Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
BICMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
55 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
4.5 ohm |
40 ns |
.1 ohm |
3 mm |
|||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
80 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
60 ns |
4.5 ohm |
40 ns |
.1 ohm |
3 mm |
|||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
80 dB |
2 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
60 ns |
4.5 ohm |
40 ns |
.1 ohm |
3 mm |
|||||||||||||||||||
Maxim Integrated |
SPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
75 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
60 ns |
1 ohm |
40 ns |
.12 ohm |
3 mm |
|||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
75 dB |
2 V |
e3 |
30 |
260 |
60 ns |
1 ohm |
40 ns |
.12 ohm |
3 mm |
||||||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
BICMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
90 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
150 ns |
1.45 ohm |
1000 ns |
.1 ohm |
3 mm |
|||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
24 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
6 |
6 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N24 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
4 mm |
Not Qualified |
70 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
800 ns |
5.5 ohm |
800 ns |
.3 ohm |
4 mm |
|||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
24 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
8 |
CMOS |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
.8 mm |
4 mm |
Not Qualified |
2.3 V |
e3 |
30 |
260 |
55 ohm |
4 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
24 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
8 |
CMOS |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N24 |
1 |
3.6 V |
.8 mm |
4 mm |
2.3 V |
e3 |
30 |
260 |
55 ohm |
4 mm |
|||||||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
J BEND |
5 V |
5/12,GND/-7 |
CHIP CARRIER |
LDCC28,.5SQ |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
SEPARATE OUTPUT |
13.2 V |
4.57 mm |
11.505 mm |
Not Qualified |
95 dB |
4.5 V |
e3 |
100 ns |
185 ohm |
5 ohm |
11.505 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
SINGLE-ENDED MULTIPLEXER |
24 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.1 mA |
1 |
8 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
SEPARATE OUTPUT |
1 |
5.5 V |
1 mm |
4 mm |
2.3 V |
30 |
260 |
.3 ns |
55 ohm |
.3 ns |
4 mm |
|||||||||||||||||||||||||||
|
Diodes Incorporated |
DIFFERENTIAL MULTIPLEXER |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
.05 mA |
1 |
1 |
NO LEAD |
2.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N10 |
SEPARATE OUTPUT |
3.6 V |
.65 mm |
.1 A |
3 mm |
NO |
41 dB |
2.3 V |
BREAK-BEFORE-MAKE |
125 ns |
6 ohm |
12 ns |
.2 ohm |
3 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
SINGLE-ENDED MULTIPLEXER |
16 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.057 mA |
1 |
1 |
33 kHz |
NO LEAD |
-18 V |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
COMMON OUTPUT |
1 |
18 V |
.8 mm |
.44 A |
4 mm |
NO |
62 dB |
4.5 V |
-4.5 V |
-4.5 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
305 ns |
8.9 ohm |
420 ns |
.2 ohm |
4 mm |
18 V |
||||||||||||||||
|
Texas Instruments |
SINGLE-ENDED MULTIPLEXER |
16 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.075 mA |
1 |
2 |
52 kHz |
NO LEAD |
-18 V |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
SEPARATE OUTPUT |
1 |
18 V |
.8 mm |
.44 A |
4 mm |
NO |
62 dB |
4.5 V |
-4.5 V |
-4.5 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
305 ns |
13.5 ohm |
420 ns |
.2 ohm |
4 mm |
18 V |
||||||||||||||||
|
Texas Instruments |
SPDT |
AUTOMOTIVE |
20 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.095 mA |
1 |
4 |
CMOS |
100 kHz |
NO LEAD |
-22 V |
-15 V |
15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
SEPARATE OUTPUT |
2 |
22 V |
.8 mm |
.44 A |
4 mm |
62 dB |
4.5 V |
0 V |
-4.5 V |
e4 |
BREAK-BEFORE-MAKE |
260 |
210 ns |
7.9 ohm |
160 ns |
.2 ohm |
4 mm |
44 V |
|||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
2 |
2 |
50 kHz |
GULL WING |
1.8 V |
1.8/3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
1.95 V |
1.1 mm |
.1 A |
3 mm |
Not Qualified |
73 dB |
1.65 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
1 ohm |
40 ns |
.15 ohm |
3 mm |
3.6 V |
|||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
GULL WING |
1.8 V |
1.8/3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
1 |
1.95 V |
1.1 mm |
.1 A |
3 mm |
Not Qualified |
73 dB |
1.65 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
80 ns |
1 ohm |
40 ns |
.15 ohm |
3 mm |
||||||||||||||||||||
|
Texas Instruments |
SPST |
INDUSTRIAL |
14 |
VQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.01 mA |
4 |
4 |
CMOS |
125 kHz |
NO LEAD |
1.8 V |
1.8/3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC14,.08SQ,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N14 |
SEPARATE OUTPUT |
1 |
3.6 V |
.4 mm |
2 mm |
Not Qualified |
NO |
61 dB |
1.6 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
20 ns |
2 ohm |
12 ns |
.09 ohm |
2 mm |
3.6 V |
||||||||||||||
|
Texas Instruments |
DPDT |
INDUSTRIAL |
8 |
VQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.001 mA |
1 |
2 |
1220 kHz |
NO LEAD |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N8 |
SEPARATE OUTPUT |
1 |
4.3 V |
.6 mm |
1.5 mm |
Not Qualified |
NC |
30 dB |
3 V |
0 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
30 ns |
10 ohm |
25 ns |
.35 ohm |
1.5 mm |
4.3 V |
||||||||||||||||||
|
Texas Instruments |
SPDT |
INDUSTRIAL |
10 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
.005 mA |
2 |
2 |
18.3 kHz |
GULL WING |
2.5 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO/NC |
70 dB |
2.3 V |
-3.2 V |
e4 |
BREAK-BEFORE-MAKE |
30 |
260 |
120 ns |
1.3 ohm |
70 ns |
.3 ohm |
3 mm |
5.5 V |
|||||||||||||||
|
Analog Devices |
SPDT |
AUTOMOTIVE |
20 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
1 |
1 |
CMOS |
NO LEAD |
-16.5 V |
-5 V |
5 V |
+-5/+-15/12 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Multiplexer or Switches |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
16.5 V |
1 mm |
.03 A |
4 mm |
Not Qualified |
70 dB |
4.5 V |
-4.5 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
350 ns |
25 ohm |
350 ns |
.6 ohm |
4 mm |
|||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
J BEND |
-16.5 V |
-15 V |
15 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J28 |
16.5 V |
4.51 mm |
11.506 mm |
68 dB |
10.8 V |
-10.8 V |
450 ohm |
5 ohm |
11.506 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
MILITARY |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
8 |
CMOS |
NO LEAD |
-22 V |
-15 V |
15 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
3 |
22 V |
.8 mm |
4 mm |
60 dB |
9 V |
-9 V |
e4 |
30 |
260 |
242 ns |
15 ohm |
198 ns |
.3 ohm |
4 mm |
||||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO |
55 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
20 ns |
5 ohm |
13 ns |
3 mm |
||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
GULL WING |
3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
SEPARATE OUTPUT |
1 |
5.5 V |
1.1 mm |
3 mm |
Not Qualified |
NO/NC |
60 dB |
1.8 V |
ALSO OPEARTES AT 5 V SUPPLY |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
24 ns |
10 ohm |
11 ns |
.3 ohm |
3 mm |
|||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
48 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
GULL WING |
-2.75 V |
-2.5 V |
2.5 V |
3/5/+-2.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
3 |
2.75 V |
1.2 mm |
.03 A |
7 mm |
Not Qualified |
72 dB |
2.25 V |
ALSO OPERATE WITH 1.8 V TO 5.5 V SINGLE SUPPLY |
-2.25 V |
e0 |
BREAK-BEFORE-MAKE |
240 |
75 ns |
5.5 ohm |
75 ns |
.3 ohm |
7 mm |
|||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
48 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
GULL WING |
-2.75 V |
-2.5 V |
2.5 V |
3/5/+-2.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
3 |
2.75 V |
1.2 mm |
.03 A |
7 mm |
Not Qualified |
72 dB |
2.25 V |
ALSO OPERATE WITH 1.8 V TO 5.5 V SINGLE SUPPLY |
-2.25 V |
e0 |
BREAK-BEFORE-MAKE |
240 |
75 ns |
5.5 ohm |
75 ns |
.3 ohm |
7 mm |
|||||||||||||||||
|
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
48 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
.02 mA |
1 |
16 |
CMOS |
GULL WING |
-2.75 V |
-2.5 V |
2.5 V |
3/5/+-2.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
2.75 V |
1.2 mm |
.03 A |
7 mm |
Not Qualified |
72 dB |
2.25 V |
-2.25 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
37 ns |
5.5 ohm |
26 ns |
.3 ohm |
7 mm |
||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
12 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.001 mA |
2 |
1 |
CMOS |
NO LEAD |
3.3 V |
3/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N12 |
3 |
3.6 V |
1 mm |
3 mm |
Not Qualified |
73 dB |
2.7 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
12.5 ns |
8.8 ohm |
9.5 ns |
.04 ohm |
3 mm |
||||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.7 V |
3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-XDSO-N10 |
SEPARATE OUTPUT |
3 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
NO/NC |
63 dB |
1.8 V |
e3 |
BREAK-BEFORE-MAKE |
260 |
30 ns |
5.75 ohm |
6 ns |
.07 ohm |
3 mm |
|||||||||||||||||||
|
Analog Devices |
SPDT |
INDUSTRIAL |
20 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
2.75 V |
1 mm |
4 mm |
Not Qualified |
36 dB |
1.65 V |
e3 |
260 |
14 ns |
13 ns |
4 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
SPST |
AUTOMOTIVE |
24 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
NO LEAD |
-5.5 V |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
5.5 V |
1 mm |
4 mm |
65 dB |
4.5 V |
-4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
485 ns |
1.2 ohm |
360 ns |
.04 ohm |
4 mm |
||||||||||||||||||||||||||
Intersil |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
BIMOS |
J BEND |
5 V |
4/15 |
CHIP CARRIER |
LDCC44,.7SQ |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
SEPARATE OUTPUT |
1 |
15 V |
4.57 mm |
16.585 mm |
Not Qualified |
95 dB |
4 V |
16 X 8 ARRAY |
e0 |
100 ns |
75 ohm |
100 ns |
6 ohm |
16.585 mm |
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|
Renesas Electronics |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
BIMOS |
J BEND |
5 V |
4/15 |
CHIP CARRIER |
LDCC44,.7SQ |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J44 |
SEPARATE OUTPUT |
3 |
15 V |
4.57 mm |
16.585 mm |
Not Qualified |
95 dB |
4 V |
16 X 8 ARRAY |
e3 |
30 |
245 |
100 ns |
75 ohm |
100 ns |
6 ohm |
16.585 mm |
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|
Vishay Intertechnology |
DIFFERENTIAL MULTIPLEXER |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
4 |
NO LEAD |
-8 V |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
PURE MATTE TIN |
QUAD |
S-XQCC-N16 |
1 |
8 V |
1 mm |
3 mm |
3 V |
-3 V |
80 ns |
15 ohm |
51 ns |
3 mm |
||||||||||||||||||||||||||||
|
Onsemi |
CROSS POINT SWITCH |
INDUSTRIAL |
20 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
NO LEAD |
1.65/4.3 |
CHIP CARRIER |
LCC20,.11SQ,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
1 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Onsemi |
SPDT |
INDUSTRIAL |
20 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
2.775 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
1 |
4.3 V |
.55 mm |
3 mm |
50 dB |
2.65 V |
e4 |
30 |
260 |
37 ns |
14 ohm |
27 ns |
.75 ohm |
3 mm |
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|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
GULL WING |
5 V |
3.3/5,+-40/+-160 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
|||||||||||||||||||
|
Renesas Electronics |
SPDT |
INDUSTRIAL |
10 |
HVSON |
SQUARE |
YES |
PLASTIC/EPOXY |
2 |
1 |
CMOS |
NO LEAD |
3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
6.5 V |
.85 mm |
3 mm |
1.8 V |
e3 |
30 |
260 |
.01 ohm |
3 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
DPDT |
INDUSTRIAL |
9 |
FBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
BICMOS |
BALL |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA9,3X3,16 |
Multiplexer or Switches |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B9 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e2 |
BREAK-BEFORE-MAKE |
30 |
260 |
.55 ohm |
||||||||||||||||||||||||||||||
|
Analog Devices |
SPST |
COMMERCIAL |
48 |
LQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
BICMOS |
GULL WING |
5 V |
3/5 |
FLATPACK, LOW PROFILE |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.8 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G48 |
1 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
50 dB |
2.7 V |
e3 |
30 |
260 |
3500 ns |
48 ohm |
3500 ns |
2.4 ohm |
7 mm |
|||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
68 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
BICMOS |
NO LEAD |
-5.1 V |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
5.1 V |
.8 mm |
10 mm |
4.9 V |
-4.9 V |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
CROSS POINT SWITCH |
INDUSTRIAL |
100 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
BICMOS |
GULL WING |
-5.25 V |
-3 V |
3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
5.25 V |
1.2 mm |
14 mm |
Not Qualified |
112 dB |
2.25 V |
-2.25 V |
e0 |
14 mm |
||||||||||||||||||||||||||||
|
Maxim Integrated |
CROSS POINT SWITCH |
INDUSTRIAL |
100 |
TFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
BICMOS |
GULL WING |
-5.25 V |
-3 V |
3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
3 |
5.25 V |
1.2 mm |
14 mm |
Not Qualified |
112 dB |
2.25 V |
-2.25 V |
e3 |
14 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
16 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
.01 mA |
1 |
8 |
BICMOS |
NO LEAD |
3/5/+-5 |
CHIP CARRIER |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N16 |
1 |
.02 A |
Not Qualified |
e3 |
BREAK-BEFORE-MAKE |
30 |
260 |
300 ns |
550 ohm |
|||||||||||||||||||||||||||
Maxim Integrated |
SINGLE-ENDED MULTIPLEXER |
INDUSTRIAL |
16 |
VQCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
4 |
2 |
CMOS |
NO LEAD |
1.8 V |
1.8/3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Multiplexer or Switches |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
1 |
3.6 V |
1 mm |
.15 A |
4 mm |
Not Qualified |
1.6 V |
e0 |
BREAK-BEFORE-MAKE |
30 ns |
3 ohm |
15 ns |
4 mm |
||||||||||||||||||||||||
Maxim Integrated |
SPST |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
3 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Multiplexer or Switches |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
NO |
80 dB |
2 V |
e0 |
BREAK-BEFORE-MAKE |
245 |
60 ns |
9 ohm |
40 ns |
.2 ohm |
3 mm |
||||||||||||||||||||
|
Analog Devices |
SPST |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
4 |
1 |
CMOS |
NO LEAD |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
1 |
5.5 V |
.8 mm |
3 mm |
Not Qualified |
80 dB |
2 V |
e3 |
30 |
260 |
60 ns |
9 ohm |
40 ns |
.2 ohm |
3 mm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.