COMMERCIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
ST27C256-25CFN	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			24 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e0	.00001 Amp		250 ns	12.5
M27W402-150N4	STMicroelectronics		COMMERCIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			50 mA	262144 words	COMMON		3/5	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40				Not Qualified	4194304 bit			e0	.00002 Amp		150 ns
M27V102-100K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	16.5862 mm	100 ns
M27V401-200B1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words		3.3		8	IN-LINE				2.54 mm	70 Cel		512KX8	512K	0 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	3 V				41.91 mm	200 ns
M27V405-180N4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		Other Memory ICs	.5 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	18.4 mm	180 ns
M87C257-80C1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	80 ns
ETC2732Q-3	STMicroelectronics		COMMERCIAL	24	DIP	RECTANGULAR	CERAMIC	NO		CMOS	THROUGH-HOLE				4096 words	COMMON	5	5	8	IN-LINE	DIP24,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	4KX8	4K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24				Not Qualified	32768 bit			e0			350 ns
M27W01690M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63		Other Memory ICs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	16777216 bit	3 V		e3	.0001 Amp	28.5 mm	90 ns
M27V402-200B1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words		3.3		16	IN-LINE				2.54 mm	70 Cel		256KX16	256K	0 Cel		DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	4194304 bit	2.97 V				52.18 mm	200 ns
M27V800-150K1	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.63 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	150 ns
M27V102-90BN1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		65536 words		3.3		16	IN-LINE					70 Cel		64KX16	64K	0 Cel		DUAL	R-PDIP-T28	3.6 V			Not Qualified	1048576 bit	3 V					90 ns
M27V256-200N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	262144 bit	3 V		e0	.00001 Amp	11.8 mm	200 ns	3.3
M27V512-100B1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	3 V		e0	.00001 Amp	37.085 mm	100 ns
M87C257-70XC1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3	.0001 Amp	13.97 mm	70 ns
M27W01690B1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		Other Memory ICs	2.54 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T42	3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	3 V		e3	.0001 Amp	52.455 mm	90 ns
M27V800-120XK1TR	STMicroelectronics	OTP ROM	COMMERCIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.465 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	3.135 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	16.5862 mm	120 ns
M27V800-100B1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDIP-T42	3.63 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	2.97 V	CONFIGURABLE AS 512K X 16	e0	.00002 Amp	52.455 mm	100 ns
M27V512K	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words				8	CHIP CARRIER				1.27 mm	70 Cel		64KX8	64K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	524288 bit	3 V				13.995 mm	200 ns
M27V160-100M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDSO-G44	3.63 V	2.8 mm	13.3 mm	Not Qualified	16777216 bit	2.97 V	CONFIGURABLE AS 1M X 16	e3	.00006 Amp	28.2 mm	100 ns
M27V102-200N1	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	12.4 mm	200 ns
M27V160-120B1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	MATTE TIN	DUAL	R-PDIP-T42	3.63 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.97 V	CONFIGURABLE AS 1M X 16	e3	.00006 Amp	52.455 mm	120 ns
M27V801-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.4554 mm	Not Qualified	8388608 bit	3 V		e0	.00002 Amp	13.995 mm	150 ns
M87C257-90XC1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3	.0001 Amp	13.97 mm	90 ns
M87C257-70C1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	70 ns
M27W064110M1T	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	4194304 words	COMMON	3	3/3.3	16	SMALL OUTLINE	SOP44,.63		OTP ROMs	1.27 mm	70 Cel	3-STATE	4MX16	4M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.6 V	3 mm	12.6 mm	Not Qualified	67108864 bit	2.7 V		e0	.0001 Amp	28.5 mm	110 ns
M27W201-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words				8	CHIP CARRIER				1.27 mm	70 Cel		256KX8	256K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	2097152 bit	2.7 V				13.995 mm	150 ns
M27V256-150B1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	10 mA	32768 words	COMMON	3.3	3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	3 V		e0	.00001 Amp	37.085 mm	150 ns	12.75
M27V102-120B1	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	52.18 mm	120 ns
ST27C256-20CFN	STMicroelectronics		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e0	.00001 Amp		200 ns	12.5
M27V800-120M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	16	SMALL OUTLINE	SOP44,.63	8	OTP ROMs	1.27 mm	70 Cel	3-STATE	512KX16	512K	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	120 ns
M27W016110S1	STMicroelectronics	OTP ROM	COMMERCIAL	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words	COMMON	3	3/3.3	16	IN-LINE, SHRINK PITCH	SDIP42,.6		Other Memory ICs	1.778 mm	70 Cel	3-STATE	1MX16	1M	0 Cel	TIN LEAD	DUAL	R-PDIP-T42	3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V	90NS ACCESS TIME AT VCC = 3.0 TO 3.6V.	e0	.0001 Amp	36.83 mm	110 ns
M27V400-100XB1	STMicroelectronics	OTP ROM	COMMERCIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	262144 words	COMMON	3.3	3.3	16	IN-LINE	DIP40,.6	8	OTP ROMs	2.54 mm	70 Cel	3-STATE	256KX16	256K	0 Cel	TIN LEAD	DUAL	R-PDIP-T40	3.465 V		15.24 mm	Not Qualified	4194304 bit	3.135 V		e0	.00002 Amp	52.18 mm	100 ns
M27W016100B1T	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		1048576 words		3		16	IN-LINE				2.54 mm	70 Cel		1MX16	1M	0 Cel		DUAL	R-PDIP-T42	3.6 V	5.08 mm	15.24 mm	Not Qualified	16777216 bit	2.7 V				52.455 mm	100 ns
M27V512-200B1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	3 V		e0	.00001 Amp	37.085 mm	200 ns
TS27C64A-15CP	STMicroelectronics		COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE				8192 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	8KX8	8K	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	65536 bit			e0			150 ns	12.5
M27V405-180K4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		Other Memory ICs	1.27 mm	70 Cel	3-STATE	512KX8	512K	-20 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	13.995 mm	180 ns
M27V512-150K1TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	64KX8	64K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	3 V		e0	.00001 Amp	13.97 mm	150 ns
M27V256-150BN1	STMicroelectronics	OTP ROM	COMMERCIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		3.3		8	IN-LINE					70 Cel		32KX8	32K	0 Cel		DUAL	R-PDIP-T28	3.6 V			Not Qualified	262144 bit	3 V					150 ns
M27V101-120K1	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	128KX8	128K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	3 V		e0	.00002 Amp	13.97 mm	120 ns
M27V102-150N1TR	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	70 Cel	3-STATE	64KX16	64K	0 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.97 V		e0	.00002 Amp	12.4 mm	150 ns
M27V402120N4	STMicroelectronics	OTP ROM	COMMERCIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX16	256K	-20 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	4194304 bit	2.97 V		e0	.00002 Amp	18.4 mm	120 ns
M27V322-100XP1	STMicroelectronics	OTP ROM	COMMERCIAL	42	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	30 mA	2097152 words	COMMON	3.3	3.3	16	IN-LINE	DIP42,.6		OTP ROMs	2.54 mm	70 Cel	3-STATE	2MX16	2M	0 Cel	MATTE TIN	DUAL	R-PDIP-T42	3.465 V	5.08 mm	15.24 mm	Not Qualified	33554432 bit	3.135 V		e3	.00006 Amp	52.455 mm	100 ns
M87C257-80X1X	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					70 Cel		32KX8	32K	0 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V					80 ns
M27V101K	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		131072 words				8	CHIP CARRIER				1.27 mm	70 Cel		128KX8	128K	0 Cel		QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.455 mm	Not Qualified	1048576 bit	3 V				13.995 mm	200 ns
M27W201-150N4TR	STMicroelectronics	OTP ROM	COMMERCIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		262144 words				8	SMALL OUTLINE, THIN PROFILE				.5 mm	70 Cel		256KX8	256K	-20 Cel	TIN	DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V		e3		18.4 mm	150 ns
M27V800-110M1	STMicroelectronics	OTP ROM	COMMERCIAL	44	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE	SOP44,.63	16	OTP ROMs	1.27 mm	70 Cel	3-STATE	1MX8	1M	0 Cel	TIN LEAD	DUAL	R-PDSO-G44	3.63 V	2.62 mm	13.3 mm	Not Qualified	8388608 bit	2.97 V		e0	.00002 Amp	28.2 mm	110 ns
M87C257-80C1XTR	STMicroelectronics	OTP ROM	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	70 Cel	3-STATE	32KX8	32K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3	.0001 Amp	13.995 mm	80 ns
M27W201-150N1	STMicroelectronics		COMMERCIAL	32	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	GULL WING			30 mA	262144 words	COMMON		3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP32,.8,20		OTP ROMs	.5 mm	70 Cel	3-STATE	256KX8	256K	0 Cel	TIN LEAD	DUAL	R-PDSO-G32				Not Qualified	2097152 bit			e0	.00002 Amp		150 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.