56 Power Management ICs 391

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MVR5510AMBA6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMAHEP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDA6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMA6ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
PC33VR5500V0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	8			NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56		36 V	1 mm	8 mm	5.1 V					8 mm	NO
MVR5510AMBAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBA4ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMA6EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
PCA9450BHN	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	11			NO LEAD	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		5.5 V	1 mm	7 mm	2.7 V					7 mm	YES
MVR5510AMBA6ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
PCA9450AAHN	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	11			NO LEAD	3.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		5.5 V	1 mm	7 mm	2.7 V			260	0.2	7 mm	YES
MVR5510AMBA0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBAHESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDA4ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDA6ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDAHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMA0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMA4EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMA0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBANES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBANESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMALEPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
MVR5510AMMA0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMALESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDANESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDALESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBA0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMANES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
MVR5510AVMANEPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
MVR5510AMBALESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMA0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDANES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMANESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
MVR5510AMDALES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMBALES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMMALES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AMDA0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm	2.7 V		40	260	+7.5V	8 mm	YES
MVR5510AVMALEP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
MVR5510AVMANEP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56		60 V	1 mm	8 mm	2.7 V				+7.5V	8 mm	YES
935353632557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56		4.5 V	.9 mm	8 mm	2.8 V				+2.4V	8 mm	YES
MMPF0100FCAEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V		40	260		8 mm	YES
MC33PF8200DEESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V	e3	40	260	+2.8V	8 mm	YES
MC33PF8201A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9			NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V	e3	40	260		8 mm	YES
MC33PF8200EMESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V	e3	40	260	+2.8V	8 mm	YES
MC33FS5502Y3ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	4		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	60 V	1 mm	8 mm		e3	40	260	+7.5V	8 mm	YES
MMPF0200F3ANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	2.8 V	e3	40	260		8 mm	YES
MC33FS8425G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm	5.1 V		40	260	+7.5V	8 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.