Maxim Integrated OTP ROM 62

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Access Time
DS2406X	Maxim Integrated	OTP ROM	INDUSTRIAL	6	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	SERIAL	ASYNCHRONOUS	1024 words		3	3/5	1	GRID ARRAY, VERY THIN PROFILE	FLIP CHIP	SRAMs	1.2 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6		6 V	.864 mm	1.91 mm	Not Qualified	1024 bit	2.8 V		e0			2.85 mm
DS2502U-1172+	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS	128 words		5		8	CYLINDRICAL				85 Cel	128X8	128	-40 Cel	MATTE TIN	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e3		250
DS2502-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	MOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS	128 words	COMMON	5	3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2502P-E48/T&R-DALLAS	Maxim Integrated	OTP ROM																																					NOT SPECIFIED	NOT SPECIFIED
DS2502G+T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	2	VBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	BUTT	SERIAL	ASYNCHRONOUS	128 words	COMMON		3/5	8	CHIP CARRIER, VERY THIN PROFILE	SURF MNT 2,.25SQ	Other Memory ICs		85 Cel	128X8	128	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B2			1 mm	6 mm	Not Qualified	1024 bit			e4			6 mm	15000 ns
DS2502P-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS	C BEND	SERIAL	SYNCHRONOUS	128 words	COMMON	5	3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0			3.94 mm
DS2505P-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	SYNCHRONOUS	2048 words	COMMON		3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	2KX8	2K	-40 Cel		DUAL	R-PDSO-C6	1	6 V	1.5 mm	3.76 mm	Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE				3.94 mm
DS2506S+T&R	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	65536 words		5		1	SMALL OUTLINE				85 Cel	64KX1	64K	-40 Cel		DUAL	R-PDSO-G8		6 V				65536 bit	2.8 V			NOT SPECIFIED	NOT SPECIFIED
DS2406	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	ASYNCHRONOUS	1024 words		3	3/5	1	CYLINDRICAL	SIP3,.1,50	SRAMs	1.27 mm	85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0
DS2502V	Maxim Integrated	OTP ROM	INDUSTRIAL	6	LSOC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	C BEND	SERIAL	ASYNCHRONOUS	128 words	COMMON	5	3/5	8	SMALL OUTLINE, LOW PROFILE	SOC6,.17	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-C6		6 V	1.5 mm	3.76 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0			3.94 mm	15000 ns
DS2502Y	Maxim Integrated	OTP ROM	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SERIAL	ASYNCHRONOUS	128 words	COMMON	5	3/5	8	SMALL OUTLINE	SOP8,.25	Other Memory ICs	1.27 mm	85 Cel	128X8	128	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	6 V	1.75 mm	3.9 mm	Not Qualified	1024 bit	2.8 V	MICROLAN COMPATIBLE	e0			4.9 mm	15000 ns
DS2502-E64	Maxim Integrated	OTP ROM	INDUSTRIAL	3		ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE			1024 words				1					85 Cel	1KX1	1K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	1024 bit	2.8 V		e0		245
DS2505-UNW	Maxim Integrated	OTP ROM	INDUSTRIAL	3	TO-92	ROUND	PLASTIC/EPOXY	NO	1	CMOS	THROUGH-HOLE	SERIAL	SYNCHRONOUS	2048 words	COMMON		3/5	8	CYLINDRICAL	SIP3,.1,50	Other Memory ICs	1.27 mm	85 Cel	2KX8	2K	-40 Cel	TIN LEAD	BOTTOM	O-PBCY-T3		6 V			Not Qualified	16384 bit	2.8 V	MICROLAN COMPATIBLE	e0
DS2502R-01C+T&R	Maxim Integrated	OTP ROM																									MATTE TIN			1								e3	30	260

OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.