COMMERCIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27V800-150M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	150 ns
M27V402150K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	16.5862 mm	150 ns
M27W401-200N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	524288 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32				Not Qualified	4194304 bit			e0	.00002 Amp		200 ns
M27V801-120B1	STMicroelectronics		COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			15 mA	1048576 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T32				Not Qualified	8388608 bit			e0	.00002 Amp		120 ns
M87C257-10XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	100 ns
M27V322-120XP1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDIP-T42	3.465 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	3.135 V		e3	.00006 Amp	52.455 mm	120 ns
M27W512-200K4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words				8	CHIP CARRIER				1.27 mm	70 Cel		64KX8	64K	-20 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	2.7 V		e3		13.995 mm	200 ns
M27V800-100M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	28.2 mm	100 ns
M27V102-100B1	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	52.18 mm	100 ns
ST27256-20CP	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	NMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	100 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	5.5 V		15.24 mm	Not Qualified	262144 bit	4.5 V		e0		36.83 mm	200 ns	12.5
M27V512-90K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	65536 words	COMMON		3.3/5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32				Not Qualified	524288 bit			e0	.00001 Amp		90 ns
M27W03290N1T	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP48,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G48	3.6 V	1.2 mm	12 mm	Not Qualified	33554432 bit	3 V		e0	.0001 Amp	18.4 mm	90 ns
TS27C64A-30CP	STMicroelectronics		COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE				8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	8KX8	8K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	65536 bit			e0			300 ns	12.5
M27V102-120K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	120 ns
M27W101-200K4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	131072 words	COMMON		3/5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	1048576 bit	2.7 V		e0	.00002 Amp	13.995 mm	200 ns
M27W06490M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	3 V		e0	.0001 Amp	28.5 mm	90 ns
M27V320-150N1	STMicroelectronics	OTP ROM	COMMERCIAL	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.8,20	8	OTP ROMs	.5 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDSO-G48	3.63 V	1.2 mm	12 mm	Not Qualified	33554432 bit	2.97 V		e3	.00006 Amp	18.4 mm	150 ns
M27V402-200B4TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words		3.3		16	IN-LINE				2.54 mm	70 Cel		256KX16	256K	-20 Cel		DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	4194304 bit	2.97 V				52.18 mm	200 ns
M27V402150N1	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	18.4 mm	150 ns
M87C257-12C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3	.0001 Amp	13.97 mm	120 ns
M27V160-120M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V		e3	.00006 Amp	28.2 mm	120 ns
M27V102-100N1	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	12.4 mm	100 ns
M27W016100S1	STMicroelectronics	OTP ROM	COMMERCIAL	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	IN-LINE, SHRINK PITCH	SDIP42,.6		Other Memory ICs	1.778 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T42	3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0	.0001 Amp	36.83 mm	100 ns
ST27256-20XCP	STMicroelectronics		COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS	THROUGH-HOLE			100 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	262144 bit			e0			200 ns	12.5
M27W201-150K4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words				8	CHIP CARRIER				1.27 mm	70 Cel		256KX8	256K	-20 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	2.7 V		e3		13.995 mm	150 ns
M27W064100M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V		e0	.0001 Amp	28.5 mm	100 ns
TS27C64A-25CFN	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	8192 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	8KX8	8K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	5.5 V	3.55 mm	11.43 mm	Not Qualified	65536 bit	4.5 V		e0	.0001 Amp	13.97 mm	250 ns	12.5
M27V102-120K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	120 ns
M27V801-200K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.4554 mm	Not Qualified	8388608 bit	3 V		e0	.00002 Amp	13.995 mm	200 ns
M87C257-60XC1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3	.0001 Amp	13.995 mm	60 ns
M27V401-150N1	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	512KX8	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	3 V		e0	.00002 Amp	18.4 mm	150 ns
M27V160-120XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.465 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	3.135 V		e3	.00006 Amp	28.2 mm	120 ns
M87C257-20XC1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3	.0001 Amp	13.995 mm	150 ns
M27V800-120XM1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.465 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	28.2 mm	120 ns
M27V102-120N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	12.4 mm	120 ns
M27V402-150B1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words		3.3		16	IN-LINE				2.54 mm	70 Cel		256KX16	256K	0 Cel		DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	4194304 bit	2.97 V				52.18 mm	150 ns
M27V801-200P1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words		3.3		8	IN-LINE				2.54 mm	70 Cel		1MX8	1M	0 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	3 V				41.91 mm	200 ns
M87C257-15XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	150 ns
M87C257-90XC1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	90 ns
M87C257-12C1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3	.0001 Amp	13.97 mm	120 ns
M27V256-90N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	262144 bit	3 V		e0	.00001 Amp	11.8 mm	90 ns	3.3
M87C257-20C1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3	.0001 Amp	13.97 mm	150 ns
M27V160-110M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	2MX8	2M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V		e0	.00002 Amp	28.2 mm	110 ns
M27V256-120K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	3 V		e0	.00001 Amp	13.97 mm	120 ns	12.75
M27V256-150N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	262144 bit	3 V		e0	.00001 Amp	11.8 mm	150 ns	3.3
M87C257-12XC1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3	.0001 Amp	13.995 mm	120 ns
M27V800-110XM1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.465 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	3.135 V		e0	.00002 Amp	28.2 mm	110 ns
M27V322-120XB1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDIP-T42	3.465 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	3.135 V		e3	.00006 Amp	52.455 mm	120 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.