ROUND OTP ROM 59

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)

DS2502T

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

128X8

128

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e0

15000 ns

DS2502TR+T&R

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

128 words

5

8

CYLINDRICAL

85 Cel

128X8

128

-40 Cel

MATTE TIN

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e3

DS2406T

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

1024 words

3

3/5

1

CYLINDRICAL

SIP3,.1,50

SRAMs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e0

DS2506

Maxim Integrated

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

MOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

65536 words

COMMON

5

3/5

1

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

64KX1

64K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

1

6 V

Not Qualified

65536 bit

2.8 V

MICROLAN COMPATIBLE

e0

245

DS2406/T&R

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

1024 words

3

3/5

1

CYLINDRICAL

SIP3,.1,50

SRAMs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e0

DS2506+

Maxim Integrated

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

MOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

65536 words

COMMON

5

3/5

1

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

64KX1

64K

-40 Cel

MATTE TIN

BOTTOM

O-PBCY-T3

1

6 V

Not Qualified

65536 bit

2.8 V

MICROLAN COMPATIBLE

e3

30

260

DS2502U-1172+

Maxim Integrated

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

128 words

5

8

CYLINDRICAL

85 Cel

128X8

128

-40 Cel

MATTE TIN

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e3

250

DS2502-UNW

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

MOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

128 words

COMMON

5

3/5

8

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

128X8

128

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e0

DS2406

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

1024 words

3

3/5

1

CYLINDRICAL

SIP3,.1,50

SRAMs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e0

DS2502-E64

Maxim Integrated

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

1024 words

1

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e0

245

DS2505-UNW

Maxim Integrated

OTP ROM

INDUSTRIAL

3

TO-92

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

2048 words

COMMON

3/5

8

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

2KX8

2K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

16384 bit

2.8 V

MICROLAN COMPATIBLE

e0

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.