32 OTP ROM 2,400+

Reset All

Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Reverse Pinout	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
TMS27PC256-15FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TMS27PC510-25FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	250 ns
TMS27PC256-10FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	100 ns	13
TMS27PC256-150FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TMS27LV010A-30DUL4	Texas Instruments	OTP ROM	COMMERCIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel	YES	3-STATE	128KX8	128K	0 Cel		DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	1048576 bit	3 V				.000025 Amp	18.415 mm	300 ns
TMS27PC256-1FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	170 ns	13
TMS27PC512-10DUE4	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel	YES	3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	100 ns
TMS27PC010A-12NL4	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	41.4 mm	120 ns
TMS27PC256-2FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC040-100FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	524288 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	512KX8	512K	0 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	100 ns
TMS27PC512-10DDE4	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	100 ns
TMS27PC512-10DDE	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	100 ns
TMS27PC512-150FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns
TMS27PC128-45FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND				16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	16KX8	16K	0 Cel		QUAD	R-PQCC-J32				Not Qualified	131072 bit							450 ns	12.5
TMS27PC510-200FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	250 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00003 Amp	13.97 mm	200 ns
TMX27PC010-300NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		5		8	IN-LINE			2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.75 V					41.4 mm	300 ns
TMS27LV010A-20DDL	Texas Instruments	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	1048576 bit	3 V				.000025 Amp	18.415 mm	200 ns
TMS27PC128-20FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	16KX8	16K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	131072 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC256-100FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	100 ns	13
TMS27PC040-15FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		5		8	CHIP CARRIER			1.27 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V					13.97 mm	150 ns
TMS27PC510-20NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	64KX8	64K	0 Cel		DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	41.4 mm	200 ns
TMS27C040P-15FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		5		8	CHIP CARRIER			1.27 mm	70 Cel		3-STATE	512KX8	512K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	4.5 V					13.97 mm	150 ns
TMS27PC010A-15DDL	Texas Instruments	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	18.415 mm	150 ns
TMS27PC510-17NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	64KX8	64K	0 Cel		DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	41.4 mm	170 ns
TMS27LV010A-25NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V				.000025 Amp	41.4 mm	250 ns
TMS27PC010A-20NL4	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	41.4 mm	200 ns
TMS27PC512-100FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	100 ns
TMS27PC256-25FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	250 ns	13
TMS27PC510-17FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	64KX8	64K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	170 ns
TMS27PC256-150FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns	13
TMX27PC010-200NL	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		5		8	IN-LINE			2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	5.25 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	4.75 V					41.4 mm	200 ns
TMS27PC256-1FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	170 ns	13
TMS27LV010A-20NL4	Texas Instruments	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	3.3	3.3/5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V				.000025 Amp	41.4 mm	200 ns
TMS27PC512-12DDE	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	18.415 mm	120 ns
TMS27PC256-12FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	120 ns	13
TMS27PC512-15FME	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	150 ns
TMS27PC010A-12FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	128KX8	128K	-40 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	120 ns
TMS27PC256-20FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC512FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	64KX8	64K	0 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	250 ns
TMS27PC510-120FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	250 mA	65536 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00003 Amp	13.97 mm	120 ns
TMS27PC510-20NE4	Texas Instruments	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	65536 words	COMMON	5	5	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel		DUAL	R-PDIP-T32	5.5 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	41.4 mm	200 ns
TMS27PC128-2FME4	Texas Instruments	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	16384 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	16KX8	16K	-40 Cel		QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	131072 bit	4.75 V		NOT SPECIFIED	NOT SPECIFIED	.00025 Amp	13.97 mm	200 ns	13
TMS27PC010A-12DUE	Texas Instruments	OTP ROM	INDUSTRIAL	32	TSOP1-R	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel	YES	3-STATE	128KX8	128K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	18.415 mm	120 ns
TMS27PC010A-20FML4	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	200 ns
TMS27PC010A-15FML	Texas Instruments	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel		3-STATE	128KX8	128K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	4.5 V		NOT SPECIFIED	NOT SPECIFIED	.0001 Amp	13.97 mm	150 ns
M27V801-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel		3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	8388608 bit	2.97 V	e0			.00002 Amp	18.4 mm	120 ns
M27V405-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	Other Memory ICs	1.27 mm	85 Cel		3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V	e0			.00002 Amp	13.995 mm	200 ns
M27W512-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel		3-STATE	64KX8	64K	-40 Cel	TIN	QUAD	R-PQCC-J32	3.6 V	3.556 mm	11.43 mm	Not Qualified	524288 bit	2.7 V	e3			.000015 Amp	13.97 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.