32 OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M87C257-70C3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	70 ns
M87C257-15XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M87C257-90X3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				125 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							90 ns
M87C257-90XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	90 ns
M87C257-12C1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	120 ns
M87C257-15XC7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M87C257-20C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	150 ns
M87C257-60C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	60 ns
M27V256-120K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	3 V		e0			.00001 Amp	13.97 mm	120 ns	12.75
M27V401-200N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	3 V		e0			.00002 Amp	18.4 mm	200 ns
M27W801-150B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words		3		8	IN-LINE			2.54 mm	85 Cel		1MX8	1M	-40 Cel		DUAL	R-PDIP-T32	3.6 V	4.83 mm	15.24 mm	Not Qualified	8388608 bit	2.7 V						42.035 mm	120 ns
M87C257-12XC1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	120 ns
M27V801-180K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.4554 mm	Not Qualified	8388608 bit	3 V		e0			.00002 Amp	13.995 mm	180 ns
M87C257-80XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	80 ns
M27V401-120N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	3 V		e0			.00002 Amp	18.4 mm	120 ns
M27W101-150N4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		131072 words				8	SMALL OUTLINE, THIN PROFILE			.5 mm	70 Cel		128KX8	128K	-20 Cel	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	1048576 bit	2.7 V		e3				18.4 mm	150 ns
M87C257-90XC3	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	125 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	90 ns
M27W201-200B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	4.83 mm	15.24 mm	Not Qualified	2097152 bit	2.7 V		e3			.000015 Amp	42.035 mm	100 ns
M27W401-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		524288 words		3		8	SMALL OUTLINE, THIN PROFILE			.5 mm	85 Cel		512KX8	512K	-40 Cel	MATTE TIN/TIN BISMUTH	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.7 V		e3/e6	40	260		18.4 mm	200 ns
M87C257-15XC7XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M27W201-80NZ6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.56,20	OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e3			.000015 Amp	12.4 mm	80 ns
M27V801-120P1	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T32	3.63 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	2.97 V		e0			.00002 Amp	41.91 mm	120 ns
M27W401-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	2.7 V		e3			.000015 Amp	13.97 mm	200 ns
M27V405-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	Other Memory ICs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27V405-150N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	Other Memory ICs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	150 ns
M27W201-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V		e3			.000015 Amp	18.4 mm	100 ns
M87C257-15XC1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	150 ns
M27V256-200K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	3 V		e0			.00001 Amp	13.97 mm	200 ns	3.3
M87C257-80C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	80 ns
M27W801-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	2.7 V		e3			.000015 Amp	13.97 mm	120 ns
M27V101-150N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	1048576 bit	3 V		e0			.00002 Amp	18.4 mm	150 ns
M27V405-150N4	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	18.4 mm	150 ns
M27V405-180K5TR	STMicroelectronics	OTP ROM	OTHER	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	Other Memory ICs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	13.995 mm	180 ns
M87C257-70XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	70 ns
M87C257-70XC6XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	70 ns
M27V405-150K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	13.995 mm	150 ns
M87C257-45X3X	STMicroelectronics	OTP ROM	AUTOMOTIVE	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER				125 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							45 ns
M27V801-150B1	STMicroelectronics		COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			15 mA	1048576 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6	OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32				Not Qualified	8388608 bit			e0			.00002 Amp		150 ns
M27V512-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	13.97 mm	200 ns
M27V101-100K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	3 V		e0			.00002 Amp	13.97 mm	100 ns
M87C257-90XC7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	90 ns
M27W201-80NZ6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.56,20	OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN/TIN BISMUTH	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e3/e6	40	260	.000015 Amp	12.4 mm	80 ns
M27V405-200N5TR	STMicroelectronics	OTP ROM	OTHER	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20	Other Memory ICs	.5 mm	85 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M87C257-15C7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e3			.0001 Amp		150 ns
M87C257-70C6XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	70 ns
M27V405-180K4	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	13.995 mm	180 ns
M87C257-15C7XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M87C257-80XC7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6	OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	80 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.