32 Power Management ICs 598

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Adjustable Threshold
MCZ33903CS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905S5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33905DS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903BD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903CD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903B3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903DP3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903CD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905DS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904B3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903DP3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904C5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905S5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903BD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V			40	260	11 mm	YES
MCZ33903BD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V			40	260	11 mm	YES
MCZ33903CP3EK,574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903BD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903CS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903DD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904B5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903CS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904A3EK/R2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		27 V	2.45 mm	7.5 mm	Not Qualified	5.5 V					11 mm	NO
MCZ33904C3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905CS3EK,574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33905CS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903DP5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33905CS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903BS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V			40	260	11 mm	YES
MCZ33905BS5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903BS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V			40	260	11 mm	YES
MCZ33904D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903C5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903C5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904B5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33904D5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33904B3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
MCZ33903CP5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MCZ33903D3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260	11 mm	YES
MC34710EW	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	3		GULL WING	30 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SOP32,.4,25	.65 mm	85 Cel	0 Cel		DUAL	R-PDSO-G32		32 V	2.45 mm	7.5 mm		13 V					11 mm	NO
NXQ1TXL5	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32		5.25 V	.85 mm	5 mm		3.4 V	SEATED HEIGHT-NOM				5 mm	NO
NXQ1TXH5	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	5000 mA	1	1		NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32		5.25 V	.85 mm	5 mm		3.5 V	SEATED HGT-NOM				5 mm	NO
MC34710EWR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	3		GULL WING	30 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SOP32,.4,25	.65 mm	85 Cel	0 Cel		DUAL	R-PDSO-G32		32 V	2.45 mm	7.5 mm		13 V					11 mm	NO
NXQ1TXA5	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32		5.25 V	.85 mm	5 mm		3.5 V	SEATED HEIGHT-NOM				5 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.