Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
245 |
.001 Amp |
13.97 mm |
70 ns |
5 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
.0001 Amp |
13.97 mm |
70 ns |
13 |
|||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
40 |
245 |
.001 Amp |
13.97 mm |
45 ns |
5 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
45 ns |
13 |
|||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
70 ns |
5 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
45 ns |
5 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
524288 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
70 ns |
5 |
|||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
524288 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
13.97 mm |
45 ns |
5 |
|||||||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
13.97 mm |
70 ns |
|||||||||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
SEPARATE |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
.001 Amp |
13.97 mm |
70 ns |
5 |
||||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
.00001 Amp |
13.97 mm |
70 ns |
13 |
|||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
1048576 bit |
4.5 V |
.0001 Amp |
13.97 mm |
70 ns |
13 |
||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
90 ns |
||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
16.586 mm |
70 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
16.586 mm |
55 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
70 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
5.5 V |
4.572 mm |
16.586 mm |
1048576 bit |
4.5 V |
e3 |
.0001 Amp |
16.586 mm |
70 ns |
13 |
|||||||||||||||||
Atmel |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
120 ns |
|||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
10 mA |
524288 words |
COMMON |
3.3 |
3.3/5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
4194304 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
e3 |
40 |
245 |
.00002 Amp |
13.97 mm |
90 ns |
13 |
||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
16.586 mm |
90 ns |
13 |
|||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
4194304 bit |
4.5 V |
.00001 Amp |
13.97 mm |
70 ns |
13 |
||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
131072 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX16 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
2097152 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
16.586 mm |
55 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
16.586 mm |
45 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
55 ns |
13 |
|||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
.00001 Amp |
13.97 mm |
45 ns |
13 |
|||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
120 ns |
|||||||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.5 V |
4.572 mm |
16.586 mm |
4194304 bit |
4.5 V |
.0001 Amp |
16.586 mm |
55 ns |
13 |
||||||||||||||||||||
Atmel |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
90 ns |
|||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8 mA |
131072 words |
COMMON |
3.3 |
3.3/5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
1048576 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
e3 |
40 |
245 |
.00002 Amp |
13.97 mm |
70 ns |
13 |
||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
1048576 bit |
4.5 V |
.0001 Amp |
13.97 mm |
45 ns |
13 |
||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
12.75 |
|||||||||||||||
Atmel |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
150 ns |
|||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
4194304 bit |
4.5 V |
e3 |
.00001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
70 ns |
13 |
|||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
12.75V PROGRAMMING VOLTAGE |
e3 |
.0001 Amp |
13.97 mm |
100 ns |
12.75 |
||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
5.5 V |
4.572 mm |
16.586 mm |
4194304 bit |
4.5 V |
e3 |
.0001 Amp |
16.586 mm |
90 ns |
13 |
|||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8 mA |
65536 words |
COMMON |
3 |
3/5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
S-PQCC-J44 |
3 |
3.6 V |
4.572 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
2.7 V |
ALSO OPERATES AT 5V SUPPLY |
e3 |
40 |
245 |
.00002 Amp |
16.5862 mm |
90 ns |
13 |
||||||||||
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
150 ns |
12.75 |
|||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
55 ns |
13 |
||||||||||||||
Fairchild Semiconductor |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.455 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0001 Amp |
13.995 mm |
120 ns |
12.75 |
||||||||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.5 V |
4.572 mm |
16.586 mm |
1048576 bit |
4.5 V |
.0001 Amp |
16.586 mm |
45 ns |
13 |
||||||||||||||||||||
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
.0001 Amp |
13.97 mm |
70 ns |
||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
e3 |
40 |
245 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||
Fairchild Semiconductor |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.455 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.0001 Amp |
13.995 mm |
90 ns |
12.75 |
||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
262144 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
11.43 mm |
2097152 bit |
4.5 V |
e3 |
245 |
.0001 Amp |
13.97 mm |
55 ns |
13 |
|||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
70 ns |
||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
262144 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
2097152 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.