Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8388608 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
8MX18 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
15 mm |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
260 |
17 mm |
||||||||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
690 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.31 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
17 mm |
3 ns |
|||||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
2MX36 |
2M |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
375 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.63 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.12 Amp |
17 mm |
3.4 ns |
|||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
2.38 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
128KX18 |
128K |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B144 |
3.465 V |
1.6 mm |
13 mm |
Not Qualified |
2359296 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
13 mm |
4 ns |
|||||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
710 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.32 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
CACHE SRAM |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
163 mA |
524288 words |
COMMON |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
3.135 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
13 mm |
18874368 bit |
3.135 V |
PIPELINED OPERATION |
YES |
.065 Amp |
15 mm |
3.4 ns |
|||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1230 mA |
1048576 words |
COMMON |
1.8 |
1.5,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
633 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
1.23 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.36 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
965 mA |
4194304 words |
COMMON |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
633 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.965 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.63 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
||||||||||||
|
Infineon Technologies |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
210 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
133 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e1 |
20 |
260 |
.07 Amp |
15 mm |
6.5 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1165 mA |
4194304 words |
SEPARATE |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
633 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
1.165 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
640 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
e0 |
20 |
260 |
.26 Amp |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
820 mA |
524288 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
e1 |
30 |
260 |
.34 Amp |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1445 mA |
1048576 words |
SEPARATE |
1.8 |
1.5,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
450 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
1.445 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
220 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
13 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.04 Amp |
15 mm |
3 ns |
|||||||||||
Infineon Technologies |
QDR II SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
730 mA |
8388608 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
9 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
8MX9 |
8M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V |
e0 |
20 |
220 |
15 mm |
.45 ns |
||||||||||||
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
.07 Amp |
15 mm |
3.4 ns |
||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
4194304 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
QDR II SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
560 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.25 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR II SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX36 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
13 mm |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
220 |
15 mm |
.45 ns |
|||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
220 |
15 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
|||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
590 mA |
524288 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
e1 |
30 |
260 |
.25 Amp |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
QDR II SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
800 mA |
8388608 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
260 |
NO |
.37 Amp |
17 mm |
.45 ns |
|||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
590 mA |
524288 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
220 |
.25 Amp |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
680 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
910 mA |
2097152 words |
COMMON |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
600 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.91 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
32 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3.6 V |
1.4 mm |
15 mm |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
45 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
400 mA |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
167 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3.4 ns |
|||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
910 mA |
2097152 words |
COMMON |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
600 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.91 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1570 mA |
4194304 words |
SEPARATE |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
600 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
1.57 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
590 mA |
524288 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
220 |
.25 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
890 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
500 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.36 Amp |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
590 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
e1 |
.32 Amp |
15 mm |
.45 ns |
|||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
16777216 bit |
2.7 V |
e1 |
260 |
17 mm |
25 ns |
||||||||||||||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
490 mA |
8388608 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
9 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
8MX9 |
8M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.27 Amp |
15 mm |
.45 ns |
|||||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1090 mA |
8388608 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
8MX18 |
8M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
e1 |
260 |
.5 Amp |
17 mm |
.45 ns |
||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
490 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.26 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1000 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.32 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
920 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
400 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.31 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
500 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.36 Amp |
15 mm |
.45 ns |
||||||||||
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
4194304 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
3.14 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
200 MHz |
15 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
17 mm |
3 ns |
|||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3.6 V |
1.4 mm |
15 mm |
16777216 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
45 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
300 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
200 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.07 Amp |
15 mm |
3 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.