Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
2MX18 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
22 mm |
8.5 ns |
|||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
3.47 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.13 V |
19.1262 mm |
10 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
64KX32 |
64K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
2097152 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
7.5 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX18 |
2M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
17 mm |
8.5 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
1MX18 |
1M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
15 mm |
2.6 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
138 MHz |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
17 mm |
4 ns |
||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
SELF-TIMED WRITE CYCLE; POWER DOWN OPTION |
20 mm |
9 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
e0 |
.03 Amp |
20 mm |
9 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
22 mm |
3.5 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
3.47 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.13 V |
19.1262 mm |
10 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
330 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
100 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
SELF-TIMED WRITE CYCLE; POWER DOWN OPTION |
e0 |
.03 Amp |
22 mm |
8.5 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
17 mm |
2.6 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
440 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
275 MHz |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.05 Amp |
20 mm |
2.2 ns |
||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
20 mm |
3.1 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
430 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
225 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.06 Amp |
20 mm |
2.8 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
256KX32 |
256K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
8388608 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
3.8 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
230 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
QUAD |
R-PQFP-G100 |
1 |
3.6 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
.05 Amp |
20 mm |
7.5 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
3.3 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
e0 |
22 mm |
3.1 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
425 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.03 Amp |
20 mm |
3.5 ns |
||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
22 mm |
||||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
3.1 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
22 mm |
2.8 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
420 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
183 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
e0 |
.05 Amp |
22 mm |
3.3 ns |
||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
375 mA |
262144 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
138 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
LINEAR OR INTERLEAVED BURST |
e0 |
.03 Amp |
20 mm |
4 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
e0 |
.06 Amp |
20 mm |
6.5 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
256KX18 |
256K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX36 |
512K |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
e0 |
20 mm |
6.5 ns |
||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX32 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4.5 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
16777216 bit |
3.135 V |
e0 |
20 mm |
3.1 ns |
||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
380 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
138 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.03 Amp |
20 mm |
4 ns |
||||||||||||||
|
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
290 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
-40 Cel |
QUAD |
R-PQFP-G100 |
2 |
3.6 V |
1.6 mm |
167 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
PIPELINED ARCHITECTURE |
.05 Amp |
20 mm |
3.5 ns |
||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
20 mm |
3.5 ns |
||||||||||||||||||||||||||
|
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
290 mA |
2097152 words |
COMMON |
2.5 |
2.5/3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
2.38 V |
-40 Cel |
QUAD |
R-PQFP-G100 |
2 |
2.625 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
37748736 bit |
2.375 V |
ALSO OPERATES AT 3.3V |
20 mm |
7.5 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.52 mm |
19.05 mm |
Not Qualified |
1179648 bit |
4.75 V |
e0 |
YES |
.09 Amp |
19.05 mm |
11 ns |
||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
290 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
167 MHz |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
NOT SPECIFIED |
NOT SPECIFIED |
.05 Amp |
20 mm |
3.5 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
512KX32 |
512K |
3.14 V |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
167 MHz |
14 mm |
Not Qualified |
16777216 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.06 Amp |
20 mm |
3.5 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
.05 Amp |
20 mm |
6.5 ns |
|||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
350 mA |
262144 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
LINEAR OR INTERLEAVED BURST |
e0 |
.03 Amp |
20 mm |
4 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX36 |
512K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
30 |
225 |
20 mm |
4 ns |
|||||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
6.5 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
400 mA |
131072 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
150 MHz |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.03 Amp |
20 mm |
3.8 ns |
||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
32KX32 |
32K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.13 V |
LINEAR OR INTERLEAVED BURST |
20 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
64KX36 |
64K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
SELF-TIMED WRITE CYCLE |
20 mm |
8 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX18 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
20 mm |
9 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
15 mm |
3.1 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
4.2 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
70 Cel |
512KX18 |
512K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
22 mm |
3.1 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.