Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
200 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
3 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
30 |
260 |
.02 Amp |
18.41 mm |
10 ns |
||||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G32 |
3 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
10 |
260 |
YES |
.00045 Amp |
20.95 mm |
12 ns |
||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
3.05 mm |
11.4 mm |
Not Qualified |
4194304 bit |
4.5 V |
.00001 Amp |
20.75 mm |
55 ns |
||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
1048576 words |
COMMON |
3 |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
DUAL |
R-PDSO-G48 |
2 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.7 V |
.000008 Amp |
18.4 mm |
45 ns |
|||||||||||||||
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
COMMON |
8 |
SMALL OUTLINE |
SOP8,.3 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2.7 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G8 |
1 |
3.6 V |
2.03 mm |
66 MHz |
5.25 mm |
1048576 bit |
2.7 V |
e3 |
260 |
NO |
.0002 Amp |
5.26 mm |
|||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
325 mA |
65536 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
4.5 V |
0 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G100 |
3 |
5.5 V |
Not Qualified |
524288 bit |
4.5 V |
e3 |
30 |
260 |
.005 Amp |
15 ns |
||||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
340 mA |
65536 words |
COMMON |
5 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQFP-G100 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
NOT SPECIFIED |
260 |
YES |
.003 Amp |
14 mm |
15 ns |
||||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
340 mA |
65536 words |
COMMON |
5 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
.5 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
0 Cel |
Matte Tin (Sn) |
QUAD |
2 |
S-PQFP-G100 |
3 |
5.5 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
NOT SPECIFIED |
260 |
YES |
.003 Amp |
14 mm |
15 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
305 mA |
65536 words |
COMMON |
5 |
5 |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
4.5 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G100 |
3 |
5.5 V |
1.6 mm |
50 MHz |
14 mm |
Not Qualified |
524288 bit |
4.5 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 |
240 |
.005 Amp |
14 mm |
25 ns |
||||||||||
|
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
185 mA |
16384 words |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
16KX16 |
16K |
3 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
262144 bit |
3 V |
e3 |
30 |
260 |
YES |
.003 Amp |
14 mm |
25 ns |
||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
480 mA |
65536 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
64KX36 |
64K |
3.15 V |
-40 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
3.45 V |
1.7 mm |
133 MHz |
17 mm |
Not Qualified |
2359296 bit |
3.15 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 |
225 |
.04 Amp |
17 mm |
15 ns |
||||||||||
|
Renesas Electronics |
DUAL-PORT SRAM |
INDUSTRIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
220 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
64KX18 |
64K |
3 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1179648 bit |
3 V |
e3 |
30 |
260 |
.003 Amp |
14 mm |
20 ns |
|||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
180 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
18.41 mm |
15 ns |
||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
140 mA |
2048 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQCC-J52 |
3 |
5.5 V |
4.572 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
20 |
225 |
.004 Amp |
19.1262 mm |
55 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
150 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3.15 V |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
10 ns |
||||||||||||
|
Renesas Electronics |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
285 mA |
262144 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e3 |
30 |
260 |
.07 Amp |
20 mm |
7.5 ns |
||||||||||
Texas Instruments |
STANDARD SRAM |
COMMERCIAL |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
16X4 |
16 |
0 Cel |
DUAL |
R-PDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
64 bit |
4.5 V |
19.305 mm |
27 ns |
|||||||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
131072 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
SRAMs |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
5.5 V |
1.727 mm |
3.8985 mm |
Not Qualified |
1048576 bit |
4.5 V |
e4 |
30 |
260 |
.00015 Amp |
4.889 mm |
||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16 mA |
65536 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
1.5 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
1048576 bit |
2.2 V |
e1 |
20 |
260 |
YES |
.000003 Amp |
8 mm |
45 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
20 |
260 |
.000004 Amp |
18.4 mm |
45 ns |
||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
36 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
20 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
1.5 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B36 |
3 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
4194304 bit |
2.2 V |
e1 |
260 |
YES |
.000007 Amp |
8 mm |
45 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
AUTOMOTIVE |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
524288 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
125 Cel |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
8388608 bit |
2.2 V |
e4 |
20 |
260 |
YES |
.00003 Amp |
18.415 mm |
55 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
1048576 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
Not Qualified |
16777216 bit |
e3 |
20 |
260 |
45 ns |
||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
PURE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
16777216 bit |
2.2 V |
30 |
260 |
18.4 mm |
45 ns |
||||||||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
30 |
260 |
.00001 Amp |
11.8 mm |
55 ns |
||||||||||||
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
195 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3 V |
AUTOMATIC POWER-DOWN |
e0 |
.00005 Amp |
14 mm |
20 ns |
|||||||||||||
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
130 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ44,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-J44 |
1 |
5.5 V |
3.7592 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.01 Amp |
28.575 mm |
15 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
1 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
100 MHz |
6 mm |
4194304 bit |
2.2 V |
e1 |
260 |
YES |
.008 Amp |
8 mm |
10 ns |
|||||||||||||||
Rochester Electronics |
STANDARD SRAM |
COMMERCIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ36,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
3 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-J36 |
3.6 V |
3.683 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
.01 Amp |
23.495 mm |
12 ns |
||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e1 |
260 |
8 mm |
10 ns |
||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
250 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
33554432 bit |
3 V |
e1 |
260 |
.05 Amp |
9.5 mm |
12 ns |
|||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
250 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
4MX8 |
4M |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
33554432 bit |
3 V |
e1 |
260 |
.05 Amp |
9.5 mm |
12 ns |
|||||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
180 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e4 |
40 |
260 |
.04 Amp |
20 mm |
3.5 ns |
|||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
200 ns |
|||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
200 ns |
||||||||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.005 Amp |
200 ns |
||||||||||||||||||||
Integrated Device Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J32 |
3 |
5.5 V |
3.759 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
30 |
225 |
.01 Amp |
20.96 mm |
15 ns |
|||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
150 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3.15 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3.15 V |
e3 |
40 |
260 |
.01 Amp |
20.95 mm |
10 ns |
||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
140 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-J32 |
3 |
3.6 V |
3.7592 mm |
7.62 mm |
Not Qualified |
1048576 bit |
3 V |
e3 |
40 |
260 |
.01 Amp |
20.955 mm |
12 ns |
||||||||||||
|
Renesas Electronics |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
285 mA |
262144 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e3 |
30 |
260 |
.07 Amp |
20 mm |
7.5 ns |
||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
140 mA |
1048576 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
1.2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.2 mm |
9 mm |
Not Qualified |
16777216 bit |
2.4 V |
e1 |
10 |
260 |
.05 Amp |
11 mm |
10 ns |
|||||||||||
|
Integrated Silicon Solution |
STANDARD SRAM |
AUTOMOTIVE |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
125 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
9 mm |
16777216 bit |
2.4 V |
11 mm |
10 ns |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
PSEUDO STATIC RAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
4194304 words |
COMMON |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
NO |
3-STATE |
4MX16 |
4M |
2.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
67108864 bit |
2.7 V |
e1 |
10 |
260 |
NO |
.00015 Amp |
8 mm |
70 ns |
||||||||||||||
|
Cypress Semiconductor |
NON-VOLATILE SRAM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
97 mA |
32768 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.4 |
SRAMs |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
2.54 mm |
7.505 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
20 |
260 |
.0015 Amp |
20.726 mm |
25 ns |
|||||||||||||||
Xicor |
NON-VOLATILE SRAM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
16 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16X16 |
16 |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.07 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
EEPROM SOFTWARE STORE/ RECALL; RETENTION/ENDURANCE-100 YEARS/100000 CYCLES |
e0 |
NO |
.00005 Amp |
10.03 mm |
375 ns |
|||||||||||||||
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
QFF |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
SYNCHRONOUS |
305 mA |
65536 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
4.5 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-F100 |
3 |
5.5 V |
1.6 mm |
50 MHz |
14 mm |
Not Qualified |
524288 bit |
4.5 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 |
240 |
.005 Amp |
14 mm |
12 ns |
||||||||||
Renesas Electronics |
MULTI-PORT SRAM |
COMMERCIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
370 mA |
262144 words |
COMMON |
2.5 |
2.5,2.5/3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
2.4 V |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
2.6 V |
1.5 mm |
133 MHz |
17 mm |
Not Qualified |
9437184 bit |
2.4 V |
FLOW-THROUGH OR PIPELINED ARCHITECTURE |
e0 |
20 |
225 |
.015 Amp |
17 mm |
15 ns |
||||||||||
|
Renesas Electronics |
DUAL-PORT SRAM |
INDUSTRIAL |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16384 words |
3.3 |
8 |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
131072 bit |
3 V |
e3 |
NOT SPECIFIED |
260 |
14 mm |
20 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.