Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
MIL-M-38510 Class S |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDFP-F24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDFP-F24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
5 |
8 |
IN-LINE |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
4096 bit |
4.5 V |
90 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
64 words |
COMMON |
5 |
8 |
IN-LINE |
DIP24(UNSPEC) |
125 Cel |
OPEN-COLLECTOR |
64X8 |
64 |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.25 V |
Qualified |
512 bit |
4.75 V |
140 ns |
5 |
||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class S |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e3/e4 |
100 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-M-38510 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
90 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.715 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e3/e4 |
55 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.715 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
55 ns |
||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
FLAT |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDFP-F24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
100 ns |
||||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
31.9405 mm |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
125 Cel |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
8192 bit |
4.5 V |
45 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
1024 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
1KX8 |
1K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
31.9405 mm |
|||||||||||||||||||||||||
NXP Semiconductors |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
55 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
FLAT |
120 mA |
2048 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-XDFP-F24 |
Not Qualified |
16384 bit |
.12 Amp |
25 ns |
||||||||||||||||||||||||||||
Toshiba |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
450 ns |
25 |
|||||||||||||||||||||||||||
Toshiba |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
350 ns |
25 |
|||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
50 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
512 words |
5 |
8 |
IN-LINE |
DIP24,.3 |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
4096 bit |
4.5 V |
LG-MAX |
.0001 Amp |
32.51 mm |
140 ns |
5 |
|||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
24 |
WDIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE, WINDOW |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
TIN LEAD |
DUAL |
R-CDIP-T24 |
5.25 V |
5.5 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
LG-MAX |
e0 |
33.5 mm |
390 ns |
25 |
||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
60 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
45 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
512 words |
5 |
8 |
IN-LINE |
DIP24,.6 |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDIP-T24 |
5.5 V |
5.72 mm |
15.24 mm |
4096 bit |
4.5 V |
LG-MAX |
.0001 Amp |
32.77 mm |
220 ns |
5 |
|||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
50 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
50 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T24 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
140 ns |
||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
512 words |
5 |
8 |
IN-LINE |
DIP24,.3 |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
DUAL |
R-CDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
4096 bit |
4.5 V |
LG-MAX |
.0001 Amp |
32.51 mm |
220 ns |
5 |
|||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
390 ns |
25 |
|||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
16384 bit |
e0 |
60 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
60 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
4096 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
4KX8 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
32768 bit |
e0 |
450 ns |
25 |
|||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
50 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
60 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
-4.5 V |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
512 words |
4.5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
512X8 |
512 |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T24 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
4096 bit |
4.5 V |
e0 |
140 ns |
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Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
FLAT |
PARALLEL |
ASYNCHRONOUS |
25 mA |
2048 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F24 |
2.92 mm |
9.905 mm |
Not Qualified |
16384 bit |
e4 |
.0002 Amp |
100 ns |
||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class V |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
GOLD |
DUAL |
R-CDIP-T24 |
5.72 mm |
15.24 mm |
Not Qualified |
16384 bit |
e4 |
.0002 Amp |
100 ns |
||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class Q |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
GOLD |
DUAL |
R-CDIP-T24 |
5.72 mm |
15.24 mm |
Not Qualified |
16384 bit |
e4 |
.0002 Amp |
100 ns |
||||||||||||||||||||
Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
FLAT |
PARALLEL |
ASYNCHRONOUS |
25 mA |
2048 words |
5 |
5 |
8 |
FLATPACK |
FL24,.4 |
OTP ROMs |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
GOLD |
DUAL |
R-CDFP-F24 |
2.92 mm |
9.905 mm |
Not Qualified |
16384 bit |
e4 |
.0002 Amp |
100 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.