INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M87C257-70XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	70 ns
M27V256-150BN6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		3.3		8	IN-LINE					85 Cel		32KX8	32K	-40 Cel		DUAL	R-PDIP-T28	3.6 V			Not Qualified	262144 bit	3 V							150 ns
M27W801-100N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	8388608 bit	2.7 V	ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V	e0			.000015 Amp	18.4 mm	100 ns
M27V402-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	20 mA	262144 words	COMMON	3.3	3.3	16	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP40,.8,20		Other Memory ICs	.5 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.63 V	1.2 mm	10 mm	Not Qualified	4194304 bit	2.97 V		e0			.00002 Amp	18.4 mm	200 ns
M27V256-150B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		3.3		8	IN-LINE				2.54 mm	85 Cel		32KX8	32K	-40 Cel		DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	262144 bit	3 V						36.83 mm	150 ns
M87C257-10XC6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	100 ns
M87C257-70XC7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit			e3			.0001 Amp	13.995 mm	70 ns
M87C257-80XC7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit			e3			.0001 Amp	13.995 mm	80 ns
M27V401-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	3 V		e0			.00002 Amp	13.97 mm	200 ns
M27W512-200K6E	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		65536 words		3		8	CHIP CARRIER				1.27 mm	85 Cel		64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED		13.97 mm	100 ns
M27W201-80K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e3			.000015 Amp	13.97 mm	80 ns
M87C257-60C7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	60 ns
M27W202-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		131072 words		3.3		16	CHIP CARRIER				1.27 mm	85 Cel		128KX16	128K	-40 Cel		QUAD	S-PQCC-J44	3.6 V	4.7 mm	16.5862 mm	Not Qualified	2097152 bit	2.7 V						16.5862 mm	100 ns
M27W256-150N6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	32768 words	COMMON	3	3/3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel		DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	262144 bit	2.7 V					.000015 Amp	11.8 mm	100 ns	12.75
M27V801-150P6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDIP-T32	3.63 V	5.08 mm	15.24 mm	Not Qualified	8388608 bit	2.97 V		e0			.00002 Amp	41.91 mm	150 ns
M27W801-200K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	2.7 V		e3			.000015 Amp	13.97 mm	120 ns
M87C257-80C7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e3			.0001 Amp		80 ns
ETC2732Q-45-V	STMicroelectronics		INDUSTRIAL	24	DIP	RECTANGULAR	CERAMIC	NO		CMOS	THROUGH-HOLE				4096 words	COMMON	5	5	8	IN-LINE	DIP24,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	4KX8	4K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24				Not Qualified	32768 bit			e0					450 ns
M87C257-20XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	150 ns
M27W512-150N6E	STMicroelectronics	OTP ROM	INDUSTRIAL	28	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		65536 words		3		8	SMALL OUTLINE, THIN PROFILE				.55 mm	85 Cel		64KX8	64K	-40 Cel	TIN/TIN BISMUTH	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	524288 bit	2.7 V		e3/e6	NOT SPECIFIED	260		11.8 mm	100 ns
M27V801-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	8388608 bit	3 V		e0			.00002 Amp	18.4 mm	150 ns
M27W101-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	1048576 bit	2.7 V		e3			.000015 Amp	13.97 mm	100 ns
M87C257-12XC7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	120 ns
ST27C256-30TP	STMicroelectronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			20 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	262144 bit			e0			.00001 Amp		300 ns	12.5
M27V201-200B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	3 V		e3			.00002 Amp	41.91 mm	200 ns
M27V160-150XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3			.00006 Amp	16.586 mm	150 ns
M27V201-250N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		262144 words				8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	2097152 bit	3 V						18.4 mm	250 ns
M87C257-10XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	100 ns
TS27C64A-30VFN	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND				8192 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	8KX8	8K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				Not Qualified	65536 bit			e0					300 ns	12.5
M27V101-120B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3.3		8	IN-LINE				2.54 mm	85 Cel		128KX8	128K	-40 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	3 V						41.91 mm	120 ns
M27V201-180K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	3 V		e3			.00002 Amp	13.97 mm	180 ns
M27W201-80N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e0			.000015 Amp	18.4 mm	80 ns
M27W801-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	1048576 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	8388608 bit	2.7 V		e3			.00002 Amp	13.97 mm	120 ns
M87C257-20X6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					85 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							150 ns
ST27C256-20TFN	STMicroelectronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e0			.00001 Amp		200 ns	12.5
M27V512-150B6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	37.085 mm	150 ns
M27V401-180B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words		3.3		8	IN-LINE				2.54 mm	85 Cel		512KX8	512K	-40 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	3 V						41.91 mm	180 ns
M27W256-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	32768 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	2.7 V					.000015 Amp	13.97 mm	100 ns	12.75
M27V512-120N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	11.8 mm	120 ns
M27W201-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	2097152 bit	2.7 V		e3			.000015 Amp	13.97 mm	100 ns
M87C257-12XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	120 ns
M87C257-60XC7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit			e3			.0001 Amp	13.995 mm	60 ns
M27W201-120F6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WDIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words				8	IN-LINE, WINDOW				2.54 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-CDIP-T32	3.6 V	5.72 mm	15.24 mm		2097152 bit	2.7 V						41.885 mm	100 ns
M27V405-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.63 V	3.56 mm	11.455 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	13.995 mm	120 ns
M27V512-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	37.085 mm	100 ns
M87C257-15XC6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.97 mm	150 ns
M27V201-150B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	3 V		e3			.00002 Amp	41.91 mm	150 ns
M27W101-200B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3		8	IN-LINE				2.54 mm	85 Cel		128KX8	128K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	2.7 V		e3				41.91 mm	100 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.