56 Power Management ICs 391

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MC33FS8510A2ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33FS8430G2ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MMPF0100FDAEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC33FS8415G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V			40	260	+7.5V	8 mm	NO
MC33FS8520A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MMPF0100F4AEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0100F3EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V						8 mm	YES
MC33PF8200A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MMPF0100F3AEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0200F4AEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC34PF4210A3ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260	+2.4V	8 mm	YES
MC34PF4210A0ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260	+2.4V	8 mm	YES
MMPF0100FDAEP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC33PF8200D2ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EQESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260		8 mm	YES
MMPF0100FBANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MMPF0100FAANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC33PF8200CXESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MMPF0100FCANES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MMPF0100F3AEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MC33PF8200DFES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33FS8530A1ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33PF8200DBESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC32PF8121F1EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.7 V			40	260		8 mm	YES
MMPF0100FAAZES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC33FS8400G5ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
78M6631-IMR/F/P	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	1			NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		3.6 V	.8 mm	7 mm		3 V						7 mm	NO
78M6631-IM/F/P	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	1			NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		3.6 V	.8 mm	7 mm		3 V						7 mm	NO
78M6631-IMR/F	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	12 mA	1	1	CMOS		NO LEAD	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Other Analog ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		3.6 V	.8 mm	7 mm	Not Qualified	3 V			NOT SPECIFIED	NOT SPECIFIED		7 mm	NO
MAX5958LETN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	3	BICMOS		NO LEAD	12 V	3.3,12	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	13.2 V	.8 mm	7 mm	Not Qualified	10.8 V		e3	30	260		7 mm	YES
MAX16048ETN+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	6.5 mA	1	8	BICMOS		NO LEAD	3.3 V	3/14	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	14 V	.8 mm	8 mm	Not Qualified	3 V		e3	30	260		8 mm	YES
MAX5958LETN+T	Maxim Integrated		INDUSTRIAL	56	QCCN	SQUARE	YES	PLASTIC/EPOXY				BICMOS		NO LEAD		3.3,12	CHIP CARRIER	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N56					Not Qualified			e3
MAX4806CTN+T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		2	2			NO LEAD	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD	S-XQCC-N56		6 V	.8 mm	7 mm		2.7 V			30	260		7 mm	NO
MAX5958AETN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	3	BICMOS		NO LEAD	12 V	3.3,12	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	13.2 V	.8 mm	7 mm	Not Qualified	10.8 V		e3	30	260		7 mm	YES
MAX4807CTN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	2			NO LEAD	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-XQCC-N56	1	6 V	.8 mm	7 mm	Not Qualified	2.7 V		e3	30	260		7 mm	NO
MAX5957AETN+T	Maxim Integrated		INDUSTRIAL	56	QCCN	SQUARE	YES	PLASTIC/EPOXY				BICMOS		NO LEAD		3.3,12	CHIP CARRIER	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N56					Not Qualified			e3
MAX5957LETN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	3	BICMOS		NO LEAD	12 V	3.3,12	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	13.2 V	.8 mm	7 mm	Not Qualified	10.8 V		e3	30	260		7 mm	YES
MAX16048ETN+T	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	8	BICMOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	14 V	.8 mm	8 mm		3 V		e3	30	260		8 mm	YES
MAX77829EWN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS		BALL	5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B56		6.3 V	.69 mm	3.208 mm		3.5 V			NOT SPECIFIED	NOT SPECIFIED		3.208 mm	YES
MAX4806CTN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	2			NO LEAD	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	6 V	.8 mm	7 mm	Not Qualified	2.7 V		e3	30	260		7 mm	NO
MAX16049ETN+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	5 mA	1	8	BICMOS		NO LEAD	3.3 V	3/14	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	14 V	.8 mm	8 mm	Not Qualified	3 V		e3	30	260		8 mm	YES
MAX5958AETN+T	Maxim Integrated		INDUSTRIAL	56	QCCN	SQUARE	YES	PLASTIC/EPOXY				BICMOS		NO LEAD		3.3,12	CHIP CARRIER	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N56					Not Qualified			e3
MAX34451ETN+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	QCCN	SQUARE	YES	PLASTIC/EPOXY						NO LEAD	3.3 V	3.3	CHIP CARRIER	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N56	1				Not Qualified			e3	30	260
MAX16049ATN+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	8	BICMOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	14 V	.8 mm	8 mm	Not Qualified	3 V		e3	30	260		8 mm	NO
MAX8904ETN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED	.165 mA	1	7			NO LEAD	7.2 V	7.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	14 V	.8 mm	7 mm	Not Qualified	3.6 V	SUPPLY VOLTAGE CONSIDERED FOR OVER ALL OPERATION	e3	30	260		7 mm	YES
MAX16049ETN+T	Maxim Integrated		INDUSTRIAL	56	QCCN	SQUARE	YES	PLASTIC/EPOXY	5 mA			BICMOS		NO LEAD		3/14	CHIP CARRIER	LCC56,.31SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N56	3				Not Qualified			e3
MAX5957AETN+	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	3	BICMOS		NO LEAD	12 V	3.3,12	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	13.2 V	.8 mm	7 mm	Not Qualified	10.8 V		e3	30	260		7 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.