Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Atmel |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
30 |
225 |
.0001 Amp |
16.586 mm |
70 ns |
||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
120 ns |
13 |
||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.572 mm |
16.586 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
16.586 mm |
55 ns |
|||||||||||||||
Cypress Semiconductor |
OTP ROM |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
100 mA |
8192 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J28 |
5.5 V |
4.572 mm |
11.5316 mm |
Not Qualified |
65536 bit |
4.5 V |
POWER SWITCHED PROM |
e0 |
.03 Amp |
11.5316 mm |
35 ns |
||||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
16.5862 mm |
150 ns |
|||||||||||||||
Atmel |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
20 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
225 |
.0001 Amp |
16.5862 mm |
120 ns |
|||||||||||||||
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
32768 words |
COMMON |
5 |
3.3/5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
11.43 mm |
Not Qualified |
262144 bit |
3 V |
e0 |
225 |
.00002 Amp |
13.97 mm |
150 ns |
13 |
||||||||||||||
Rochester Electronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
CHIP CARRIER |
70 Cel |
128KX8 |
128K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
150 ns |
||||||||||||||||||||||||||||||
Rochester Electronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
70 Cel |
64KX8 |
64K |
0 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
5.5 V |
Not Qualified |
524288 bit |
4.5 V |
e0 |
45 ns |
||||||||||||||||||||||||||||
National Semiconductor |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.51 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.0001 Amp |
16.51 mm |
150 ns |
|||||||||||||||||
Microchip Technology |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8 mA |
65536 words |
COMMON |
3 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
1.27 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
-40 Cel |
QUAD |
1 |
S-PQCC-J44 |
3.6 V |
4.572 mm |
16.5862 mm |
1048576 bit |
2.7 V |
ALSO OPERATES AT 5V SUPPLY |
.00002 Amp |
16.5862 mm |
90 ns |
13 |
|||||||||||||||||||
Microchip Technology |
OTP ROM |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
1048576 words |
SEPARATE |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
8388608 bit |
4.5 V |
.001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8 mA |
262144 words |
COMMON |
3.3 |
3.3/5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
2097152 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
e3 |
40 |
245 |
.00002 Amp |
13.97 mm |
120 ns |
13 |
||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
3.3 |
3.3/5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
11.43 mm |
Not Qualified |
1048576 bit |
3 V |
.000025 Amp |
13.97 mm |
300 ns |
|||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
TTL |
J BEND |
125 mA |
32 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC20,.4SQ |
OTP ROMs |
1.27 mm |
70 Cel |
32X8 |
32 |
0 Cel |
QUAD |
S-PQCC-J20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
25 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
13.97 mm |
100 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
150 ns |
13 |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
200 ns |
13 |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
13.97 mm |
80 ns |
|||||||||||||||||
|
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
250 ns |
13 |
|||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
TTL |
J BEND |
155 mA |
4096 words |
5 |
5 |
4 |
CHIP CARRIER |
LDCC20,.4SQ |
OTP ROMs |
1.27 mm |
70 Cel |
4KX4 |
4K |
0 Cel |
QUAD |
S-PQCC-J20 |
Not Qualified |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
45 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
TTL |
J BEND |
256 words |
5 |
5 |
8 |
CHIP CARRIER |
LDCC20,.4SQ |
OTP ROMs |
1.27 mm |
70 Cel |
256X8 |
256 |
0 Cel |
QUAD |
S-PQCC-J20 |
Not Qualified |
2048 bit |
NOT SPECIFIED |
NOT SPECIFIED |
25 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
131072 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
150 ns |
13 |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
16.5862 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00003 Amp |
13.97 mm |
170 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
-40 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
16.5862 mm |
100 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
16.5862 mm |
250 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
16384 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
QUAD |
R-PQCC-J32 |
Not Qualified |
131072 bit |
300 ns |
12.5 |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
3.3 |
3.3/5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
11.43 mm |
Not Qualified |
1048576 bit |
3 V |
.000025 Amp |
13.97 mm |
250 ns |
|||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.57 mm |
16.5862 mm |
Not Qualified |
4194304 bit |
4.75 V |
16.5862 mm |
120 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
13.97 mm |
100 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
13.97 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
200 ns |
|||||||||||||||||
|
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
250 ns |
13 |
|||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC28,.5SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.5062 mm |
Not Qualified |
16384 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.035 Amp |
11.5062 mm |
35 ns |
13.5 |
||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
262144 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
2097152 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
13.97 mm |
100 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
65536 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
QUAD |
S-PQCC-J44 |
Not Qualified |
1048576 bit |
.0005 Amp |
120 ns |
||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
QCCJ |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
30 mA |
16384 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC(UNSPEC) |
OTP ROMs |
70 Cel |
3-STATE |
16KX8 |
16K |
0 Cel |
QUAD |
Not Qualified |
131072 bit |
.00025 Amp |
200 ns |
12.5 |
||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.75 V |
13.97 mm |
120 ns |
||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
50 mA |
262144 words |
COMMON |
5 |
5 |
16 |
CHIP CARRIER |
LDCC44,.7SQ |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
QUAD |
S-PQCC-J44 |
Not Qualified |
4194304 bit |
.0001 Amp |
150 ns |
|||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
150 ns |
|||||||||||||||||
|
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00003 Amp |
13.97 mm |
170 ns |
||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.25 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00003 Amp |
13.97 mm |
200 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
13.97 mm |
200 ns |
|||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
65536 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
0 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00025 Amp |
13.97 mm |
250 ns |
|||||||||||||||||
Texas Instruments |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
524288 bit |
4.5 V |
13.97 mm |
120 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.