TFQFP Other Function Memory ICs 4

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	No. of Words	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Memory Width	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Access Time
DSM2150F5V-12T6	STMicroelectronics	MEMORY CIRCUIT	INDUSTRIAL	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS	262144 words	3.3		16	FLATPACK, THIN PROFILE, FINE PITCH		.5 mm	85 Cel	256KX16	256K	-40 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3.6 V	1.2 mm	12 mm	Not Qualified	4194304 bit	3 V	ALSO CONTAINS 32K BYTE OF SECONDARY FLASH MEMORY	e3/e4	NOT SPECIFIED	NOT SPECIFIED	12 mm
DSM2150F5V-12T6T	STMicroelectronics	MEMORY CIRCUIT	INDUSTRIAL	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	ASYNCHRONOUS	262144 words	3.3		16	FLATPACK, THIN PROFILE, FINE PITCH		.5 mm	85 Cel	256KX16	256K	-40 Cel		QUAD	S-PQFP-G80	3.6 V	1.2 mm	12 mm	Not Qualified	4194304 bit	3 V	ALSO CONTAINS 32K BYTE OF SECONDARY FLASH MEMORY				12 mm
PF38F5070M0Y3DG	Micron Technology	MEMORY CIRCUIT		56	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	BALL	SYNCHRONOUS	536870912 words	1.8	FLASH+PSRAM	1	FLATPACK, THIN PROFILE, FINE PITCH	BGA56,10X14,20	.5 mm	85 Cel	512MX1	512M	-25 Cel		BOTTOM	S-PBGA-B56	2 V	1.2 mm	8 mm		536870912 bit	1.7 V	PSEUDO SRAM IS ORGANIZED AS 256M X 1 BIT				8 mm	70 ns
PF38F5060M0Y4DE	Micron Technology	MEMORY CIRCUIT		56	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	BALL	SYNCHRONOUS	536870912 words	1.8	FLASH+PSRAM	1	FLATPACK, THIN PROFILE, FINE PITCH	BGA56,10X14,20	.5 mm	85 Cel	512MX1	512M	-25 Cel		BOTTOM	S-PBGA-B56	2 V	1.2 mm	8 mm		536870912 bit	1.7 V	PSEUDO SRAM IS ORGANIZED AS 128M X 1 BIT				8 mm	70 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.