Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Atmel |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0003 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.75 V |
e0 |
30 |
225 |
NOR TYPE |
.00003 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
2K |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
256 |
e3 |
260 |
NOR TYPE |
.0003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
66 MHz |
3.9 mm |
Not Qualified |
SPI |
2097152 bit |
2.7 V |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
|||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX1 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
2097152 bit |
2.7 V |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
24 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
1 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.4 mm |
66 MHz |
6 mm |
Not Qualified |
33554432 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 528 BYTES EACH |
e3 |
8 mm |
2.7 |
|||||||||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
66 MHz |
6 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 528 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
8 mm |
2.7 |
||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
524288 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.65 V |
4/8 |
e3 |
260 |
NOR TYPE |
.000025 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
Flash Memories |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
512 |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
5.59 mm |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
NOR TYPE |
.0003 Amp |
36.95 mm |
120 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
66 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
ORGANIZED AS 2048 PAGES OF 256 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
66 MHz |
5.24 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
ORGANIZED AS 2048 PAGES OF 256 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
5.29 mm |
2.7 |
||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
256 |
e0 |
NOR TYPE |
.0003 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
80 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
45 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.65 V |
e0 |
NOR TYPE |
.000025 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
15 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1K |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
2097152 bit |
3 V |
e3 |
30 |
260 |
NOR TYPE |
.00005 Amp |
18.4 mm |
100 ns |
3 |
YES |
|||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
1K |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
2097152 bit |
4.5 V |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
256 |
e0 |
NOR TYPE |
.0001 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
2K |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
256 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
16.5862 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e0 |
225 |
NOR TYPE |
.0002 Amp |
16.5862 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
512 |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
12 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.75 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.56 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.75 V |
HARDWARE AND SOFTWARE DATA PROTECTION; 10000 CYCLES TYPICAL ENDURANCE |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.56 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
HARDWARE AND SOFTWARE DATA PROTECTION; 10000 CYCLES TYPICAL ENDURANCE |
64 |
e0 |
30 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
90 ns |
5 |
YES |
|||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
524288 bit |
4.75 V |
128 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
35 mA |
1081344 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
Flash Memories |
.55 mm |
70 Cel |
1081344X8 |
1081344 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
20 MHz |
8 mm |
Not Qualified |
SPI |
8650752 bit |
2.7 V |
ORGANIZED AS 4096 PAGES OF 264 BYTES EACH |
e0 |
240 |
NOR TYPE |
.00001 Amp |
11.8 mm |
2.7 |
|||||||||||||||||||||||
Atmel |
FLASH CARD |
INDUSTRIAL |
7 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
3 |
8 |
UNCASED CHIP |
85 Cel |
8MX8 |
8M |
-40 Cel |
UPPER |
X-XUUC-N7 |
3.6 V |
66 MHz |
Not Qualified |
67108864 bit |
2.7 V |
NOR TYPE |
2.7 |
|||||||||||||||||||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
25 mA |
262144 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,3 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
e0 |
225 |
NOR TYPE |
.0001 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX1 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
70 MHz |
3.9 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.000015 Amp |
4.925 mm |
2.7 |
|||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
256 |
e0 |
240 |
NOR TYPE |
.0001 Amp |
18.4 mm |
120 ns |
5 |
YES |
||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
65536 words |
5 |
YES |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
NO |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.57 mm |
10000 Write/Erase Cycles |
16.5862 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e0 |
225 |
NOR TYPE |
.0002 Amp |
16.5862 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
15 mA |
131072 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1K |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.56 mm |
11.43 mm |
Not Qualified |
20 ms |
1048576 bit |
3 V |
e0 |
225 |
NOR TYPE |
.00004 Amp |
13.97 mm |
150 ns |
3 |
YES |
|||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
17 mA |
4194304 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.6 mm |
100000 Write/Erase Cycles |
66 MHz |
5 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
ORGANIZED AS 2048 PAGES OF 264 BYTES EACH |
e3 |
NOR TYPE |
.00001 Amp |
6 mm |
2.7 |
||||||||||||||||||||||
Atmel |
FLASH |
INDUSTRIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL/SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
1 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G40 |
3 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
67108864 bit |
2.7 V |
ORGANISED AS 8192 PAGES OF 1056 BYTES EACH |
e0 |
NOR TYPE |
18.4 mm |
2.7 |
||||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,32K,64K |
80 mA |
1048576 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
8,2,30 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
4.5 V |
CONFIGURABLE AS 2M X 8 |
e0 |
NOR TYPE |
.003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
50 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM |
2097152 bit |
3 V |
e0 |
240 |
NOR TYPE |
.00005 Amp |
18.4 mm |
90 ns |
3 |
YES |
||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
14 mA |
4194304 words |
3 |
2.5/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX1 |
4M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.3 V |
e4 |
NOR TYPE |
.000015 Amp |
4.925 mm |
2.7 |
||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
19 mA |
8388608 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
HARDWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
1000000 Write/Erase Cycles |
85 MHz |
6 mm |
Not Qualified |
5 ms |
SPI |
67108864 bit |
2.7 V |
e4 |
NOR TYPE |
.000005 Amp |
8 mm |
2.7 |
||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
15 mA |
131072 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
1048576 bit |
2.7 V |
e3 |
245 |
NOR TYPE |
.00005 Amp |
13.97 mm |
120 ns |
2.7 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1K |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
5.59 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
e0 |
NOR TYPE |
.0001 Amp |
42.05 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,1,1 |
NO |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
42.037 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.55 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
NOR TYPE |
13.97 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
262144 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1K |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
2097152 bit |
4.5 V |
e3 |
260 |
NOR TYPE |
.0003 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
2K |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
256 |
e0 |
240 |
NOR TYPE |
.0001 Amp |
18.4 mm |
100 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
250 ns |
5 |
YES |
||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64 |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.75 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
64 |
e0 |
225 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.75 V |
e0 |
NOR TYPE |
13.97 mm |
70 ns |
5 |
|||||||||||||||||||||||||||||||
Atmel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
512 |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
524288 bit |
4.75 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e0 |
225 |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128 |
15 mA |
65536 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
512 |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
20 ms |
524288 bit |
3 V |
128 |
e3 |
260 |
NOR TYPE |
.00005 Amp |
18.4 mm |
120 ns |
3 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.