Flash Memory

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

SST39VF1601C-70-4I-EKE

Microchip Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

8K,4K,16K,32K

35 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

100

.5 mm

85 Cel

3-STATE

1MX16

1M

-40 Cel

1,2,1,31

YES

Matte Tin (Sn) - annealed

YES

DUAL

1

R-PDSO-G48

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e3

40

260

NOR TYPE

.00002 Amp

18.4 mm

YES

70 ns

3

YES

W25Q512NWEIM

Winbond Electronics

EEPROM

AT25DF041B-SSHN-B

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4194304 words

1.8

1

SMALL OUTLINE

1.27 mm

85 Cel

4MX1

4M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

3.6 V

1.75 mm

104 MHz

3.9 mm

4194304 bit

1.65 V

e4

260

NOR TYPE

4.925 mm

1.8

GD25Q16CSIGR

Gigadevice Semiconductor

FLASH

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

2097152 words

3.3

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

120 MHz

5.23 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000005 Amp

5.28 mm

3.3

IS34ML02G084-TLI

Integrated Silicon Solution

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

256MX8

256M

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

2147483648 bit

2.7 V

e3

10

260

SLC NAND TYPE

18.4 mm

3.3

MT25QL01GBBB8ESF-0AATTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

3

MTFC8GAMALNA-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

68719476736 bit

2.7 V

e1

30

260

18 mm

2.7

MX25L3233FM1I-08Q

Macronix

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

17 mA

4194304 words

3

8

SMALL OUTLINE

SOP8,.25

4

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

133 MHz

3.9 mm

SPI

33554432 bit

2.65 V

ALSO ORGANISED AS 32MX1

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00005 Amp

4.9 mm

3

S25FL064LABMFV010

Infineon Technologies

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE

2

1.27 mm

105 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

3

3.6 V

2.16 mm

108 MHz

5.28 mm

67108864 bit

2.7 V

IT ALSO HAVE X1 MEMORY WIDTH

e3

260

5.28 mm

3

SST26VF016B-104I/SM-RN

Microchip Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

1

SMALL OUTLINE

SOP8,.3

100

1.27 mm

85 Cel

3-STATE

16MX1

16M

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.03 mm

100000 Write/Erase Cycles

104 MHz

5.25 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000045 Amp

5.26 mm

3

SST26VF064BA-104I/SM

Microchip Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

67108864 words

3

1

SMALL OUTLINE

SOP8,.3

100

1.27 mm

85 Cel

3-STATE

64MX1

64M

-40 Cel

MATTE TIN

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000 Write/Erase Cycles

104 MHz

5.25 mm

SPI

67108864 bit

2.7 V

e3

40

260

NOR TYPE

.000045 Amp

5.26 mm

3

SST38VF6401-90-5I-B3KE

Microchip Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

BALL

PARALLEL

ASYNCHRONOUS

4K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

1K

YES

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

1

R-PBGA-B48

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

4

e1

40

260

NOR TYPE

.00003 Amp

8 mm

YES

90 ns

3

YES

IS25LP016D-JNLA3-TR

Integrated Silicon Solution

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

2097152 words

3

8

SMALL OUTLINE

1

1.27 mm

125 Cel

2MX8

2M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

133 MHz

3.9 mm

16777216 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

3

IS25LP512M-JLLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1

1.27 mm

105 Cel

64MX8

64M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

6 mm

536870912 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT25QU02GCBB8E12-0AUTTR

Micron Technology

FLASH

TIN SILVER COPPER

e1

30

260

1.8

MT29F1G08ABAFAH4-ITE:F

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX8

128M

-40 Cel

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

11 mm

3.3

MT29F8G08ADADAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

8589934592 words

3.3

NO

3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

8GX8

8G

-40 Cel

8K

YES

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

68719476736 bit

2.7 V

2K

e1

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

3.3

NO

MTFC16GAPALBH-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

11.5 mm

137438953472 bit

2.7 V

e1

30

260

13 mm

2.7

S25FL064LABNFI041

Infineon Technologies

FLASH

INDUSTRIAL

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

16777216 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.8 mm

85 Cel

16MX4

16M

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3

3.6 V

.6 mm

108 MHz

4 mm

67108864 bit

2.7 V

IT IS ALSO CONFIGURED AS 64M X 1

e3

4 mm

3

S29GL01GT11FHV010

Infineon Technologies

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

3

16

GRID ARRAY, LOW PROFILE

1 mm

105 Cel

64MX16

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

1073741824 bit

2.7 V

e1

30

260

13 mm

110 ns

2.7

SST39SF040-70-4C-NHE-T

Microchip Technology

FLASH

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

4K

35 mA

524288 words

5

YES

5

8

CHIP CARRIER

LDCC32,.5X.6

Flash Memories

100

1.27 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

128

YES

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

100000 Write/Erase Cycles

11.43 mm

Not Qualified

4194304 bit

4.5 V

e3

40

245

NOR TYPE

.0001 Amp

13.97 mm

70 ns

5

YES

SST39VF1601-70-4I-EKE

Microchip Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K

35 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

100

.5 mm

85 Cel

3-STATE

1MX16

1M

-40 Cel

512

YES

MATTE TIN

DUAL

1

R-PDSO-G48

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

BOTTOM BOOT BLOCK

e3

NOR TYPE

.00002 Amp

18.4 mm

YES

70 ns

3

YES

M25P64-VMF6PBA

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

20 mA

8388608 words

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

67108864 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

2.7

MT25QL256ABA8ESF-0AATTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

3

MX25L12835FMI-10G

Macronix

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3

3/3.3

4

SMALL OUTLINE

SOP16,.4

2

Flash Memories

20

1.27 mm

85 Cel

32MX4

32M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3

3.6 V

2.65 mm

100000 Write/Erase Cycles

104 MHz

7.52 mm

Not Qualified

SPI

134217728 bit

2.7 V

IT ALSO CONFIGURED AS 128M X 1

e3

NOR TYPE

.00002 Amp

10.3 mm

3

SDCS2/64GB

Kingston Technology Company

FLASH CARD

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

68719476736 words

3.3

8

UNCASED CHIP

85 Cel

64GX8

64G

-25 Cel

UPPER

R-XUUC-N

1 mm

11 mm

549755813888 bit

NOR TYPE

15 mm

3.3

W25Q256JWFIQ

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

12 mA

33554432 words

1.8

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

1.95 V

2.64 mm

100000 Write/Erase Cycles

133 MHz

7.49 mm

SPI

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

10.31 mm

1.8

AT25DF041A-SSH-B

Atmel

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16 mA

4194304 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

4MX1

4M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

2

3.6 V

1.75 mm

100000 Write/Erase Cycles

70 MHz

3.9 mm

Not Qualified

SPI

4194304 bit

2.7 V

e4

40

260

NOR TYPE

.000015 Amp

4.925 mm

2.7

AT25SF321-SSHD-T

Renesas Electronics

FLASH

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16 mA

4194304 words

3

8

SMALL OUTLINE

SOP8,.25

20

1.27 mm

85 Cel

3-STATE

4MX8

4M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

85 MHz

3.9 mm

SPI

33554432 bit

2.5 V

NOR TYPE

.000025 Amp

4.925 mm

3

M29W800DB45N6E

STMicroelectronics

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

524288 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

TIN/TIN BISMUTH

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

8388608 bit

3 V

e3/e6

NOT SPECIFIED

260

NOR TYPE

.0001 Amp

18.4 mm

YES

45 ns

3

YES

MT25QU128ABA8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

SMALL OUTLINE

1.27 mm

105 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

1.8

MX25L25645GXDI-08G

Macronix

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

25 mA

33554432 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

120 MHz

6 mm

SPI

268435456 bit

2.7 V

e1

NOR TYPE

.00002 Amp

8 mm

3

MX25V8035FZUI

Macronix

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2097152 words

3

4

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2

.5 mm

85 Cel

2MX4

2M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.6 mm

108 MHz

2 mm

8388608 bit

2.3 V

ALSO IT CAN BE CONFIGURED AS 8M X 1 BIT

NOT SPECIFIED

NOT SPECIFIED

3 mm

3

S29GL064N90BFI030

Infineon Technologies

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

TOP

67108864 bit

2.7 V

8/16

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

90 ns

3

YES

S29GL064S70TFI063

Infineon Technologies

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

8MX8

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

14 mm

67108864 bit

2.7 V

e3

18.4 mm

70 ns

3

AT45DB081E-SSHNHC-T

Renesas Electronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

16 mA

1048576 words

3

1.8/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

3-STATE

1MX8

1M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

133 MHz

3.9 mm

Not Qualified

SPI

8388608 bit

2.3 V

IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE

e4

NOR TYPE

.00004 Amp

4.925 mm

3

AT45DB641E-MWHN2B-T

Renesas Electronics

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

67108864 words

2.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

64MX1

64M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

3

3.6 V

1 mm

85 MHz

6 mm

67108864 bit

1.7 V

e4

260

NOR TYPE

8 mm

1.8

BMXRMS128MPF

Schneider Electric Sa

FLASH CARD

MT28EW256ABA1LPC-0SIT

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

31 mA

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

16MX16

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

268435456 bit

2.7 V

e1

30

260

NOR TYPE

13 mm

70 ns

3

MT29F1G08ABADAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

1073741824 bit

2.7 V

2K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

3.3

NO

MT29F4G01AAADDHC-ITX:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

4294967296 words

3.3

3/3.3

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

10

.8 mm

85 Cel

4GX1

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE

R-PBGA-B63

3.6 V

1 mm

100000 Write/Erase Cycles

50 MHz

10.5 mm

Not Qualified

SPI

4294967296 bit

2.7 V

e1

30

260

SLC NAND TYPE

.00005 Amp

13 mm

3.3

MT29F4G08ABADAH4:D

Micron Technology

FLASH

COMMERCIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

536870912 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

512MX8

512M

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

4294967296 bit

2.7 V

2K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

NO

MT29F64G08AECABH1-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

8589934592 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

8GX8

8G

-40 Cel

8K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

68719476736 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F64G08AFAAAWP-ITZ:A

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8589934592 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

8GX8

8G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

68719476736 bit

2.7 V

e3

30

260

MLC NAND TYPE

18.4 mm

2.7

S25FL128P0XNFI001

Cypress Semiconductor

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

26 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3

3.6 V

.85 mm

100000 Write/Erase Cycles

104 MHz

6 mm

Not Qualified

SPI

134217728 bit

2.7 V

e3

40

260

NOR TYPE

.00002 Amp

8 mm

3

SST25VF040B-50-4I-S2AE

Microchip Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

30 mA

4194304 words

1

SMALL OUTLINE

SOP8,.3

100

1.27 mm

85 Cel

3-STATE

4MX1

4M

-40 Cel

MATTE TIN

DUAL

1

SOFTWARE

S-PDSO-G8

3

3.6 V

2.16 mm

100000 Write/Erase Cycles

50 MHz

5.275 mm

SPI

4194304 bit

2.7 V

e3

40

260

NOR TYPE

.00003 Amp

5.275 mm

IS25LP064A-JMLE-TR

Integrated Silicon Solution

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

67108864 words

3

1

SMALL OUTLINE

1.27 mm

105 Cel

64MX1

64M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

133 MHz

7.5 mm

67108864 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

3

M25P80-VMN6TP

STMicroelectronics

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

1048576 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

1MX8

1M

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

1

3.6 V

1.75 mm

100000 Write/Erase Cycles

50 MHz

3.9 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

e4

NOR TYPE

.00001 Amp

4.9 mm

2.7

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.