Renesas Electronics Other Function Memory ICs 824

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
UPD424260LG5M-A70	Renesas Electronics
MC-22106F1-DE1-B10	Renesas Electronics	MEMORY CIRCUIT	OTHER	48	BGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		70 mA					FLASH+SRAM	3/3.3		GRID ARRAY	BGA48,6X8,40	Other Memory ICs	1 mm	85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM	R-PBGA-B48					Not Qualified				e0			.00002 Amp		100 ns
UPD4516921G5A10L	Renesas Electronics
UPD42832G-12	Renesas Electronics		COMMERCIAL	28	SOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		50 mA	32768 words		COMMON	5		5	8	SMALL OUTLINE	SOP28,.5	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					Not Qualified	262144 bit			e0			.001 Amp		120 ns
UPD482235LE-80L	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND		200 mA	262144 words			5		5	8	SMALL OUTLINE	SOJ40,.44	Other Memory ICs	1.27 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J40					Not Qualified	2097152 bit			e0			.0002 Amp		80 ns
UPD4216165G5-50-7KF	Renesas Electronics
UPD4632312-CX	Renesas Electronics
UPD4216102V70	Renesas Electronics
UPD42102C-1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		40 mA				5		5		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified				e0			.04 Amp		40 ns
M30082040054X0IWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		1048576 words			3			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	3.6 V	.8 mm	5 mm		8388608 bit	2.7 V		e3		260		6 mm
UPD4216165LE80	Renesas Electronics
MC-242453F9-B90-BS1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	77	FBGA		RECTANGULAR	PLASTIC/EPOXY	YES		HYBRID	BALL		45 mA					FLASH+SRAM	2.6/3		GRID ARRAY, FINE PITCH	BGA77,8X14,32	Other Memory ICs	.8 mm	70 Cel				-20 Cel		BOTTOM	R-PBGA-B77					Not Qualified							.00001 Amp		80 ns
M10082040054X0IWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		1048576 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm	5 mm		8388608 bit	1.71 V		e3		260		6 mm
UPD4216805G5-80	Renesas Electronics
UPD482445GW-70	Renesas Electronics	VIDEO DRAM	COMMERCIAL	64	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		135 mA	262144 words			5		5	16	SMALL OUTLINE, SHRINK PITCH	SOP64,.54,32	Other Memory ICs	.8 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G64					Not Qualified	4194304 bit			e0			.0002 Amp		70 ns
MC-422000LAB72F-A80	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		730 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm		Not Qualified	150994944 bit						.041 Amp		80 ns
M10082040054X0PWAY	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		1048576 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm	5 mm		8388608 bit	1.71 V		e3		260		6 mm
MC-22001F1-DB1-B10	Renesas Electronics	MEMORY CIRCUIT	OTHER	48	BGA			PLASTIC/EPOXY	YES		HYBRID	BALL		70 mA					FLASH+SRAM	3/3.3		GRID ARRAY	BGA48(UNSPEC)	Other Memory ICs		85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	BOTTOM						Not Qualified				e0			.000002 Amp		100 ns
AMB0480XXBJG	Renesas Electronics	MEMORY CIRCUIT
UPD482234G5-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		205 mA	262144 words			5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40					Not Qualified	2097152 bit			e0			.001 Amp		70 ns
UPD482445G5M-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		115 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70					Not Qualified	4194304 bit			e0			.0002 Amp		70 ns
UPD41101C-2	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		90 mA						+-5,12		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified				e0			.09 Amp		27 ns
M10162040108X0PWAR	Renesas Electronics	MEMORY CIRCUIT		8	HVSON		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	NO LEAD	SYNCHRONOUS		2097152 words			1.8			8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		1.27 mm	105 Cel		2MX8	2M	-40 Cel	TIN	DUAL	R-PDSO-N8	3	2 V	.8 mm	5 mm		16777216 bit	1.71 V		e3		260		6 mm
UPD482444LG5-70	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		125 mA	262144 words			3.3		3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70					Not Qualified	4194304 bit			e0			.00013 Amp		70 ns
MC-422000LFB72F-70	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		820 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm		Not Qualified	150994944 bit						.041 Amp		70 ns
UPD482234LE-80	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	SOJ		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND		200 mA	262144 words			5		5	8	SMALL OUTLINE	SOJ40,.44	Other Memory ICs	1.27 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-J40					Not Qualified	2097152 bit			e0			.001 Amp		80 ns
UPD4516181G5A11L	Renesas Electronics
UPD42101C-3	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		70 mA						+-5,12		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified				e0			.07 Amp		27 ns
UPD41102C-1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		90 mA				5		5		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified				e0			.09 Amp		40 ns
UPD482444LG5M-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		105 mA	262144 words			3.3		3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70					Not Qualified	4194304 bit			e0			.00013 Amp		80 ns
UPD4516182G5A13L	Renesas Electronics
71V416S20Y	Renesas Electronics
UPD482235G5-80	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		200 mA	262144 words			5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40					Not Qualified	2097152 bit			e0			.001 Amp		80 ns
UPD42102C-2	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	24	DIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		70 mA				5		5		IN-LINE	DIP24,.3	Other Memory ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified				e0			.07 Amp		21 ns
MC-422000LFB72F-A60	Renesas Electronics		COMMERCIAL	168	DIMM	2048	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	NO LEAD		910 mA	2097152 words	NO	COMMON	3.3		3.3	72	MICROELECTRONIC ASSEMBLY	DIMM168	Other Memory ICs	1.27 mm	70 Cel	3-STATE	2MX72	2M	0 Cel		DUAL	R-PDMA-N168			25.4 mm		Not Qualified	150994944 bit						.041 Amp		60 ns
MC-2311100F9-B90-BQ1	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	61	TFBGA		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS		1048576 words						16	GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel		1MX16	1M	-20 Cel		BOTTOM	R-PBGA-B61		3 V	1.2 mm	7 mm	Not Qualified	16777216 bit	2.6 V	SRAM CONFIGURATION IS 256K X 16					9 mm
UPD42116920	Renesas Electronics
R8A20211BG	Renesas Electronics
UPD482445G5-60	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	70	TSSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		155 mA	262144 words			5		5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP70,.46	Other Memory ICs	.635 mm	70 Cel		256KX16	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G70					Not Qualified	4194304 bit			e0			.0002 Amp		60 ns
UPD482234G5M-70L	Renesas Electronics	VIDEO DRAM	COMMERCIAL	40	TSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		205 mA	262144 words			5		5	8	SMALL OUTLINE, THIN PROFILE	TSOP40/44,.46,32	Other Memory ICs	.8 mm	70 Cel		256KX8	256K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G40					Not Qualified	2097152 bit			e0			.0002 Amp		70 ns
M30082040108X0ISAY	Renesas Electronics	MEMORY CIRCUIT		8	SOP		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS		1048576 words			3			8	SMALL OUTLINE	SOP8,.3		1.27 mm	85 Cel		1MX8	1M	-40 Cel	TIN	DUAL	R-PDSO-G8	3	3.6 V	2.16 mm	5.18 mm		8388608 bit	2.7 V		e3		260		5.23 mm
UPD4516161G5A10L	Renesas Electronics
74FCT162701ATPV	Renesas Electronics	MEMORY CIRCUIT	INDUSTRIAL	56	SSOP		RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING		5 mA				5		5		SMALL OUTLINE, SHRINK PITCH	SSOP56,.4	Other Memory ICs	.635 mm	85 Cel				-40 Cel	TIN LEAD	DUAL	R-PDSO-G56	1				Not Qualified				e0	20	225
UPD42274V-80	Renesas Electronics	MEMORY CIRCUIT	COMMERCIAL	28	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		160 mA	262144 words			5		5	4	IN-LINE	ZIP28,.1	Other Memory ICs	1.27 mm	70 Cel		256KX4	256K	0 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T28					Not Qualified	1048576 bit			e0			.004 Amp		80 ns
UPD4516922G5A13L	Renesas Electronics
UPD42505V-75	Renesas Electronics		COMMERCIAL	28	ZIP		RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE		60 mA				5		5		IN-LINE	ZIP28,.1	Other Memory ICs	1.27 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	ZIG-ZAG	R-PZIP-T28					Not Qualified				e0			.06 Amp		55 ns
UPD4565323G5A10BL9JH	Renesas Electronics
UPD4516822G5A10L	Renesas Electronics

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.