TFBGA FRAMs 9

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Part	Manufacturer	Memory IC Type	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Standby Voltage	Minimum Operating Temperature	Terminal Finish	Terminal Position	Write Protection	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Endurance	Maximum Clock Frequency (fCLK)	Width	Qualification	Serial Bus Type	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
CY15B108QN-50BKXI	Infineon Technologies	FRAM	24	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	SYNCHRONOUS	4.5 mA	1048576 words	3.3		8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA24,5X5,40		10	1 mm	85 Cel	1MX8	1M	1.8 V	-40 Cel		BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B24		3.6 V	1.2 mm	1000000000000000 Write/Erase Cycles	50 MHz	6 mm		SPI	8388608 bit	1.8 V				.000135 Amp	8 mm
FM21LD16-60-BG	Cypress Semiconductor	FRAM	48	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS	12 mA	131072 words	3.3	3/3.3	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,6X8,30	SRAMs	10	.75 mm	85 Cel	128KX16	128K	2.7 V	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B48	3	3.6 V	1.2 mm	100000000000000 Write/Erase Cycles		6 mm	Not Qualified		2097152 bit	2.7 V	DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 256KX8	e1	260	.00027 Amp	8 mm	110 ns
FM22LD16-55-BGTR	Infineon Technologies	FRAM	48	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS	12 mA	262144 words	3.3		16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,6X8,30		10	.75 mm	85 Cel	256KX16	256K		-40 Cel	TIN SILVER COPPER	BOTTOM	SOFTWARE	R-PBGA-B48	3	3.6 V	1.2 mm	100000000000000 Write/Erase Cycles		6 mm			4194304 bit	2.7 V		e1	260	.00027 Amp	8 mm	110 ns
FM22LD16-55-BG	Infineon Technologies	FRAM	48	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS	12 mA	262144 words	3.3		16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,6X8,30		10	.75 mm	85 Cel	256KX16	256K		-40 Cel	TIN SILVER COPPER	BOTTOM	SOFTWARE	R-PBGA-B48	3	3.6 V	1.2 mm	100000000000000 Write/Erase Cycles		6 mm			4194304 bit	2.7 V		e1	260	.00027 Amp	8 mm	110 ns
FM28V102-BG	Infineon Technologies	FRAM	48	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS	12 mA	65536 words	3.3	2.5/3.3	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,6X8,30	SRAMs	10	.75 mm	85 Cel	64KX16	64K	2 V	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B48	3	3.6 V	1.2 mm	100000000000000 Write/Erase Cycles		6 mm	Not Qualified		1048576 bit	2 V	4KV ESD AVAILABLE	e1		.00025 Amp	8 mm	105 ns
FM28V202-BG	Infineon Technologies	FRAM	48	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	PARALLEL	ASYNCHRONOUS	12 mA	131072 words	3.3		16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,6X8,30		10	.75 mm	85 Cel	128KX16	128K	2 V	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B48	3	3.6 V	1.2 mm	100000000000000 Write/Erase Cycles		6 mm			2097152 bit	2 V		e1		.00025 Amp	8 mm	105 ns
CY15V108QN-50BKXIT	Infineon Technologies	FRAM	24	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	SYNCHRONOUS	4.5 mA	1048576 words	1.8		8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA24,5X5,40		10	1 mm	85 Cel	1MX8	1M	1.71 V	-40 Cel		BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B24		1.89 V	1.2 mm	1000000000000000 Write/Erase Cycles	50 MHz	6 mm		SPI	8388608 bit	1.71 V				.000135 Amp	8 mm
CY15V108QN-50BKXI	Infineon Technologies	FRAM	24	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	SYNCHRONOUS	4.5 mA	1048576 words	1.8		8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA24,5X5,40		10	1 mm	85 Cel	1MX8	1M	1.71 V	-40 Cel		BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B24		1.89 V	1.2 mm	1000000000000000 Write/Erase Cycles	50 MHz	6 mm		SPI	8388608 bit	1.71 V				.000135 Amp	8 mm
CY15B108QN-50BKXIT	Infineon Technologies	FRAM	24	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	SYNCHRONOUS	4.5 mA	1048576 words	3.3		8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA24,5X5,40		10	1 mm	85 Cel	1MX8	1M	1.8 V	-40 Cel		BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B24		3.6 V	1.2 mm	1000000000000000 Write/Erase Cycles	50 MHz	6 mm		SPI	8388608 bit	1.8 V				.000135 Amp	8 mm

FRAMs

Ferroelectric Random-Access Memories (or FRAMs), are a type of non-volatile memory technology that combines the advantages of both traditional dynamic random-access memory (DRAM) and non-volatile memory (NVRAM) technologies. FRAMs store data using a ferroelectric material, which has the unique property of being able to retain data even when the power is removed.

FRAMs are used in a variety of fields, including industrial automation, automotive systems, smart meters, and more, where their combination of non-volatility, speed, and endurance can be advantageous. While they may not be as prevalent as other memory types like Flash or DRAM, FRAMs offer a unique set of features that make them suitable for specific use cases.

Here are some key features and characteristics of FRAMs:

Non-Volatile: FRAMs are non-volatile, meaning they can retain data even when the power supply is turned off. This is in contrast to traditional DRAM, which is volatile and loses data when power is removed.

Fast Write Speeds: FRAMs offer very fast write speeds, comparable to DRAM. This makes them suitable for applications where high-speed write operations are required.

Low Power Consumption: FRAMs typically consume less power than other non-volatile memory technologies like Flash memory. This makes them suitable for battery-powered devices and applications where power efficiency is critical.

High Endurance: FRAMs have a high endurance, meaning they can withstand a large number of write cycles without degrading. This is in contrast to some Flash memory technologies that have limited write endurance.

Bit-Addressable: FRAMs are bit-addressable, which means you can read or write individual bits of data. This granularity is useful in applications where precise control over specific data is required.

Radiation Resistance: FRAMs are resistant to radiation, which makes them suitable for use in aerospace and other high-radiation environments.

Limited Density: One limitation of FRAM technology is that it has historically had lower storage density compared to other non-volatile memory technologies like Flash. However, advancements in FRAM technology have been made to increase storage capacity.