
YES |
3,3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
20 |
.5 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
1000000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.285 mm |
134217728 bit |
2.7 V |
30 |
260 |
5.285 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
4194304 words |
3.3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
33554432 bit |
3 V |
2.7V NOMINAL AVAILABLE WITH 104MHZ |
e3 |
260 |
5.28 mm |
3 |
|||||||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
67108864 bit |
2.7 V |
e4 |
.0001 Amp |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8K,64K |
45 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
16,126 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP BOOT BLOCK, BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2147483648 words |
1.8 |
1 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
2GX1 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
2147483648 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
50 MHz |
5.275 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.00002 Amp |
5.275 mm |
|||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
67108864 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
64MX4 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
268435456 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
100 mA |
33554432 words |
3 |
3/3.3 |
4 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX4 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
IT ALSO CONFIGURED AS 256M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000045 Amp |
5.26 mm |
3 |
|||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
134217728 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00006 Amp |
5.28 mm |
3.3 |
||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
SOFTWARE |
S-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
50 MHz |
5.275 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e4 |
260 |
NOR TYPE |
.00002 Amp |
5.275 mm |
||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
8388608 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
2 |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
108 MHz |
5.28 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
.00002 Amp |
5.28 mm |
3 |
||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
Not Qualified |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e4 |
260 |
NOR TYPE |
.00004 Amp |
4.925 mm |
3 |
|||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
e4 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.23 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
16777216 bit |
2.7 V |
e3 |
260 |
NOR TYPE |
.000025 Amp |
4.9 mm |
3 |
|||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
2.3 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
85 MHz |
5.24 mm |
67108864 bit |
1.7 V |
e4 |
5.29 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
85 MHz |
5.24 mm |
Not Qualified |
SPI |
16777216 bit |
2.5 V |
e4 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8388608 words |
3.3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
133 MHz |
5.28 mm |
67108864 bit |
3 V |
ALSO OPERATES WITH 2.7V-3V SUPPLY AT 104MHZ |
e3 |
30 |
260 |
5.28 mm |
2.7 |
|||||||||||||||||||||||||||||
|
Winbond Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
133 MHz |
3.9 mm |
16777216 bit |
3 V |
ALSO IT OPERATES AT 2.7V TO 3V WITH 104 MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
4.85 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3 |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
8388608 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE |
1 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
DUAL |
S-PDSO-G8 |
3.6 V |
2.16 mm |
133 MHz |
5.285 mm |
134217728 bit |
2.7 V |
30 |
260 |
5.285 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
75 MHz |
3.9 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
35 mA |
134217728 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
6 mm |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
8 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.