Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.25 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.000045 ms |
1048576 bit |
4.75 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
45 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-20 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
64 mA |
4194304 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
16 |
Flash Memories |
.5 mm |
70 Cel |
4MX8 |
4M |
0 Cel |
64 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
3 V |
128/256 |
e0 |
NOR TYPE |
.00001 Amp |
18.4 mm |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
70 Cel |
1MX8 |
1M |
0 Cel |
1,2,1,7 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
4.5 V |
CONFG AS 512K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
|||||||||||||||||||
Intel |
EEPROM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
90 mA |
4194304 words |
3.3 |
3.3 |
1 |
FLATPACK |
QFP100,.7X.9 |
Flash Memories |
.65 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
3.4 mm |
100000 Write/Erase Cycles |
66.7 MHz |
14 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.00015 Amp |
20 mm |
|||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
46 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
1048576 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA46,6X8,30 |
Flash Memories |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
TIN LEAD |
BOTTOM |
R-PBGA-B46 |
3.6 V |
1 mm |
6.964 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
7.286 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
BOTTOM |
1048576 bit |
4.5 V |
DEEP POWER-DOWN; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000001 Amp |
13.97 mm |
120 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
100000 ERASE/PROGRAM CYCLES |
e0 |
NOR TYPE |
.0001 Amp |
13.97 mm |
120 ns |
12 |
NO |
||||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
CONFG AS 256K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
28.2 mm |
70 ns |
5 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
524288 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
1,2,1,3 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
CONFG AS 256K X 16; USER SELECTABLE AS 5V OR 12V VPP; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
28.2 mm |
80 ns |
5 |
NO |
|||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
16777216 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
TOP |
268435456 bit |
2.3 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
NOR TYPE |
.000195 Amp |
10 mm |
YES |
85 ns |
3 |
NO |
||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
4194304 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
4,63 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
2 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
85 ns |
1.8 |
NO |
||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
70 mA |
8388608 words |
3 |
NO |
2.5/3.3,3/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
134217728 bit |
2.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
8 |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000055 Amp |
13 mm |
YES |
115 ns |
3 |
NO |
|||||||||||||||||||
|
Intel |
FLASH |
COMMERCIAL |
22 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
SERIAL |
ASYNCHRONOUS |
515396075520 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
480GX8 |
480G |
0 Cel |
SINGLE |
R-XSMA-N22 |
5.25 V |
7 mm |
69.85 mm |
4123168604160 bit |
4.75 V |
ALSO OPERATES @ 12V NOM, AVAILABLE 2.5INCH @ 100GB, 1.8INCH @ 800GB, LG-MAX |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
100.45 mm |
5 |
|||||||||||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
4K,32K |
55 mA |
2097152 words |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
DUAL |
R-PDSO-G48 |
Not Qualified |
BOTTOM |
33554432 bit |
NOR TYPE |
.000005 Amp |
YES |
90 ns |
NO |
||||||||||||||||||||||||||||||||
Intel |
FLASH |
AUTOMOTIVE |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
MIN 100K EXTENDED BLOCK ERASE CYCLES; CAN BE CONFG AS 125KX16; BOTTOM BOOT BLOCK |
NOR TYPE |
28.2 mm |
80 ns |
5 |
|||||||||||||||||||||||||||||||||
Intel |
FLASH |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
40 mA |
131072 words |
5 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
20 |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
8 |
YES |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
8 mm |
.000055 ms |
1048576 bit |
4.5 V |
NOR TYPE |
.000005 Amp |
18.4 mm |
55 ns |
5 |
YES |
|||||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-20 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
33554432 bit |
4.5 V |
CONFIGURABLE AS 2M X 16; BLOCK ERASE |
16/32 |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
120 ns |
5 |
NO |
|||||||||||||||||
Intel |
FLASH |
AUTOMOTIVE |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
60 mA |
524288 words |
3.3 |
NO |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
Flash Memories |
.8 mm |
125 Cel |
512KX16 |
512K |
-40 Cel |
8,15 |
YES |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G56 |
3.6 V |
1.9 mm |
13.3 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
TOP BOOT BLOCK |
4 |
e0 |
NOR TYPE |
.0001 Amp |
23.7 mm |
95 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
40 mA |
2097152 words |
5 |
NO |
3.3/5 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
16 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
32 |
YES |
Tin/Lead (Sn/Pb) |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
2.97 V |
DEEP POWER-DOWN; HARDWARE WRITE PROTECT |
128/256 |
e0 |
NOR TYPE |
.000005 Amp |
23.7 mm |
100 ns |
12 |
NO |
||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
2097152 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.9 mm |
13.3 mm |
Not Qualified |
16777216 bit |
3 V |
16/32 |
e0 |
NOR TYPE |
.000005 Amp |
23.7 mm |
YES |
100 ns |
2.7 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
60 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G40 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
10 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
1,2,1,1 |
YES |
DUAL |
R-PDSO-N40 |
5.25 V |
1.2 mm |
100000 Write/Erase Cycles |
10 mm |
Not Qualified |
TOP |
2097152 bit |
4.75 V |
BOTTOM BOOT BLOCK |
NOR TYPE |
.0000012 Amp |
18.4 mm |
80 ns |
12 |
NO |
|||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
60 mA |
536870912 words |
3.3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
20 |
1.27 mm |
85 Cel |
3-STATE |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
100 MHz |
7.5 mm |
536870912 bit |
2.7 V |
NOR TYPE |
.0001 Amp |
10.3 mm |
2.7 |
||||||||||||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
1048576 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
|||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e3 |
40 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.55 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
TOP |
1048576 bit |
4.5 V |
DEEP POWER-DOWN; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000001 Amp |
13.97 mm |
120 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8K,4K,112K |
30 mA |
131072 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
1,2,1 |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.83 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
TOP |
1048576 bit |
4.5 V |
DEEP POWER-DOWN; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000001 Amp |
41.91 mm |
150 ns |
12 |
NO |
|||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
50 mA |
1048576 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP44,.63 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
16 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.95 mm |
13.3 mm |
Not Qualified |
8388608 bit |
4.5 V |
DEEP POWER-DOWN |
e0 |
NOR TYPE |
.0000012 Amp |
28.2 mm |
85 ns |
12 |
NO |
||||||||||||||||||||
Intel |
FLASH |
COMMERCIAL |
40 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
MOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
65 mA |
262144 words |
5 |
NO |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
1,2,1,3 |
YES |
DUAL |
R-PDSO-N40 |
5.5 V |
2.95 mm |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
NOR TYPE |
.0000012 Amp |
28.2 mm |
60 ns |
12 |
NO |
|||||||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e1 |
40 |
260 |
NOR TYPE |
.00012 Amp |
13 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
16777216 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B64 |
2 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
88 ns |
1.8 |
NO |
||||||||||||||||
|
Intel |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
51 mA |
33554432 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
32MX16 |
32M |
-40 Cel |
8, 510 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
536870912 bit |
2.3 V |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
4 |
e1 |
NOR TYPE |
.00039 Amp |
10 mm |
YES |
85 ns |
3 |
NO |
||||||||||||||||||
Intel |
MEMORY CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
80 mA |
2097152 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
32 |
YES |
YES |
DUAL |
R-PDSO-G56 |
5.25 V |
1.2 mm |
14 mm |
Not Qualified |
16777216 bit |
4.75 V |
CONFIGURABLE AS 1M X 16 |
16/32 |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00002 Amp |
18.4 mm |
YES |
70 ns |
5 |
NO |
|||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,96K,128K |
70 mA |
262144 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1,2,1,1 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
CONFG AS 128K X 16; USER SELECTABLE AS 5V OR 12V VPP; TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000008 Amp |
18.4 mm |
80 ns |
5 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.3 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
110 ns |
2.7 |
NO |
|||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
55 mA |
2097152 words |
3 |
NO |
1.8/3.3,3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK |
e0 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
NO |
||||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
32 |
YES |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
33554432 bit |
2.7 V |
4/8 |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
110 ns |
2.7 |
NO |
||||||||||||||||||
Intel |
FLASH |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP32,.6 |
Flash Memories |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
YES |
TIN LEAD |
DUAL |
R-PDIP-T32 |
5.5 V |
4.83 mm |
1000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
100000 ERASE/PROGRAM CYCLES |
e0 |
NOR TYPE |
.0001 Amp |
41.91 mm |
120 ns |
12 |
NO |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.