Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
84 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
80 mA |
8388608 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA84,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
8,126 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B84 |
3 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
80 ns |
1.8 |
YES |
||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
3 |
NO |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
38 mA |
4096 words |
3 |
3/3.3 |
16 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4KX16 |
4K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3.6 V |
2.159 mm |
100000 Write/Erase Cycles |
104 MHz |
5.283 mm |
Not Qualified |
SPI |
65536 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
5.283 mm |
3 |
|||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3 |
3.6 V |
1.2 mm |
9 mm |
17179869184 bit |
2.7 V |
260 |
SLC NAND TYPE |
11 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3 |
YES |
3/3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
4 |
.8 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3 |
1.95 V |
1.2 mm |
9 mm |
17179869184 bit |
1.7 V |
260 |
SLC NAND TYPE |
11 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
3 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
1073741824 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
1K |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
1073741824 bit |
3 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3 |
1.95 V |
1 mm |
9 mm |
1073741824 bit |
1.7 V |
260 |
SLC NAND TYPE |
11 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
3 |
NO |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3 |
3.6 V |
.85 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
8 mm |
3 |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
8 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
3 |
NO |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
70 ns |
5 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX16 |
128M |
-40 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
1K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
8 |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.8 mm |
13.3 mm |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
28.2 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
80 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
16,254 |
YES |
YES |
BOTTOM |
R-PBGA-B80 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
11 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256K |
30 mA |
1073741824 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
8589934592 bit |
2.7 V |
2K |
e3 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
3 |
NO |
|||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
1073741824 words |
3.3 |
YES |
3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
1K |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
1073741824 bit |
3 V |
8/16 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
38 mA |
4096 words |
3 |
3/3.3 |
16 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4KX16 |
4K |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3 |
3.6 V |
2.159 mm |
100000 Write/Erase Cycles |
104 MHz |
5.283 mm |
Not Qualified |
SPI |
65536 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
5.283 mm |
3 |
||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
38 mA |
4096 words |
3 |
3/3.3 |
16 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4KX16 |
4K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-N8 |
3 |
3.6 V |
2.159 mm |
100000 Write/Erase Cycles |
104 MHz |
5.283 mm |
Not Qualified |
SPI |
65536 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00001 Amp |
5.283 mm |
3 |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3.3 |
YES |
3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
3 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3 |
YES |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
110 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
8 |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
TOP |
4194304 bit |
2.7 V |
ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
18.4 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
45 ns |
1.8 |
NO |
||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
56 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3.3 |
YES |
3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512MX1 |
512M |
-40 Cel |
512 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
536870912 bit |
3 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
13 mm |
3 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
18 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
18 mm |
3 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
18 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
18 mm |
3 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.