Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
4194304 bit |
2.7 V |
e4 |
20 |
260 |
.00005 Amp |
|||||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
16777216 bit |
2.7 V |
e4 |
20 |
260 |
.00005 Amp |
|||||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
8388608 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
67108864 bit |
2.7 V |
e4 |
.0001 Amp |
|||||||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
16777216 words |
3.3 |
1 |
SMALL OUTLINE |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
100 MHz |
3.9 mm |
16777216 bit |
2.7 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
.00005 Amp |
4.9 mm |
3.3 |
|||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
131072 words |
3.3 |
3.3 |
1 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
1048576 bit |
2.7 V |
e4 |
30 |
260 |
.00005 Amp |
|||||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
268435456 words |
3.3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
256MX1 |
256M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
20 MHz |
7.5 mm |
Not Qualified |
8 ms |
268435456 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
4194304 bit |
2.7 V |
e0 |
.00005 Amp |
|||||||||||||||||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
134217728 bit |
2.7 V |
e4 |
20 |
260 |
.0001 Amp |
|||||||||||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.00007 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.00007 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.00007 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.000055 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.000055 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
CONFIGURATION MEMORY |
COMMERCIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
100000 Write/Erase Cycles |
25 MHz |
16777216 bit |
2.7 V |
.00005 Amp |
||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
|||||||||||||||||||
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
131072 words |
3.3 |
3.3 |
1 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
1048576 bit |
2.7 V |
e0 |
.00005 Amp |
||||||||||||||||||||||||||||||||
|
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
4194304 words |
3.3 |
3.3 |
1 |
FLATPACK |
Flash Memories |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
100000 Write/Erase Cycles |
66.7 MHz |
Not Qualified |
4194304 bit |
3 V |
e3 |
NOR TYPE |
.00015 Amp |
||||||||||||||||||||||||||||||
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
4194304 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
3.4 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00015 Amp |
20 mm |
|||||||||||||||||||||||||||
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
88 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
90 mA |
16777216 words |
3.3 |
3.3 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA88,8X12,32 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B88 |
3.6 V |
1.4 mm |
100000 Write/Erase Cycles |
66.7 MHz |
8 mm |
Not Qualified |
16777216 bit |
3 V |
.00015 Amp |
11 mm |
||||||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
8 ms |
16777216 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
4.9 mm |
3.3 |
||||||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
13.97 mm |
200 ns |
12 |
NO |
|||||||||||||||||||||||
|
Intel |
EEPROM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
16777216 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
2.15 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
.00015 Amp |
20 mm |
||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
70 ns |
2.7 |
NO |
|||||||||||||||||||||
|
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
16777216 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
70 Cel |
3-STATE |
16MX1 |
16M |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
2.15 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
.00015 Amp |
20 mm |
||||||||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
RECTANGULAR |
1 |
CMOS |
4398046511104 words |
8 |
70 Cel |
4TX8 |
4T |
0 Cel |
35184372088832 bit |
TLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3.3 |
1 |
SMALL OUTLINE |
SOP8,2 |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX1 |
32M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
133 MHz |
3.9 mm |
33554432 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
67108864 words |
3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
8 ms |
67108864 bit |
2.7 V |
e4 |
20 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
2.7 |
|||||||||||||||||||||||
|
Intel |
EEPROM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
8388608 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
2.15 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
8388608 bit |
3 V |
e3 |
.00015 Amp |
20 mm |
||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
16777216 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
DUAL |
R-PDSO-G56 |
2 V |
1.2 mm |
14 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
88 ns |
1.8 |
NO |
||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
3 |
NO |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
TIN LEAD |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
13 mm |
YES |
75 ns |
2.7 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
16 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10 mm |
Not Qualified |
8388608 bit |
4.5 V |
DEEP POWER-DOWN |
e0 |
NOR TYPE |
.0000012 Amp |
18.4 mm |
120 ns |
12 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
60 mA |
1048576 words |
5 |
NO |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
32 |
YES |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
14 mm |
Not Qualified |
16777216 bit |
4.5 V |
ALSO CAN BE CONFIGURED AS 1M X 16 |
128/256 |
NOR TYPE |
.000005 Amp |
18.4 mm |
100 ns |
12 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.83 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
NOR TYPE |
.0001 Amp |
41.91 mm |
120 ns |
12 |
NO |
|||||||||||||||||||||||
Intel |
EEPROM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
8388608 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
85 Cel |
3-STATE |
8MX1 |
8M |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
2.15 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
8388608 bit |
3 V |
e0 |
.00015 Amp |
20 mm |
|||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3.3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
128MX1 |
128M |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
8 ms |
134217728 bit |
2.7 V |
e4 |
40 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3.3 |
||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e3 |
40 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
8388608 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
4,127 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM |
134217728 bit |
2.3 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
NOR TYPE |
.000155 Amp |
10 mm |
YES |
85 ns |
3 |
NO |
||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-20 Cel |
64 |
YES |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
|||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
20 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
QUAD |
R-PQCC-J32 |
5.25 V |
3.556 mm |
1000000 Write/Erase Cycles |
11.43 mm |
.000045 ms |
1048576 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
13.97 mm |
45 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
2097152 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.25 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
4.75 V |
CONFIGURABLE AS 1M X 16 |
16/32 |
e0 |
NOR TYPE |
.00002 Amp |
23.7 mm |
YES |
70 ns |
5 |
NO |
|||||||||||||||||
Intel |
EEPROM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
16777216 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
70 Cel |
3-STATE |
16MX1 |
16M |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
2.15 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
e0 |
.00015 Amp |
20 mm |
|||||||||||||||||||||||||||
Intel |
FLASH |
MILITARY |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
MIL-PRF-38535 Class N |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
135 mA |
2097152 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
16 |
Flash Memories |
.8 mm |
125 Cel |
3-STATE |
2MX8 |
2M |
-55 Cel |
32 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
3.15 V |
USER-SELECTABLE 5V OR 12V VPP |
128/256 |
e0 |
NOR TYPE |
.00005 Amp |
23.7 mm |
85 ns |
5 |
NO |
|||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.83 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.5 V |
DEEP POWER-DOWN; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000001 Amp |
41.91 mm |
120 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
16777216 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
256 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
268435456 bit |
2.7 V |
4/8 |
e0 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
125 ns |
2.7 |
NO |
|||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
524288 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
10 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.000045 ms |
1048576 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
45 ns |
5 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.