Renesas Electronics Other Function Memory ICs 824

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
UPD46128953F1-E12X-EB1	Renesas Electronics		OTHER	127	FBGA		SQUARE	PLASTIC/EPOXY	YES		CMOS		BALL		60 mA	4194304 words		COMMON	1.8		1.8	32	GRID ARRAY, FINE PITCH	BGA127,14X14,32	Other Memory ICs	.8 mm	85 Cel	3-STATE	4MX32	4M	-25 Cel		BOTTOM	S-PBGA-B127				83 MHz		Not Qualified	134217728 bit
UPD482445LGW-60	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	64	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING		145 mA	262144 words			3.3		3.3	16	SMALL OUTLINE, SHRINK PITCH	SOP64,.54,32	Other Memory ICs	.8 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G64						Not Qualified	4194304 bit			e0			.00013 Amp		60 ns
UPD4664312F9-E85X-CR2	Renesas Electronics		OTHER	93	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		BALL			4194304 words		COMMON			1.8/2	16	GRID ARRAY, FINE PITCH	BGA93,10X14,32	Other Memory ICs	.8 mm	85 Cel	3-STATE	4MX16	4M	-25 Cel		BOTTOM	R-PBGA-B93						Not Qualified	67108864 bit						.00001 Amp		85 ns
7MPV6273S66M	Renesas Electronics
UPD4217102G5M80	Renesas Electronics
M10162040054X0PWAY	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SYNCHRONOUS		2097152 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		2MX8	2M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm		5 mm		16777216 bit	1.71 V		e3		260		6 mm
UPD41264C-15	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		MOS		THROUGH-HOLE			65536 words			5		5	4	IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel		64KX4	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T24						Not Qualified	262144 bit			e0					150 ns
MC-424000FC72F-70	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		1500 mA	4194304 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	4MX72	4M	0 Cel		DUAL	R-PDMA-N168						Not Qualified	301989888 bit						.082 Amp		70 ns
MC174	Renesas Electronics
UPD42264LA-10	Renesas Electronics	VIDEO DRAM	COMMERCIAL	24	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		J BEND		125 mA	65536 words			5		5	4	SMALL OUTLINE	SOJ24,.34	Other Memory ICs	1.27 mm	70 Cel		64KX4	64K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J24						Not Qualified	262144 bit			e0			.005 Amp		100 ns
UPD4664312F9-C85X-CR2	Renesas Electronics		OTHER	93	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		BALL			4194304 words		COMMON	2.5		2.5	16	GRID ARRAY, FINE PITCH	BGA93,10X14,32	Other Memory ICs	.8 mm	85 Cel	3-STATE	4MX16	4M	-25 Cel		BOTTOM	R-PBGA-B93						Not Qualified	67108864 bit						.00001 Amp		85 ns
UPD4664312-B65X-CR2	Renesas Electronics		OTHER	93	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		BALL		45 mA	4194304 words		COMMON	3		3	16	GRID ARRAY, FINE PITCH	BGA93,10X14,32	Other Memory ICs	.8 mm	85 Cel	3-STATE	4MX16	4M	-25 Cel		BOTTOM	R-PBGA-B93						Not Qualified	67108864 bit						.00001 Amp		65 ns
MC-24212361F9-E10X-CDX	Renesas Electronics	MEMORY CIRCUIT	OTHER	85	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS		BALL	ASYNCHRONOUS		1048576 words			1.8			16	GRID ARRAY, FINE PITCH			.8 mm	85 Cel		1MX16	1M	-25 Cel		BOTTOM	R-PBGA-B85		1.95 V			8 mm		16777216 bit	1.65 V	ALSO OPERATES AT 2.6-3.1V, AND 4M X 16 RAM					11 mm
MC-422000LAB72F-60	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		910 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	150994944 bit						.014 Amp		60 ns
MC-422000LAB72F-A70	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		820 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	150994944 bit						.041 Amp		70 ns
M30082040108X0IWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SYNCHRONOUS		1048576 words			3			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	3.6 V	.8 mm		5 mm		8388608 bit	2.7 V		e3		260		6 mm
MC-242443F9-B95-BT3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID		BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified							.00001 Amp		90 ns
UPD27C256AG12	Renesas Electronics
UPD42505C-75	Renesas Electronics		COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		THROUGH-HOLE		60 mA				5		5		IN-LINE	DIP24,.4	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24						Not Qualified				e0			.06 Amp		55 ns
MC-222263F9-B85X-BT3	Renesas Electronics	MEMORY CIRCUIT	OTHER	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID		BALL		50 mA					FLASH+SRAM	3/3.3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	85 Cel				-25 Cel		BOTTOM	R-PBGA-B77						Not Qualified									85 ns
MC176	Renesas Electronics
UPD4216405G3-60-7KD	Renesas Electronics
MC41256A9A10	Renesas Electronics
MC-242454F9-B90-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID		BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77						Not Qualified							.00001 Amp		80 ns
UPD482235G5-70L	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING		205 mA	262144 words			5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40						Not Qualified	2097152 bit			e0			.0002 Amp		70 ns
M66223FP	Renesas Electronics	MEMORY CIRCUIT		80	LFQFP		SQUARE	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	ASYNCHRONOUS		4096 words			5			16	FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			4KX16	4K			QUAD	S-PQFP-G80			1.7 mm		12 mm		65536 bit							12 mm
UPD4216102G5M70	Renesas Electronics
M10042040108X0IWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SYNCHRONOUS		524288 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	85 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm		5 mm		4194304 bit	1.71 V		e3		260		6 mm
M10162040108X0ISAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SYNCHRONOUS		2097152 words			1.8			8	SMALL OUTLINE	SOP8,.3		1.27 mm	85 Cel		2MX8	2M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	2 V	2.16 mm		5.18 mm		16777216 bit	1.71 V		e3		260		5.23 mm
UPD482444G5M-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		GULL WING		135 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70						Not Qualified	4194304 bit			e0			.0002 Amp		70 ns
IDT79R3020-33GB	Renesas Electronics	MEMORY CIRCUIT	MILITARY	68	PGA		SQUARE	CERAMIC	NO		CMOS	38535Q/M;38534H;883B	PIN/PEG		80 mA				5		5		GRID ARRAY	PGA68,11X11	Other Memory ICs	2.54 mm	125 Cel				-55 Cel	TIN LEAD	PERPENDICULAR	S-XPGA-P68						Not Qualified				e0
MC-222244AF9-B85X-BT3	Renesas Electronics	MEMORY CIRCUIT	OTHER	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID		BALL		45 mA					FLASH+SRAM	3/3.3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	85 Cel				-25 Cel		BOTTOM	R-PBGA-B77						Not Qualified									85 ns
CD40108BE98	Renesas Electronics		INDUSTRIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		THROUGH-HOLE								5/15		IN-LINE	DIP24,.6	Other Memory ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24						Not Qualified				e0
UPD4565323G5A80-9JH	Renesas Electronics
MC-482235A32B-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	112	DIMM		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		820 mA	262144 words			5		5	32	MICROELECTRONIC ASSEMBLY	DIMM112	Other Memory ICs	1.27 mm	70 Cel		256KX32	256K	0 Cel		DUAL	R-PDMA-N112						Not Qualified	8388608 bit						.008 Amp		70 ns
UPD4216102G5-80	Renesas Electronics
MC-422000AB72F-80	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		874 mA	2097152 words	NO	COMMON	5		5	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm			Not Qualified	150994944 bit						.073 Amp		80 ns
UPD482234VF-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	40	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		THROUGH-HOLE		200 mA	262144 words			5		5	8	IN-LINE	ZIP40,.1	Other Memory ICs	1.27 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T40						Not Qualified	2097152 bit			e0			.001 Amp		80 ns
M10042040108X0PWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SYNCHRONOUS		524288 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		512KX8	512K	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm		5 mm		4194304 bit	1.71 V		e3		260		6 mm
MC411000A1C12	Renesas Electronics
UPD4616112F9-B95LX-BC2	Renesas Electronics		OTHER	48	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		BALL		35 mA	1048576 words		COMMON			2.7/3	16	GRID ARRAY, FINE PITCH	BGA48,6X8,30	Other Memory ICs	.75 mm	85 Cel	3-STATE	1MX16	1M	-25 Cel		BOTTOM	R-PBGA-B48						Not Qualified	16777216 bit						.00001 Amp		95 ns
UPD411D-E	Renesas Electronics		COMMERCIAL	22	DIP	64	RECTANGULAR	CERAMIC	NO		MOS		THROUGH-HOLE			4096 words		SEPARATE				1	IN-LINE	DIP22,.4	Other Memory ICs	2.54 mm	70 Cel	3-STATE	4KX1	4K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T22						Not Qualified	4096 bit			e0					350 ns
MC-222273F9-B85X-BT3	Renesas Electronics	MEMORY CIRCUIT	OTHER	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID		BALL		50 mA					FLASH+SRAM	3/3.3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	85 Cel				-25 Cel		BOTTOM	R-PBGA-B77						Not Qualified									85 ns
79R3020-20J	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	68	QCCJ		SQUARE	PLASTIC/EPOXY	YES		CMOS		J BEND		60 mA				5		5		CHIP CARRIER	LDCC68,1.0SQ	Other Memory ICs	1.27 mm	70 Cel				0 Cel	TIN LEAD	QUAD	S-PQCC-J68	1					Not Qualified				e0	20	225
CDP1832CH	Renesas Electronics
UPD27C1000D-20	Renesas Electronics
MC-458CA726EFB-A10	Renesas Electronics		COMMERCIAL	168	DIMM	4096	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		NO LEAD		1100 mA	8388608 words		COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	8MX72	8M	0 Cel		DUAL	R-PDMA-N168				100 MHz		Not Qualified	603979776 bit						.0025 Amp		6 ns
UPD42274V-10	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	28	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		THROUGH-HOLE		160 mA	262144 words			5		5	4	IN-LINE	ZIP28,.1	Other Memory ICs	1.27 mm	70 Cel		256KX4	256K	0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T28						Not Qualified	1048576 bit			e0			.004 Amp		100 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.