Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
520 mA |
4194304 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
333 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
335 mA |
1048576 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
2.38 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.12 Amp |
17 mm |
3.4 ns |
||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
400 mA |
4194304 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
|||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
|||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
180 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
100 MHz |
13 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.04 Amp |
15 mm |
8.5 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
690 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.31 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
710 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.32 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
32 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
5.5 V |
1.4 mm |
15 mm |
16777216 bit |
4.5 V |
17 mm |
25 ns |
|||||||||||||||||||||||||||
|
Infineon Technologies |
QDR II PLUS SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1520 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
NO |
.5 Amp |
17 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
760 mA |
4194304 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.38 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
524288 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.29 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
.07 Amp |
15 mm |
3.4 ns |
||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
570 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
380 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.25 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
640 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
333 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
QDR II SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
990 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
8 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
333 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
e0 |
.29 Amp |
15 mm |
.45 ns |
|||||||||||||
Infineon Technologies |
QDR II SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
910 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
8 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
e0 |
.28 Amp |
15 mm |
.45 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.375 V |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
e0 |
220 |
YES |
.12 Amp |
17 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
4194304 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
2.38 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
200 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
15 mm |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
260 |
17 mm |
||||||||||||||||||||||
|
Infineon Technologies |
QDR II PLUS SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1290 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
450 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
NO |
.46 Amp |
17 mm |
.45 ns |
||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
560 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.25 Amp |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
550 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.31 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
13 mm |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
15 mm |
.45 ns |
||||||||||||||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
435 mA |
1048576 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
2.38 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
.12 Amp |
17 mm |
2.6 ns |
||||||||||||
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
4194304 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
3.14 V |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B165 |
3.6 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
17 mm |
3 ns |
|||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
335 mA |
2097152 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.12 Amp |
17 mm |
3.4 ns |
||||||||||
Infineon Technologies |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
333 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
260 |
.27 Amp |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
QDR II SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
790 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3.6 V |
1.4 mm |
15 mm |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
45 ns |
||||||||||||||||||||||||
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
17 mm |
3.4 ns |
||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
15 mm |
.45 ns |
||||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
680 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.07 Amp |
15 mm |
2.6 ns |
|||||||||||
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
COMMON |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
18 |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.35 mm |
166 MHz |
13 mm |
18874368 bit |
1.7 V |
YES |
15 mm |
|||||||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1230 mA |
1048576 words |
COMMON |
1.8 |
1.5,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
633 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
1.23 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
920 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.38 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
530 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
970 mA |
2097152 words |
SEPARATE |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
366 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.97 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
32 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
16777216 bit |
2.7 V |
e1 |
260 |
17 mm |
25 ns |
||||||||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
690 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.31 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
133 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
220 |
17 mm |
6.5 ns |
||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
490 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.26 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
430 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.26 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1210 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
500 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
235 |
.36 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
13 mm |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
15 mm |
3.4 ns |
|||||||||||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
260 |
17 mm |
.45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.