Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | Maximum Output Current | Trim or Adjustable Output (V) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Main Out Ripple Voltage | Control Technique | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Switcher Config | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Output Voltage | Control Mode | Protection(s) | Maximum Total Power Output | Minimum Operating Temperature | Terminal Finish | Maximum Output Voltage | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width (mm) | Qualification | Normal Position (V) | Minimum Supply Voltage (Vsup) | Nominal Input Voltage | Additional Features | Minimum Input Voltage | Maximum Negative Input Voltage | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Length | Adjustable Threshold | Nominal Output Voltage | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
12.5 mA |
1 |
8 |
NO LEAD |
54 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
57 V |
1 mm |
8 mm |
44 V |
ALSO REQUIRE 3V TO 3.6V SUPPLY VOLTAGE |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
2.8 V |
e4 |
9 |
260 |
2.75 |
8 mm |
YES |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
25 mA |
1 |
6 |
AEC-Q100 |
NO LEAD |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
36 V |
1 mm |
8 mm |
5.1 V |
e3 |
40 |
260 |
+7.5V |
8 mm |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.5 V |
e3 |
40 |
260 |
+2.8V |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
8 mm |
YES |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
56 |
QCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
14 |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
0 Cel |
QUAD |
S-PQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
40 |
260 |
+2.4V |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
VQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
8 mm |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
12.5 mA |
1 |
8 |
NO LEAD |
54 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
57 V |
1 mm |
8 mm |
44 V |
ALSO REQUIRE 3V TO 3.6V SUPPLY VOLTAGE |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
NO LEAD |
54 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N56 |
3 |
57 V |
1 mm |
8 mm |
44 V |
ALSO HAS DIGITAL POWER SUPPLY FROM 3V TO 3.6V |
e4 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N56 |
3 |
3.6 V |
1 mm |
8 mm |
3 V |
e4 |
30 |
260 |
8 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N56 |
3 |
3.6 V |
1 mm |
8 mm |
3 V |
e4 |
30 |
260 |
8 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
NO LEAD |
54 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N56 |
3 |
57 V |
1 mm |
8 mm |
44 V |
ALSO HAS DIGITAL POWER SUPPLY FROM 3V TO 3.6V |
e4 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N56 |
3 |
3.45 V |
1 mm |
8 mm |
2.85 V |
e4 |
30 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
ROHM |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HQCCN |
SQUARE |
YES |
UNSPECIFIED |
.185 mA |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC52,.28SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
5.5 V |
1 mm |
7 mm |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
56 |
QCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
5 |
NO LEAD |
3.6 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-20 Cel |
QUAD |
S-XQCC-N56 |
5.5 V |
1.1 mm |
7 mm |
2.7 V |
7 mm |
YES |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
56 |
HQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
8 |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG |
.4 mm |
85 Cel |
-20 Cel |
QUAD |
S-XQCC-N56 |
5.5 V |
1.1 mm |
7 mm |
2.7 V |
7 mm |
YES |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
2.8 V |
e4 |
30 |
9 |
260 |
2.75 |
8 mm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
56 |
HQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
5 |
NO LEAD |
3.6 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG |
LCC56,.27SQ,16 |
Power Management Circuits |
.4 mm |
85 Cel |
-20 Cel |
QUAD |
S-XQCC-N56 |
3 |
5.5 V |
1.1 mm |
7 mm |
Not Qualified |
2.7 V |
40 |
260 |
7 mm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
BICMOS |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
14 V |
.8 mm |
8 mm |
3 V |
e3 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.7 V |
e3 |
40 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
6.5 mA |
1 |
12 |
BICMOS |
NO LEAD |
3.3 V |
3/14 |
CHIP CARRIER |
LCC56,.31SQ,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N56 |
3 |
14 V |
.8 mm |
8 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
6.5 mA |
1 |
12 |
BICMOS |
NO LEAD |
3.3 V |
3/14 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
14 V |
.8 mm |
8 mm |
Not Qualified |
3 V |
e3 |
30 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
BICMOS |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N56 |
3 |
14 V |
.8 mm |
8 mm |
3 V |
e3 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
BICMOS |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
14 V |
.8 mm |
8 mm |
3 V |
e3 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
4400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
9 |
AEC-Q100 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
3.3 V |
QUAD |
S-PQCC-N56 |
5.5 V |
.9 mm |
7 mm |
2.8 V |
9 |
7 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
3 V |
e4 |
9 |
2.75 |
8 mm |
YES |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
NO LEAD |
48 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N56 |
3 |
57 V |
1 mm |
8 mm |
44 V |
ITS ALSO REQUIRED VDD DIGITAL SUPPLY 3-3.6V |
e4 |
30 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
2.8 V |
e4 |
30 |
9 |
260 |
2.75 |
8 mm |
YES |
|||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
2.8 V |
e4 |
9 |
260 |
2.75 |
8 mm |
YES |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.7 V |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
12 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
2400 kHz |
PLASTIC/EPOXY |
14 A |
1 |
20 |
AEC-Q100 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
.9 mm |
8 mm |
2.8 V |
e4 |
9 |
260 |
2.75 |
8 mm |
YES |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
12 mA |
1 |
1 |
CMOS |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
Other Analog ICs |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
3.6 V |
.8 mm |
7 mm |
Not Qualified |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
NO |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
25 mA |
1 |
6 |
AEC-Q100 |
NO LEAD |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
36 V |
1 mm |
8 mm |
5.1 V |
e3 |
40 |
260 |
+7.5V |
8 mm |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
25 mA |
1 |
6 |
AEC-Q100 |
NO LEAD |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
36 V |
1 mm |
8 mm |
5.1 V |
e3 |
40 |
260 |
+7.5V |
8 mm |
NO |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.5 V |
e3 |
40 |
260 |
+2.8V |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.5 V |
e3 |
40 |
260 |
+2.8V |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-N56 |
3 |
5.5 V |
1 mm |
8 mm |
2.7 V |
e3 |
40 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
OTHER |
56 |
HQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
8 |
NO LEAD |
3.6 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG |
LCC56,.27SQ,16 |
Power Management Circuits |
.4 mm |
85 Cel |
-20 Cel |
QUAD |
S-XQCC-N56 |
3 |
5.5 V |
1.1 mm |
7 mm |
Not Qualified |
2.7 V |
40 |
260 |
7 mm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
MOS |
NO LEAD |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Freescale Semiconductor |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
56 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
14 |
NO LEAD |
3.6 V |
2.8/4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Power Management Circuits |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N56 |
3 |
4.5 V |
.9 mm |
8 mm |
Not Qualified |
2.8 V |
e3 |
40 |
260 |
8 mm |
YES |
Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.
PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.
PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.
One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.