16 Other Function Memory ICs 101

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length
KS54HCTLS670J	Samsung		MILITARY	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS	THROUGH-HOLE				5	5		IN-LINE	DIP16,.3	Other Memory ICs	2.54 mm	125 Cel			-55 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16				Not Qualified			e0
KS74AHCT670J	Samsung		INDUSTRIAL	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS	THROUGH-HOLE				5	5		IN-LINE	DIP16,.3	Other Memory ICs	2.54 mm	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16				Not Qualified			e0
KS74AHCT670DT	Samsung		INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING				5	5		SMALL OUTLINE	SOP16,.25	Other Memory ICs	1.27 mm	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified			e0
NP5Q128AE3ESFC0E	Micron Technology	MEMORY CIRCUIT	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	50 mA	16777216 words	3	3/3.3	8	SMALL OUTLINE	SOP16,.4	SRAMs	1.27 mm	85 Cel	16MX8	16M	-40 Cel		DUAL	R-PDSO-G16	3.6 V	2.65 mm	7.5 mm	Not Qualified	134217728 bit	2.7 V		NOT SPECIFIED	NOT SPECIFIED	.0002 Amp	10.3 mm
NP5Q128A13ESFC0E	Micron Technology	MEMORY CIRCUIT	COMMERCIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	50 mA	134217728 words	3	3/3.3	1	SMALL OUTLINE	SOP16,.4	SRAMs	1.27 mm	70 Cel	128MX1	128M	0 Cel		DUAL	R-PDSO-G16	3.6 V	2.65 mm	7.5 mm	Not Qualified	134217728 bit	2.7 V		NOT SPECIFIED	NOT SPECIFIED	.0002 Amp	10.3 mm

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.