Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
13.97 mm |
200 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
2048 bit |
70 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
2048 bit |
70 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
41.4 mm |
120 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
155 mA |
512 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
85 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
175 mA |
2048 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX4 |
2K |
0 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX4 |
2K |
0 Cel |
DUAL |
R-PDIP-T18 |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
1024 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX4 |
1K |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
60 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
155 mA |
512 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-XDIP-T24 |
4096 bit |
75 ns |
|||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
41.4 mm |
300 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
100 mA |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
256X4 |
256 |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
1024 bit |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
1024 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX4 |
1K |
-55 Cel |
DUAL |
R-XDIP-T18 |
Not Qualified |
4096 bit |
NOT SPECIFIED |
NOT SPECIFIED |
75 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
155 mA |
4096 words |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
4KX4 |
4K |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
45 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
256X8 |
256 |
0 Cel |
DUAL |
R-GDIP-T20 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
2048 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
24.195 mm |
70 ns |
|||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
35 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
130 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.32 mm |
250 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
70 mA |
256 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
125 Cel |
256X8 |
256 |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
2048 bit |
40 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
250 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
60 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
131072 bit |
36.32 mm |
250 ns |
|||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
13.97 mm |
120 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQCC-J28 |
5.25 V |
4.57 mm |
11.5062 mm |
Not Qualified |
16384 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.035 Amp |
11.5062 mm |
50 ns |
13.5 |
||||||||||||||||
|
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
41.4 mm |
200 ns |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.5 V |
41.4 mm |
120 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDIP-T20 |
4096 bit |
75 ns |
||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
125 mA |
32 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC20,.35SQ |
OTP ROMs |
1.27 mm |
70 Cel |
32X8 |
32 |
0 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
15 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
DUAL |
R-PDIP-T24 |
16384 bit |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
1024 bit |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
3.3 |
3.3/5 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
DUAL |
R-PDIP-T32 |
3.6 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
3 V |
.000025 Amp |
41.4 mm |
300 ns |
|||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
TTL |
J BEND |
2048 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
OTP ROMs |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQCC-J28 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
25 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
250 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.25 V |
5.08 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.32 mm |
200 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP20,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-XDIP-T20 |
4096 bit |
75 ns |
||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.32 mm |
170 ns |
13 |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.25 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
36.32 mm |
150 ns |
13 |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
4194304 bit |
4.75 V |
16.5862 mm |
80 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
120 mA |
1024 words |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX4 |
1K |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
4096 bit |
25 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
16.5862 mm |
200 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
DUAL |
R-PDIP-T24 |
5.25 V |
5.08 mm |
15.24 mm |
Not Qualified |
32768 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
31.75 mm |
300 ns |
21 |
||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
70 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
110 mA |
32 words |
5 |
5 |
8 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
32X8 |
32 |
0 Cel |
DUAL |
R-XDIP-T16 |
40 ns |
||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
175 mA |
2048 words |
5 |
4 |
IN-LINE |
DIP18,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX4 |
2K |
-55 Cel |
DUAL |
R-GDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
85 ns |
||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
512 words |
8 |
IN-LINE |
DIP24,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
DUAL |
R-PDIP-T24 |
4096 bit |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
OTP ROMs |
.5 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
18.415 mm |
150 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.