Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
90 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
4194304 bit |
3 V |
e1 |
20 |
260 |
.01 Amp |
8 mm |
10 ns |
||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
524288 words |
COMMON |
3.3 |
8 |
SMALL OUTLINE |
SOJ36,.44 |
1.27 mm |
85 Cel |
NO |
3-STATE |
512KX8 |
512K |
3 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 |
R-PDSO-J36 |
3 |
3.6 V |
3.683 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e4 |
40 |
260 |
YES |
.01 Amp |
23.495 mm |
10 ns |
|||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
100 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
8388608 bit |
3 V |
e3 |
40 |
260 |
.02 Amp |
18.415 mm |
12 ns |
||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
16777216 bit |
3 V |
e1 |
40 |
260 |
.025 Amp |
9.5 mm |
10 ns |
||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
3 V |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
AUTOMATIC POWER-DOWN |
e3 |
20 |
260 |
.05 Amp |
22.415 mm |
10 ns |
|||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
20 |
260 |
.05 Amp |
22.415 mm |
10 ns |
||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
260 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
3 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
e0 |
.05 Amp |
22.415 mm |
12 ns |
|||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
5.5 V |
3.7592 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.01 Amp |
20.955 mm |
35 ns |
||||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP22,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
5.08 mm |
10.16 mm |
Not Qualified |
1024 bit |
4.5 V |
e0 |
YES |
.09 Amp |
28.067 mm |
15 ns |
|||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
4.826 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
30.099 mm |
35 ns |
|||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
125 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
31.877 mm |
20 ns |
||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T24 |
1 |
5.5 V |
4.826 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
31.75 mm |
45 ns |
||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.02 Amp |
31.877 mm |
55 ns |
||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e0 |
YES |
.015 Amp |
19.1262 mm |
45 ns |
||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e0 |
30 |
225 |
YES |
.015 Amp |
19.1262 mm |
55 ns |
||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e0 |
YES |
.015 Amp |
19.1262 mm |
55 ns |
||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
2 |
S-PQCC-J52 |
1 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e0 |
30 |
225 |
YES |
19.1262 mm |
55 ns |
|||||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e3 |
20 |
260 |
.015 Amp |
19.1262 mm |
55 ns |
||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1024 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
8192 bit |
4.5 V |
INTERRUPT FLAG |
e3 |
20 |
260 |
YES |
.015 Amp |
19.1262 mm |
55 ns |
|||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
305 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.5 mm |
10 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
260 |
.015 Amp |
10 mm |
15 ns |
||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.5 mm |
10 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
260 |
.015 Amp |
10 mm |
25 ns |
||||||||||||
Cypress Semiconductor |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
.03 Amp |
20 mm |
5 ns |
|||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
2048 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.45 mm |
10 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
20 |
260 |
.015 Amp |
10 mm |
55 ns |
|||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
275 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.015 Amp |
19.1262 mm |
25 ns |
|||||||||||
|
Cypress Semiconductor |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e3 |
40 |
260 |
.07 Amp |
20 mm |
8.5 ns |
||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.63 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
.07 Amp |
20 mm |
8.5 ns |
|||||||||||||
|
Cypress Semiconductor |
CACHE SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-J28 |
3 |
3.6 V |
3.556 mm |
7.5 mm |
Not Qualified |
262144 bit |
3 V |
e4 |
40 |
260 |
.00002 Amp |
17.907 mm |
15 ns |
||||||||||||
|
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
375 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
3.14 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
167 MHz |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e4 |
40 |
260 |
20 mm |
3.4 ns |
|||||||||||
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
17 mm |
3.4 ns |
||||||||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
165 mA |
8192 words |
COMMON |
3.3 |
3.3 |
8 |
FLATPACK, LOW PROFILE |
QFP64,.66SQ,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
2 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
65536 bit |
3 V |
e4 |
20 |
260 |
.00005 Amp |
14 mm |
25 ns |
|||||||||||
Cypress Semiconductor |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
200 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
17 mm |
3 ns |
||||||||||||||
Cypress Semiconductor |
CACHE SRAM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1024 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1KX4 |
1K |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4096 bit |
4.5 V |
YES |
15.4 mm |
10 ns |
|||||||||||||||||||||||
|
Cypress Semiconductor |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
430 mA |
4194304 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
15 mm |
.45 ns |
|||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
30 |
260 |
.00015 Amp |
17.907 mm |
15 ns |
||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
830 mA |
1048576 words |
COMMON |
1.5 |
1.5/1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
1.4 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
200 MHz |
17 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e1 |
20 |
260 |
.35 Amp |
17 mm |
3.3 ns |
|||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
780 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
1.4 V |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
167 MHz |
17 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e0 |
.35 Amp |
17 mm |
4 ns |
||||||||||||
Cypress Semiconductor |
SRAM MODULE |
COMMERCIAL |
48 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1800 mA |
1048576 words |
COMMON |
5 |
5 |
4 |
MICROELECTRONIC ASSEMBLY |
DIP48,.9 |
8 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-XDMA-T48 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
CONFIGURABLE AS 256K X 16 |
e0 |
NO |
.32 Amp |
35 ns |
|||||||||||||||
Cypress Semiconductor |
SRAM MODULE |
COMMERCIAL |
72 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
MOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
1200 mA |
1048576 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
ZIP72/76,.1,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
4.5 V |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZMA-T72 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
CONFIGURABLE AS 1M X 32 |
e0 |
YES |
.08 Amp |
20 ns |
||||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
175 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
3 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.01 Amp |
18.56 mm |
15 ns |
||||||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
256KX36 |
256K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.2 mm |
13 mm |
Not Qualified |
9437184 bit |
3.135 V |
e0 |
15 mm |
4 ns |
|||||||||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-CDIP-T28 |
1 |
5.5 V |
4.11 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
STORE/RECAL TO EEPROM SOFTWARE |
e0 |
.00075 Amp |
35.56 mm |
35 ns |
|||||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65 mA |
8192 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.794 mm |
8.6865 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
260 |
.00075 Amp |
18.3895 mm |
45 ns |
||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28(UNSPEC) |
SRAMs |
1.27 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
QUAD |
R-CQCC-N28 |
1 |
5.5 V |
2.29 mm |
8.89 mm |
Not Qualified |
65536 bit |
4.5 V |
RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
.004 Amp |
13.97 mm |
35 ns |
||||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
QCCN |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
65 mA |
8192 words |
5 |
5 |
8 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
QUAD |
R-CQCC-N28 |
1 |
5.5 V |
2.29 mm |
8.89 mm |
Not Qualified |
65536 bit |
4.5 V |
.02 Amp |
13.97 mm |
45 ns |
||||||||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.82 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e4 |
40 |
260 |
.0015 Amp |
34.67 mm |
25 ns |
|||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
SYNCHRONOUS |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e4 |
40 |
260 |
.0025 Amp |
36.322 mm |
25 ns |
||||||||||||||||
Cypress Semiconductor |
NON-VOLATILE SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T32 |
1 |
5.5 V |
4.11 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
EEPROM HARDWARE/SOFTWARE STORE; RETENTION/STORE CYCLE = 10 YEARS/100000 |
e0 |
.003 Amp |
40.64 mm |
45 ns |
||||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
SRAMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.67 mm |
7.505 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
260 |
.0015 Amp |
17.905 mm |
25 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.