Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
375 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
3.14 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
167 MHz |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e4 |
40 |
260 |
20 mm |
3.4 ns |
|||||||||||
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
17 mm |
3.4 ns |
||||||||||||||||||||||
|
Infineon Technologies |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
500 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
200 MHz |
14 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e4 |
40 |
260 |
20 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
-40 Cel |
PURE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.63 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
75497472 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
260 |
20 mm |
6.5 ns |
||||||||||||||
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1KX4 |
1K |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4096 bit |
4.5 V |
YES |
15.4 mm |
10 ns |
|||||||||||||||||||||||
Motorola |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
165 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.5 V |
4.57 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.5 V |
OUTPUT BUFFER SUPPLY VOLTAGE 5V +/- 10% OR 3.3V +/- 10%; SELF-TIMED WRITE; BURST COUNTER |
e0 |
YES |
.03 Amp |
16.5862 mm |
14 ns |
||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
4194304 words |
CONFIGURABLE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ32,.44 |
4 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
4.5 V |
0 Cel |
DUAL |
1 |
R-PDSO-J32 |
5.25 V |
3.7 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.75 V |
YES |
.01 Amp |
20.96 mm |
25 ns |
|||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
CONFIGURED AS 2-WAY 4K X 18 OR DIRECT MAPPED 8K X 18 |
YES |
19.1262 mm |
25 ns |
||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
8192 words |
COMMON |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
S-PQCC-J52 |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
NOT SPECIFIED |
NOT SPECIFIED |
19.1262 mm |
||||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
CONFIGURED AS 2-WAY 4K X 18 OR DIRECT MAPPED 8K X 18 |
YES |
19.1262 mm |
25 ns |
||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
COMMON |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
S-PQCC-J52 |
Not Qualified |
147456 bit |
25 ns |
|||||||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
e0 |
.03 Amp |
16.5862 mm |
11 ns |
|||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
e0 |
.03 Amp |
16.5862 mm |
8 ns |
|||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
14 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
YES |
16.5862 mm |
14 ns |
||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
e0 |
.03 Amp |
16.5862 mm |
9 ns |
|||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
e0 |
YES |
.03 Amp |
16.5862 mm |
19 ns |
||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
e0 |
.03 Amp |
16.5862 mm |
12 ns |
|||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
12 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
e0 |
YES |
.03 Amp |
16.5862 mm |
19 ns |
|||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
180 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
e0 |
.03 Amp |
16.5862 mm |
14 ns |
|||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
9 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
e0 |
YES |
.03 Amp |
16.5862 mm |
24 ns |
|||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
14 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
YES |
16.5862 mm |
11 ns |
||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
11 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
YES |
16.5862 mm |
12 ns |
||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
11 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
12 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
32768 words |
5 |
9 |
CHIP CARRIER |
1.27 mm |
70 Cel |
32KX9 |
32K |
0 Cel |
QUAD |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
SELF-TIMED WRITE CYCLE |
16.5862 mm |
8 ns |
|||||||||||||||||||||||||
STMicroelectronics |
CACHE SRAM |
COMMERCIAL |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
160 mA |
32768 words |
COMMON |
5 |
5 |
9 |
CHIP CARRIER |
LDCC44,.7SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX9 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J44 |
5.25 V |
4.7 mm |
16.5862 mm |
Not Qualified |
294912 bit |
4.75 V |
BURST COUNTER; SELF TIMED WRITE CYCLE |
e0 |
YES |
.03 Amp |
16.5862 mm |
24 ns |
||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
10 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
MILITARY |
16 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
1 |
IN-LINE |
125 Cel |
256X1 |
256 |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.25 V |
Not Qualified |
256 bit |
4.75 V |
||||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
11 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
11 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
4194304 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
10 ns |
||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
MILITARY |
16 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
1 |
IN-LINE |
125 Cel |
256X1 |
256 |
-55 Cel |
DUAL |
R-CDIP-T16 |
5.5 V |
Not Qualified |
256 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
MILITARY |
16 |
DFP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
MIL-STD-883 |
FLAT |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
1 |
FLATPACK |
125 Cel |
256X1 |
256 |
-55 Cel |
DUAL |
R-XDFP-F16 |
5.25 V |
Not Qualified |
256 bit |
4.75 V |
||||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
330 mA |
262144 words |
COMMON |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
.65 mm |
70 Cel |
256KX18 |
256K |
3.125 V |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
90 MHz |
14 mm |
4718592 bit |
3.135 V |
FLOW THROUGH ARCHITECTURE |
YES |
.005 Amp |
20 mm |
8.5 ns |
|||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
20 mm |
8 ns |
||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4 ns |
|||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
1179648 bit |
3.135 V |
20 mm |
4 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
265 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
10 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
225 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
20 mm |
2.6 ns |
|||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
DUAL |
R-PDSO-J44 |
3.6 V |
3.76 mm |
10.16 mm |
4194304 bit |
3 V |
28.575 mm |
10 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.