Maxim Integrated OTP ROM 62

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
DS2502P-E48/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0			.000005 Amp	3.94 mm
DS2502P-E48	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240	.000005 Amp	3.94 mm
DS2502P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240		3.94 mm	15000 ns
DS2502R/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TO-236	Other Memory ICs	.95 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G3	1	6 V	1.12 mm	1.3 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				2.92 mm	15000 ns
DS2502P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240		3.94 mm	15000 ns
DS2502-E48	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS	.005 mA	1024 words	COMMON		3/5	1	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0		245	.000005 Amp
DS2502S	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0		245		4.9 mm	15000 ns
DS2502	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS2502/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS2502P-E64	Maxim Integrated	OTP ROM	INDUSTRIAL	6		RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND				1024 words				1					85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-C6	1	6 V			Not Qualified	1024 bit	2.8 V		e0	20	240
DS2505P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm	15000 ns
DS2502X1#U	Maxim Integrated	OTP ROM	INDUSTRIAL	2	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	ASYNCHRONOUS		128 words		5		8	GRID ARRAY, VERY THIN PROFILE			.933 mm	85 Cel	128X8	128	-40 Cel		BOTTOM	R-PBGA-B2		6 V	.639 mm	.91 mm		1024 bit	2.8 V			NOT SPECIFIED	NOT SPECIFIED		1.6 mm
DS2502X1	Maxim Integrated	OTP ROM	INDUSTRIAL	2	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	GRID ARRAY, VERY THIN PROFILE	BGA2,1X2,37	Other Memory ICs	.933 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	R-PBGA-B2	1	6 V	.639 mm	.91 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240		1.6 mm	15000 ns
DS2406P/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240		3.94 mm
DS2506S	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	GULL WING	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	SMALL OUTLINE	SOP8,.3	Other Memory ICs	1.27 mm	85 Cel	64KX1	64K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		6 V	2.13 mm	5.285 mm	Not Qualified	65536 bit	2.8 V		e0				5.31 mm
DS2505P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	SMALL OUTLINE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0		245		3.94 mm	15000 ns
DS2406P	Maxim Integrated	OTP ROM	INDUSTRIAL	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0	20	240		3.94 mm
DS2505	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel	16KX1	16K	-40 Cel	Tin/Lead (Sn85Pb15)	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0	20	240			15000 ns
DS2502S/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				4.9 mm	15000 ns
DS1982-F3	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	1KX1	1K	-40 Cel	TIN LEAD	END	O-MEDB-N2	1	6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS1982-F3#	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words		5		1	DISK BUTTON				85 Cel	1KX1	1K	-40 Cel	MATTE TIN	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3
DS2502S-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	GULL WING	SERIAL	SYNCHRONOUS		128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				4.9 mm
DS2505/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1	Other Memory ICs	2.54 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS1982U-F3	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words		5		8	DISK BUTTON				85 Cel	128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS1982U-F5-PPPP	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words				8	DISK BUTTON				85 Cel	128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V		e0
DS1986-F5	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	64KX1	64K	-40 Cel	TIN LEAD	END	O-MEDB-N2	1	6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS1982U-F5	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words		5		8	DISK BUTTON				85 Cel	128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS1982-F5	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		1024 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	1KX1	1K	-40 Cel	TIN LEAD	END	O-MEDB-N2	1	6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS1986-F3+	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		65536 words		5		1	DISK BUTTON				85 Cel	64KX1	64K	-40 Cel		END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V			NOT SPECIFIED	NOT SPECIFIED
DS1986-F3	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	DISK BUTTON	BUTTON,.68IN	Other Memory ICs		85 Cel	64KX1	64K	-40 Cel	TIN LEAD	END	O-MEDB-N2	1	6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS1982U-F3-PPPP	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		128 words				8	DISK BUTTON				85 Cel	128X8	128	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	1024 bit	2.8 V		e0
DS1985U-F5	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	SYNCHRONOUS		2048 words				8	DISK BUTTON				85 Cel	2KX8	2K	-40 Cel	TIN LEAD	END	O-MEDB-N2		6 V			Not Qualified	16384 bit	2.8 V		e0
DS1986F-5+	Maxim Integrated	OTP ROM	INDUSTRIAL	2		ROUND	METAL	YES	1	CMOS	NO LEAD	SERIAL	ASYNCHRONOUS		65536 words		5		1	DISK BUTTON				85 Cel	64KX1	64K	-40 Cel	MATTE TIN	END	O-MEDB-N2		6 V			Not Qualified	65536 bit	2.8 V		e3
DS2502/T&R/SL	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS2505T	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		16384 words		5		1	CYLINDRICAL				85 Cel	16KX1	16K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2502T	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0					15000 ns
DS2505PV	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS		2048 words				8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	2KX8	2K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V		e0				3.94 mm
DS2502C-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		128 words		5		8	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2505V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	ASYNCHRONOUS		16384 words		5		1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0				3.94 mm
DS2505S-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS		16384 words				1	SMALL OUTLINE			1.27 mm	85 Cel	16KX1	16K	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	16384 bit	2.8 V		e0				4.9 mm
DS2502TR+T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		128 words		5		8	CYLINDRICAL				85 Cel	128X8	128	-40 Cel	MATTE TIN	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3
DS2502G+U	Maxim Integrated	OTP ROM																										NICKEL GOLD PALLADIUM
DS2406T	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	CYLINDRICAL	SIP3,.1,50	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS2506	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	64KX1	64K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3	1	6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e0		245
DS2406/T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	CYLINDRICAL	SIP3,.1,50	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS2506+	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS		65536 words	COMMON	5	3/5	1	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	64KX1	64K	-40 Cel	MATTE TIN	BOTTOM	O-PBCY-T3	1	6 V			Not Qualified	65536 bit	2.8 V	MICROLAN COMPATIBLE	e3	30	260
DS2502PV	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words				1	SMALL OUTLINE, LOW PROFILE			1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0				3.94 mm
DS2406V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS		1024 words		3	3/5	1	SMALL OUTLINE, LOW PROFILE	SOC6,.17	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V		e0				3.94 mm

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.