Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e3 |
20 |
260 |
.015 Amp |
19.1262 mm |
55 ns |
||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e3 |
20 |
260 |
YES |
.015 Amp |
19.1262 mm |
55 ns |
|||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
305 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.5 mm |
10 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
260 |
.015 Amp |
10 mm |
15 ns |
||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.5 mm |
10 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
260 |
.015 Amp |
10 mm |
25 ns |
||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
2048 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
20 |
260 |
.015 Amp |
10 mm |
55 ns |
|||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.015 Amp |
19.1262 mm |
25 ns |
|||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
CONFIGURED AS 2-WAY 4K X 18 OR DIRECT MAPPED 8K X 18 |
YES |
19.1262 mm |
25 ns |
||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
8192 words |
COMMON |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
S-PQCC-J52 |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
NOT SPECIFIED |
NOT SPECIFIED |
19.1262 mm |
||||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.75 V |
CONFIGURED AS 2-WAY 4K X 18 OR DIRECT MAPPED 8K X 18 |
YES |
19.1262 mm |
25 ns |
||||||||||||||||||||||
Texas Instruments |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
COMMON |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
0 Cel |
QUAD |
S-PQCC-J52 |
Not Qualified |
147456 bit |
25 ns |
|||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
265 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
10 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
280 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
BYTE WRITE |
e0 |
YES |
.02 Amp |
19.1262 mm |
12 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
265 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
BYTE WRITE |
e0 |
YES |
.02 Amp |
19.1262 mm |
15 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
12 ns |
|||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.1262 mm |
1179648 bit |
4.75 V |
19.1262 mm |
10 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
19.1262 mm |
1179648 bit |
4.75 V |
19.1262 mm |
9 ns |
||||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
10 ns |
|||||||||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
19.1262 mm |
10 ns |
||||||||||||||||||||
NXP Semiconductors |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
4.75 V |
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE |
e0 |
YES |
.095 Amp |
19.1262 mm |
12 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
10 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
8 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
5 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
5.25 V |
4.57 mm |
19.125 mm |
1179648 bit |
4.75 V |
19.125 mm |
9 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN; INTERRUPT FLAG |
e3 |
30 |
260 |
19.1262 mm |
15 ns |
|||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.015 Amp |
14 ns |
|||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
235 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.01 Amp |
14 ns |
||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2048 words |
COMMON |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
.65 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
QUAD |
2 |
S-PQFP-G52 |
5.5 V |
2.5 mm |
10 mm |
16384 bit |
4.5 V |
.015 Amp |
10 mm |
25 ns |
|||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
235 mA |
65536 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
.01 Amp |
14 ns |
||||||||||||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
25 ns |
|||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
25 ns |
|||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
30 ns |
|||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
200 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
30 ns |
|||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
230 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
20 ns |
|||||||||||||
Toshiba |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
230 mA |
8192 words |
COMMON |
5 |
5 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.5 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
147456 bit |
4.5 V |
CONFIGURABLE AS 2-WAY 4K*18 |
e0 |
YES |
.04 Amp |
19.1262 mm |
20 ns |
|||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
190 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
e0 |
20 |
225 |
.03 Amp |
19.1262 mm |
100 ns |
||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
70 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQFP-G52 |
5.5 V |
16384 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
70 Cel |
2KX8 |
2K |
0 Cel |
QUAD |
S-PQFP-G52 |
5.5 V |
16384 bit |
4.5 V |
20 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
330 mA |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N52 |
5.5 V |
4.572 mm |
19.1262 mm |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
19.1262 mm |
25 ns |
|||||||||||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
330 mA |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
MATTE TIN |
QUAD |
S-PQCC-N52 |
5.5 V |
4.572 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
19.1262 mm |
25 ns |
|||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
30 |
260 |
.004 Amp |
19.1262 mm |
25 ns |
|||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
2 V |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.0015 Amp |
35 ns |
||||||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
FLATPACK |
85 Cel |
2KX8 |
2K |
-40 Cel |
QUAD |
S-PQFP-G52 |
5.5 V |
16384 bit |
4.5 V |
55 ns |
|||||||||||||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 Class Q |
J BEND |
PARALLEL |
ASYNCHRONOUS |
220 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
2 V |
-55 Cel |
MATTE TIN |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
4.572 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
30 |
260 |
.004 Amp |
19.1262 mm |
25 ns |
||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J52 |
5.5 V |
4.57 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e3 |
19.1262 mm |
100 ns |
|||||||||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
MILITARY |
52 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-PRF-38535 |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
280 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQCC-N52 |
1 |
5.5 V |
4.572 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER DOWN |
e3 |
30 |
260 |
.03 Amp |
19.1262 mm |
25 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.