INDUSTRIAL OTP ROM 2,400+

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)
M27W401-120B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3	3/3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	2.7 V		e3			.000015 Amp	41.91 mm	120 ns
M27W201-150F6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	WDIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words				8	IN-LINE, WINDOW				2.54 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-CDIP-T32	3.6 V	5.72 mm	15.24 mm		2097152 bit	2.7 V						41.885 mm	100 ns
M27V160-100XK6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	1048576 words	COMMON	3.3	3.3	16	CHIP CARRIER	LDCC44,.7SQ	8	OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX16	1M	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.465 V	4.57 mm	16.586 mm	Not Qualified	16777216 bit	3.135 V		e3			.00006 Amp	16.586 mm	100 ns
M27W400-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	524288 words	COMMON		3/3.3	8	CHIP CARRIER	LDCC44,.7SQ	16	Other Memory ICs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.96 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.43 V		e0			.000015 Amp	16.5862 mm	100 ns
M87C257-20XC7XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M27W202-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	20 mA	131072 words	COMMON	3.3	3/3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T40	3.6 V		15.24 mm	Not Qualified	2097152 bit	2.7 V		e3			.000015 Amp	52.18 mm	100 ns
M27V800-150K6TR	STMicroelectronics		INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	1048576 words	COMMON		3/3.3	8	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	1MX8	1M	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				Not Qualified	8388608 bit			e0			.000015 Amp		150 ns
M27V512-200K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	13.97 mm	200 ns
M87C257-10C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	100 ns
M27W401-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		3		8	CHIP CARRIER				1.27 mm	85 Cel		512KX8	512K	-40 Cel		QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED		13.97 mm	100 ns
M27W401-150K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		3		8	CHIP CARRIER				1.27 mm	85 Cel		512KX8	512K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	4194304 bit	2.7 V		e3				13.97 mm	150 ns
M27W201-200B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		262144 words				8	IN-LINE				2.54 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-PDIP-T32	3.6 V		15.24 mm		2097152 bit	2.7 V						42.035 mm	100 ns
M27W256-150K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	32768 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	2.7 V		e0			.000015 Amp	13.97 mm	100 ns	12.75
M27V201-120N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	2097152 bit	3 V		e0			.00002 Amp	18.4 mm	120 ns
M27W101-120B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		131072 words		3		8	IN-LINE				2.54 mm	85 Cel		128KX8	128K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	2.7 V		e3				41.91 mm	100 ns
M27W512-80K6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel		QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e0	NOT SPECIFIED	NOT SPECIFIED	.000015 Amp	13.97 mm	80 ns
M27V401-150B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		524288 words		3.3		8	IN-LINE				2.54 mm	85 Cel		512KX8	512K	-40 Cel		DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	4194304 bit	3 V						41.91 mm	150 ns
M27W402-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		262144 words	COMMON	3	3/3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3.6 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	2.7 V		e3			.00002 Amp	16.586 mm	120 ns
M27V201N	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		262144 words				8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		256KX8	256K	-40 Cel		DUAL	R-PDSO-G32	5.5 V	1.2 mm	8 mm	Not Qualified	2097152 bit	3.2 V						18.4 mm	200 ns
M27W101-80B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3	3/3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	1048576 bit	2.7 V		e3			.000015 Amp	41.91 mm	80 ns
M27W512-80B6E	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3	3/3.3	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T28	3.6 V	5.08 mm	15.24 mm	Not Qualified	524288 bit	2.7 V	ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V	e3			.000015 Amp	36.83 mm	80 ns
M87C257-90C6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	90 ns
ST27C256-17VP	STMicroelectronics		INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	THROUGH-HOLE			35.8 mA	32768 words	COMMON	5	5	8	IN-LINE	DIP28,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				Not Qualified	262144 bit			e0			.00001 Amp		170 ns	12.5
M27W256-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	15 mA	32768 words	COMMON	3	3/3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	2.7 V		e0			.000015 Amp	13.97 mm	100 ns	12.75
M87C257-45X7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							45 ns
M27V101-150N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	131072 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	128KX8	128K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	1048576 bit	3 V		e0			.00002 Amp	18.4 mm	150 ns
M27V102-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T40	3.63 V		15.24 mm	Not Qualified	1048576 bit	2.97 V		e0			.00002 Amp	52.18 mm	100 ns
M87C257-90X7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		32768 words		5		8	CHIP CARRIER					105 Cel		32KX8	32K	-40 Cel		QUAD	R-PQCC-J32	5.25 V			Not Qualified	262144 bit	4.75 V							90 ns
M87C257-12XC6X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.25 V	3.56 mm	11.455 mm	Not Qualified	262144 bit	4.75 V		e3			.0001 Amp	13.995 mm	120 ns
M87C257-45C7TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm	Not Qualified	262144 bit			e3			.0001 Amp	13.995 mm	45 ns
M27V512-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP28,.53,22		OTP ROMs	.55 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	3.6 V	1.25 mm	8 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	11.8 mm	200 ns
M27W102-80N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	40	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	65536 words	COMMON	3.3	3/3.3	16	SMALL OUTLINE, THIN PROFILE	TSSOP40,.56,20		OTP ROMs	.5 mm	85 Cel	3-STATE	64KX16	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G40	3.6 V	1.2 mm	10 mm	Not Qualified	1048576 bit	2.7 V		e0			.000015 Amp	12.4 mm	80 ns
M27V401-200N6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	15 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.6 V	1.2 mm	8 mm	Not Qualified	4194304 bit	3 V		e0			.00002 Amp	18.4 mm	200 ns
M87C257-10C7X	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	100 ns
M87C257-20C7	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND			30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	105 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32				Not Qualified	262144 bit			e3			.0001 Amp		200 ns
M27W202-100K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	131072 words	COMMON	3.3	3/3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	128KX16	128K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.6 V	4.7 mm	16.5862 mm	Not Qualified	2097152 bit	2.7 V		e0			.000015 Amp	16.5862 mm	100 ns
M27V201-120B6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	15 mA	262144 words	COMMON	3.3	3.3	8	IN-LINE	DIP32,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX8	256K	-40 Cel	MATTE TIN	DUAL	R-PDIP-T32	3.6 V	5.08 mm	15.24 mm	Not Qualified	2097152 bit	3 V		e3			.00002 Amp	41.91 mm	120 ns
M27V405-120N6	STMicroelectronics	OTP ROM	INDUSTRIAL	32	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	30 mA	524288 words	COMMON	3.3	3.3	8	SMALL OUTLINE, THIN PROFILE	TSSOP32,.8,20		OTP ROMs	.5 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G32	3.63 V	1.2 mm	8 mm	Not Qualified	4194304 bit	2.97 V		e0			.0001 Amp	18.4 mm	120 ns
M27W400-120K6	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	20 mA	524288 words	COMMON		3/3.3	8	CHIP CARRIER	LDCC44,.7SQ	16	Other Memory ICs	1.27 mm	85 Cel	3-STATE	512KX8	512K	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3.96 V	4.7 mm	16.5862 mm	Not Qualified	4194304 bit	2.43 V		e0			.000015 Amp	16.5862 mm	120 ns
M27W256-150B6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		32768 words		3		8	IN-LINE				2.54 mm	85 Cel		32KX8	32K	-40 Cel		DUAL	R-PDIP-T28	3.6 V		15.24 mm	Not Qualified	262144 bit	2.7 V						36.83 mm	80 ns
M27W402-120B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	262144 words	COMMON	3	3/3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T40	3.6 V		15.24 mm	Not Qualified	4194304 bit	2.7 V		e3			.000015 Amp	52.18 mm	120 ns
M27W402-100K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	50 mA	262144 words	COMMON	3	3/3.3	16	CHIP CARRIER	LDCC44,.7SQ		OTP ROMs	1.27 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J44	3.6 V	4.57 mm	16.586 mm	Not Qualified	4194304 bit	2.7 V	ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V	e3	40	245	.000015 Amp	16.586 mm	100 ns
M27W402-100B6	STMicroelectronics	OTP ROM	INDUSTRIAL	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	50 mA	262144 words	COMMON	3	3/3.3	16	IN-LINE	DIP40,.6		OTP ROMs	2.54 mm	85 Cel	3-STATE	256KX16	256K	-40 Cel	TIN	DUAL	R-PDIP-T40	3.6 V		15.24 mm	Not Qualified	4194304 bit	2.7 V	ACCESS TIME 80 NANO SECS AT VCC 3V TO 3.6V	e3		245	.000015 Amp	52.18 mm	100 ns
M27W800-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		524288 words		3.3		16	CHIP CARRIER		8		1.27 mm	85 Cel		512KX16	512K	-40 Cel		QUAD	S-PQCC-J44	3.6 V	4.7 mm	16.5862 mm	Not Qualified	8388608 bit	2.7 V						16.5862 mm	120 ns
M27V512-120K6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	10 mA	65536 words	COMMON	3.3	3.3	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	64KX8	64K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	3.6 V	3.56 mm	11.43 mm	Not Qualified	524288 bit	3 V		e0			.00001 Amp	13.97 mm	120 ns
M87C257-15C6TR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32	5.5 V	3.56 mm	11.43 mm	Not Qualified	262144 bit	4.5 V		e3			.0001 Amp	13.97 mm	150 ns
M87C257-15XC6XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	150 ns
M87C257-90C6XTR	STMicroelectronics	OTP ROM	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	30 mA	32768 words	COMMON	5	5	8	CHIP CARRIER	LDCC32,.5X.6		OTP ROMs	1.27 mm	85 Cel	3-STATE	32KX8	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-J32			11.455 mm		262144 bit			e3			.0001 Amp	13.995 mm	90 ns

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.