Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
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Micron Technology |
MEMORY CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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Micron Technology |
MEMORY CIRCUIT |
149 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+LPDDR |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA149,14X16,20 |
.5 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
BOTTOM |
R-PBGA-B149 |
1.95 V |
.8 mm |
8 mm |
4294967296 bit |
1.7 V |
9.5 mm |
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Micron Technology |
MEMORY CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+SDRAM |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA168,23X23,20 |
Other Memory ICs |
.5 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B168 |
1.9 V |
.75 mm |
12 mm |
Not Qualified |
4294967296 bit |
1.7 V |
e1 |
12 mm |
25 ns |
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|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
137 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX32 |
64M |
-25 Cel |
BOTTOM |
R-PBGA-B137 |
1.95 V |
1.1 mm |
10.5 mm |
2147483648 bit |
1.7 V |
ALSO ORGANISED AS 128M X 16 |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
149 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+LPDDR |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA149,14X16,20 |
.5 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
BOTTOM |
R-PBGA-B149 |
1.95 V |
.8 mm |
8 mm |
4294967296 bit |
1.7 V |
9.5 mm |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
MEMORY CIRCUIT |
OTHER |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+SDRAM |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA168,23X23,20 |
Other Memory ICs |
.5 mm |
85 Cel |
256MX16 |
256M |
-25 Cel |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.9 mm |
12 mm |
Not Qualified |
4294967296 bit |
1.7 V |
MOBILE LPDDR DEVICE ALSO AVAILABLE |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
25 ns |
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Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
52 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B52 |
1.95 V |
1.2 mm |
4 mm |
67108864 bit |
1.7 V |
IT ALSO CONTAINS 16MBIT(1MBIT X 16) PSRAM |
6 mm |
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Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.2 mm |
8 mm |
67108864 bit |
1.7 V |
IT ALSO CONTAINS 32MBIT(2MBIT X 16) PSRAM |
10 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
896 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4294967296 words |
1.2 |
4 |
GRID ARRAY |
1 mm |
105 Cel |
4GX4 |
4G |
0 Cel |
BOTTOM |
S-PBGA-B896 |
1.26 V |
4.2 mm |
31 mm |
17179869184 bit |
1.14 V |
IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE |
NOT SPECIFIED |
NOT SPECIFIED |
31 mm |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
MEMORY CIRCUIT |
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|
Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
137 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B137 |
1.95 V |
1 mm |
10.5 mm |
4294967296 bit |
1.7 V |
IT IS ALSO HAVING 2GBIT (X 32) LPDDR |
e1 |
30 |
260 |
13 mm |
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|
Micron Technology |
OTHER |
169 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA169,14X28,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
R-PBGA-B169 |
Not Qualified |
137438953472 bit |
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|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
17179869184 bit |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
MEMORY CIRCUIT |
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|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
137438953472 bit |
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|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8/3.3,3/3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
274877906944 bit |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
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|
Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
RECTANGULAR |
UNSPECIFIED |
1 |
CMOS |
ASYNCHRONOUS |
1099511627776 words |
8 |
70 Cel |
1TX8 |
1T |
0 Cel |
8796093022208 bit |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Micron Technology |
MEMORY CIRCUIT |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
FLASH+LPDDR |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA168,23X23,20 |
.5 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.8 mm |
12 mm |
4294967296 bit |
1.7 V |
IT IS ALSO HAVING 2GBIT (X 32) LPDDR |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
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Micron Technology |
MEMORY CIRCUIT |
OTHER |
162 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
134217728 words |
3.3 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128MX32 |
128M |
-30 Cel |
BOTTOM |
R-PBGA-B162 |
3.6 V |
1 mm |
11.5 mm |
4294967296 bit |
2.7 V |
ALSO ORGANISED AS 256M X 16 |
13 mm |
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Micron Technology |
MEMORY CIRCUIT |
COMMERCIAL |
24 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
65536 words |
5 |
5 |
4 |
IN-LINE |
ZIP24,.1 |
Other Memory ICs |
1.27 mm |
70 Cel |
64KX4 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T24 |
Not Qualified |
262144 bit |
e0 |
.004 Amp |
150 ns |
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|
Micron Technology |
MEMORY CIRCUIT |
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|
Micron Technology |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
5220 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N184 |
166 MHz |
Not Qualified |
9663676416 bit |
.09 Amp |
.7 ns |
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|
Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
137 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
536870912 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B137 |
1.95 V |
1 mm |
10.5 mm |
4294967296 bit |
1.7 V |
IT IS ALSO HAVING 2GBIT (X 32) LPDDR |
e1 |
30 |
260 |
13 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
256MX16 |
256M |
-25 Cel |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.75 mm |
12 mm |
4294967296 bit |
1.7 V |
MOBILE LPDDR DEVICE ALSO AVAILABLE |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
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Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
88 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.2 mm |
8 mm |
67108864 bit |
1.7 V |
IT ALSO CONTAINS 16MBIT(1MBIT X 16) PSRAM |
10 mm |
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Micron Technology |
MEMORY CIRCUIT |
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|
Micron Technology |
OTHER |
153 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
1.8/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA153,14X14,20 |
Other Memory ICs |
.5 mm |
85 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B153 |
Not Qualified |
8589934592 bit |
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|
Micron Technology |
MEMORY CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
168 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B168 |
1.95 V |
.9 mm |
12 mm |
4294967296 bit |
1.7 V |
e1 |
12 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
149 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SYNCHRONOUS |
536870912 words |
1.8 |
FLASH+LPDDR |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA149,14X16,20 |
.5 mm |
85 Cel |
512MX16 |
512M |
-40 Cel |
BOTTOM |
R-PBGA-B149 |
1.95 V |
1 mm |
8 mm |
8589934592 bit |
1.7 V |
9.5 mm |
3.5 ns |
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|
Micron Technology |
MEMORY CIRCUIT |
149 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SYNCHRONOUS |
536870912 words |
1.8 |
FLASH+LPDDR |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA149,14X16,20 |
.5 mm |
105 Cel |
512MX16 |
512M |
-40 Cel |
BOTTOM |
R-PBGA-B149 |
1.95 V |
1 mm |
8 mm |
8589934592 bit |
1.7 V |
9.5 mm |
3.5 ns |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
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Micron Technology |
MEMORY CIRCUIT |
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Micron Technology |
MEMORY CIRCUIT |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
8 mm |
134217728 bit |
2.7 V |
10 mm |
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Micron Technology |
MEMORY CIRCUIT |
OTHER |
88 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
8388608 words |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.4 mm |
9 mm |
Not Qualified |
134217728 bit |
1.7 V |
CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH |
e1 |
12 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
77 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
4194304 words |
1.8 |
FLASH+SRAM |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA77,8X10,32 |
Other Memory ICs |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B77 |
1.95 V |
1.2 mm |
8 mm |
Not Qualified |
67108864 bit |
1.7 V |
CELLULAR RAM IS ORGANIZED AS 2M X 16 |
e1 |
260 |
.000135 Amp |
10 mm |
85 ns |
|||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
OTHER |
88 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
8388608 words |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.4 mm |
9 mm |
Not Qualified |
134217728 bit |
1.7 V |
CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH |
e1 |
12 mm |
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|
Micron Technology |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
67108864 words |
COMMON |
1.5,1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
95 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N240 |
266 MHz |
Not Qualified |
4831838208 bit |
|||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
MEMORY CIRCUIT |
OTHER |
88 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
ASYNCHRONOUS |
8388608 words |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B88 |
1.95 V |
1.4 mm |
9 mm |
Not Qualified |
134217728 bit |
1.7 V |
CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH |
e1 |
12 mm |
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|
Micron Technology |
MEMORY CIRCUIT |
OTHER |
152 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BALL |
1.8 |
FLASH+SDRAM |
1.8 |
GRID ARRAY, FINE PITCH |
BGA152,21X21,25 |
Other Memory ICs |
.635 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B152 |
Not Qualified |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.