Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
4.5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
Multiplexer or Switches |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
COMMON OUTPUT |
1 |
5.5 V |
1.1 mm |
1.5 mm |
Not Qualified |
NC |
93 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
40 |
260 |
30 ns |
40 ohm |
15 ns |
3 ohm |
3 mm |
||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.055 mA |
1 |
4 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,16 |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
4.5 V |
.54 mm |
2.34 mm |
27 dB |
1.65 V |
0 V |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
900 ns |
12 ohm |
325 ns |
.09 ohm |
2.34 mm |
4.5 V |
||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
16 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
3 |
2 |
CMOS |
GULL WING |
5/15 |
SMALL OUTLINE |
SOP16,.25 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
.025 A |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
1200 ohm |
|||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
16 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
3 |
2 |
CMOS |
GULL WING |
5/15 |
SMALL OUTLINE |
SOP16,.25 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
.025 A |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
1200 ohm |
|||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
56 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
.35 mA |
1 |
1 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.19X.43,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
R-XQCC-N56 |
1 |
3.6 V |
.8 mm |
5 mm |
Not Qualified |
54 dB |
3 V |
e3 |
30 |
260 |
9.5 ns |
13 ohm |
.35 ohm |
11 mm |
||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
56 |
QCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
.6 mA |
1 |
8 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER |
LCC56,.19X.43,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
R-XQCC-N56 |
3 |
Not Qualified |
e3 |
25 ohm |
||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
6 |
VSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
2 |
CMOS |
NO LEAD |
2.3 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
TSSOP6,.08 |
Multiplexers or Switches |
.4 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-N6 |
1 |
5.5 V |
.8 mm |
1 mm |
Not Qualified |
57 dB |
1.65 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
24 ns |
15 ohm |
13 ns |
.5 ohm |
1.2 mm |
||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
6 |
TSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
2.5 V |
SMALL OUTLINE, THIN PROFILE |
.95 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.5 mm |
93 dB |
2 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
30 ns |
85 ohm |
15 ns |
2 ohm |
3 mm |
|||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
4.5 V |
2/5.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
235 |
30 ns |
40 ohm |
15 ns |
3 ohm |
2 mm |
||||||||||||||||||||||
|
Onsemi |
SPDT |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
SPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
3 |
2 |
CMOS |
GULL WING |
5/15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.635 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
.025 A |
Not Qualified |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
1200 ohm |
|||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
2.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
65 dB |
1.8 V |
e0 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
VSON |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
1 |
CMOS |
NO LEAD |
3.3 V |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
.35 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-XDSO-N6 |
1 |
4.5 V |
.4 mm |
1 mm |
21 dB |
1.65 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
23.2 ohm |
25 ns |
1 mm |
4.5 V |
|||||||||||||||||||||
Onsemi |
SPDT |
INDUSTRIAL |
14 |
HVQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N14 |
3.6 V |
.8 mm |
2.5 mm |
30 dB |
3 V |
7 ns |
7 ohm |
4 ns |
.3 ohm |
3 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
GULL WING |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
52 dB |
1.65 V |
e3 |
30 ns |
4 ohm |
20 ns |
.15 ohm |
2 mm |
||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
.032 mA |
1 |
10 |
BALL |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA36,6X6,14 |
.35 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B36 |
SEPARATE OUTPUT |
1 |
4.5 V |
.473 mm |
2.06 mm |
30 dB |
1.65 V |
0 V |
e1 |
30 |
260 |
200 ns |
12 ohm |
200 ns |
.12 ohm |
2.06 mm |
4.5 V |
|||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
3 V |
2/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NC |
70 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
4.5 ohm |
40 ns |
.4 ohm |
3 mm |
||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
QUAD |
S-XQCC-N10 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
65 dB |
1.8 V |
e3 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
3 mm |
|||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.3 V |
1.8/4 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.5 V |
.55 mm |
1.4 mm |
Not Qualified |
70 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
.8 ohm |
55 ns |
.4 ohm |
1.8 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
4.5 V |
2/5.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSOP6,.11,37 |
Multiplexer or Switches |
.95 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn80Pb20) |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.5 mm |
Not Qualified |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
235 |
30 ns |
40 ohm |
15 ns |
3 ohm |
3 mm |
||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
4.5 V |
2/5.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
93 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
40 |
260 |
30 ns |
40 ohm |
15 ns |
3 ohm |
2 mm |
||||||||||||||||||||
|
Onsemi |
SPDT |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
VBCC |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BUTT |
1.8 V |
1.8/5 |
CHIP CARRIER, VERY THIN PROFILE |
SOLCC6,.04,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
BOTTOM |
R-PBCC-B6 |
1 |
5.5 V |
.55 mm |
1 mm |
Not Qualified |
60 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
NOT SPECIFIED |
75 ns |
2 ohm |
50 ns |
.15 ohm |
1.45 mm |
||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
65 dB |
1.8 V |
e1 |
BREAK-BEFORE-MAKE |
40 |
260 |
60 ns |
1 ohm |
50 ns |
.06 ohm |
1.965 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/4.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.5 V |
.6 mm |
1.4 mm |
Not Qualified |
68 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
.4 ohm |
30 ns |
.05 ohm |
1.8 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
6 |
TSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
4.5 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE |
TSOP6,.11,37 |
Multiplexer or Switches |
.95 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.5 mm |
Not Qualified |
93 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
30 ohm |
8 ohm |
3 mm |
||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
16 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.08 mA |
3 |
2 |
CMOS |
GULL WING |
-6 V |
-4.5 V |
4.5 V |
2/6,GND/-6 |
SMALL OUTLINE |
SOP16,.3 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
2.05 mm |
.025 A |
5.275 mm |
Not Qualified |
50 dB |
2 V |
0 V |
e0 |
BREAK-BEFORE-MAKE |
245 ns |
80 ohm |
160 ns |
12 ohm |
10.2 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
16 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
GULL WING |
5/15 |
SMALL OUTLINE |
SOP16,.3 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
70 ns |
2 ohm |
70 ns |
.18 ohm |
1.965 mm |
||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
36 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
10 |
1 |
BALL |
2.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
1 |
5 V |
.637 mm |
2.43 mm |
24 dB |
1.5 V |
e1 |
30 |
260 |
1100 ns |
800 ns |
.1 ohm |
2.43 mm |
|||||||||||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.08 mA |
3 |
2 |
CMOS |
GULL WING |
-6 V |
-4.5 V |
4.5 V |
2/6,GND/-6 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.2 mm |
.025 A |
4.4 mm |
Not Qualified |
50 dB |
2 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
245 ns |
80 ohm |
160 ns |
12 ohm |
5 mm |
||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
.05 mA |
1 |
CMOS |
GULL WING |
-12 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1.1 mm |
1.25 mm |
33 dB |
0 V |
-4 V |
e3 |
30 |
260 |
220 ns |
15 ohm |
225 ns |
.3 ohm |
2 mm |
3.3 V |
|||||||||||||||||||||||
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
BALL |
3 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NC |
75 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
240 |
30 ns |
4.5 ohm |
40 ns |
.1 ohm |
1.965 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
57 dB |
1.65 V |
e3 |
40 |
260 |
23 ns |
50 ohm |
12.5 ns |
.5 ohm |
2 mm |
|||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
3 V |
2/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
NOT SPECIFIED |
235 |
60 ns |
1 ohm |
50 ns |
.06 ohm |
3 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
1 |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
1.965 mm |
|||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
14 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
2.7 V |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
70 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
50 ns |
4.5 ohm |
20 ns |
.7 ohm |
5 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
2.5 V |
2/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA10,3X4,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B10 |
SEPARATE OUTPUT |
5.5 V |
.65 mm |
1.465 mm |
Not Qualified |
NO/NC |
65 dB |
1.8 V |
e0 |
BREAK-BEFORE-MAKE |
30 |
240 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
1.965 mm |
||||||||||||||||||||
Onsemi |
SPDT |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
BALL |
1.95 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.625 mm |
.91 mm |
60 dB |
1.65 V |
75 ns |
5 ohm |
50 ns |
.15 ohm |
1.91 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.3 V |
1.8/4 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.08,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
1 |
4.5 V |
.55 mm |
1.6 mm |
Not Qualified |
70 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
100 ns |
.8 ohm |
60 ns |
.4 ohm |
2.1 mm |
|||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
16 |
SOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
GULL WING |
5/15 |
SMALL OUTLINE |
SOP16,.3 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
VSON |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
2.7 V |
1.8/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-N6 |
1 |
5.5 V |
.55 mm |
1 mm |
Not Qualified |
62 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
40 |
260 |
35 ns |
1.7 ohm |
25 ns |
.15 ohm |
1.2 mm |
|||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
6 |
VSON |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
1.8 V |
SMALL OUTLINE, VERY THIN PROFILE |
.35 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N6 |
1 |
5.5 V |
.4 mm |
1 mm |
20 dB |
1.6 V |
30 |
260 |
25 ohm |
40 ohm |
1 mm |
||||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.8 V |
e0 |
2 mm |
|||||||||||||||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
10 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-XQCC-N10 |
5.5 V |
1 mm |
3 mm |
Not Qualified |
65 dB |
1.8 V |
e0 |
60 ns |
1 ohm |
60 ns |
.06 ohm |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
10 |
VQCCN |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
1.8/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC10,.06X.07,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N10 |
SEPARATE OUTPUT |
3.6 V |
.8 mm |
1.4 mm |
Not Qualified |
65 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
50 ns |
.3 ohm |
30 ns |
.05 ohm |
1.8 mm |
|||||||||||||||||||||
Onsemi |
SPDT |
MILITARY |
6 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
2.7 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.95 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.5 mm |
Not Qualified |
57 dB |
1.8 V |
e0 |
3 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.