Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
STANDARD SRAM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
2.8 mm |
10.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
20.6 mm |
70 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P24 |
1 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.004 Amp |
100 ns |
||||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
MATTE TIN |
DUAL |
R-XDMA-P24 |
5.5 V |
10.54 mm |
17.97 mm |
Not Qualified |
16384 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
33.785 mm |
100 ns |
|||||||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-P24 |
5.5 V |
10.54 mm |
17.97 mm |
Not Qualified |
16384 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
33.785 mm |
100 ns |
|||||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
.004 Amp |
100 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.004 Amp |
100 ns |
|||||||||||||||||||||
|
Gsi Technology |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
140 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
3 V |
-40 Cel |
PURE MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
260 |
.02 Amp |
18.41 mm |
8 ns |
||||||||||||||
Integrated Device Technology |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
145 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5184 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
30 |
225 |
YES |
.015 Amp |
17.9324 mm |
20 ns |
|||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
1MX18 |
1M |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
18874368 bit |
3.135 V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
3 ns |
||||||||||||||||||||||||
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION |
e3 |
YES |
.003 Amp |
39.625 mm |
100 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
20 |
260 |
.000004 Amp |
11.8 mm |
45 ns |
||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP48,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
2 |
R-PDIP-T48 |
5.5 V |
5.334 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN; INTERRUPT FLAG |
e0 |
YES |
.015 Amp |
61.976 mm |
55 ns |
|||||||||||||
|
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
200 MHz |
14 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
40 |
260 |
20 mm |
3 ns |
||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
9.398 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
BATTERY BACK-UP |
e0 |
38.862 mm |
200 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
2.997 mm |
11.303 mm |
4194304 bit |
4.5 V |
260 |
20.446 mm |
45 ns |
|||||||||||||||||||||||
Texas Instruments |
STANDARD SRAM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
4 |
IN-LINE |
DIP16,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||
|
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
.000012 Amp |
20.95 mm |
55 ns |
|||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
230 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
3 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
YES |
.01 Amp |
18.41 mm |
12 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
5.5 V |
3 mm |
8.38 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.000015 Amp |
18.29 mm |
70 ns |
||||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
55 mA |
131072 words |
3 |
3 |
8 |
SMALL OUTLINE |
SOP32,.4 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
2.54 mm |
7.505 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
20 |
260 |
.003 Amp |
20.726 mm |
45 ns |
|||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
.00002 Amp |
20.95 mm |
55 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
16777216 bit |
2.2 V |
30 |
260 |
22.415 mm |
10 ns |
||||||||||||||||||||||
|
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
75 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
4.5 V |
-40 Cel |
TIN SILVER COPPER |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
e1 |
260 |
.005 Amp |
18.41 mm |
10 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
70 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
3 mm |
8.38 mm |
Not Qualified |
262144 bit |
4.5 V |
BATTERY BACKUP |
e0 |
YES |
.00005 Amp |
18.29 mm |
100 ns |
|||||||||||||
|
STMicroelectronics |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
105 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDMA-P32 |
1 |
5.5 V |
9.52 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
10 YEARS OF DATA RETENTION; POWER SUPPLY WRITE PROTECTION; BATTERY BACK-UP |
e3 |
225 |
YES |
.004 Amp |
42.8 mm |
70 ns |
||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
8MX16 |
8M |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
e1 |
260 |
10 mm |
70 ns |
||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
70 mA |
524288 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.7 V |
e4 |
20 |
260 |
.005 Amp |
18.415 mm |
25 ns |
|||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
8388608 bit |
2.2 V |
e0 |
260 |
YES |
.000008 Amp |
8 mm |
45 ns |
|||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
1 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
e1 |
30 |
260 |
YES |
.008 Amp |
8 mm |
10 ns |
|||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
90 mA |
524288 words |
COMMON |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
NO |
3-STATE |
512KX8 |
512K |
3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e4 |
20 |
260 |
YES |
.01 Amp |
18.415 mm |
10 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
524288 words |
COMMON |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
1 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
8388608 bit |
2.2 V |
e4 |
YES |
.03 Amp |
18.415 mm |
10 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
2.2 V |
1 mm |
6 mm |
16777216 bit |
1.65 V |
e1 |
260 |
8 mm |
15 ns |
||||||||||||||||||||||
Infineon Technologies |
CACHE SRAM |
MILITARY |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
125 Cel |
1MX36 |
1M |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
37748736 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
20 |
260 |
17 mm |
6.5 ns |
|||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e4 |
260 |
20 mm |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
175 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.0007 Amp |
18.41 mm |
10 ns |
||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDIP-T32 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
41.91 mm |
70 ns |
||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
3 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
240 |
.000012 Amp |
20.47 mm |
55 ns |
||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65 mA |
8192 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-40 Cel |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
2.794 mm |
8.6865 mm |
65536 bit |
4.5 V |
YES |
.0025 Amp |
18.3895 mm |
45 ns |
|||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
70 mA |
131072 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, SHRINK PITCH |
SSOP48,.4 |
SRAMs |
.635 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
2.794 mm |
7.5 mm |
Not Qualified |
1048576 bit |
2.7 V |
e4 |
20 |
260 |
.005 Amp |
15.875 mm |
25 ns |
|||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
105 Cel |
8KX8 |
8K |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G8 |
3 |
3.6 V |
1.638 mm |
40 MHz |
3.81 mm |
65536 bit |
2.7 V |
30 |
260 |
4.902 mm |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
8388608 bit |
2.2 V |
e0 |
220 |
YES |
.000008 Amp |
8 mm |
45 ns |
|||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
37 mA |
1048576 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.2 V |
CONFIGURABLE AS 2M X 8 ALSO |
e4 |
20 |
260 |
.00001 Amp |
18.4 mm |
45 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8 |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e1 |
30 |
260 |
8 mm |
45 ns |
||||||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.794 mm |
7.5057 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
20 |
260 |
17.9324 mm |
70 ns |
|||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G32 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
2.97 V |
20.95 mm |
15 ns |
||||||||||||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
2.97 V |
e3 |
20 |
260 |
.005 Amp |
20.95 mm |
10 ns |
||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
7 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
8.5 mm |
10 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
1.8 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
1 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
2.2 V |
1.194 mm |
66.7 MHz |
10.16 mm |
4194304 bit |
1.65 V |
e4 |
260 |
YES |
.008 Amp |
18.415 mm |
15 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.