NXP Semiconductors Power Management ICs 2,400+

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Part RoHS Manufacturer Other IC type Temperature Grade No. of Terminals Package Code Package Shape Surface Mount Total Dose (V) Maximum Switching Frequency Package Body Material Maximum Supply Current (Isup) Maximum Output Current Trim or Adjustable Output (V) No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Terminal Form Main Out Ripple Voltage Control Technique Nominal Negative Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Power Supplies (V) Switcher Config Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output Voltage Control Mode Protection(s) Maximum Total Power Output Minimum Operating Temperature Terminal Finish Maximum Output Voltage Terminal Position JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width (mm) Qualification Normal Position (V) Minimum Supply Voltage (Vsup) Nominal Input Voltage Additional Features Minimum Input Voltage Maximum Negative Input Voltage JESD-609 Code Switching (V) Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Maximum Switch-on Time Maximum On-state Resistance (Ron) Nominal Threshold Voltage (V) Length Adjustable Threshold Nominal Output Voltage Maximum Input Voltage

UBA2028T

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

COMMERCIAL EXTENDED

20

SOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

13 V

SMALL OUTLINE

1.27 mm

80 Cel

-25 Cel

DUAL

R-PDSO-G20

13.6 V

2.65 mm

7.5 mm

Not Qualified

8.6 V

12.8 mm

NO

SA56614-47GW-G

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

5

LSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

CMOS

GULL WING

5.7 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G5

10 V

1.35 mm

1.6 mm

Not Qualified

.95 V

2.85 mm

NO

MPF7100BMBA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

7

AEC-Q100

NO LEAD

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N48

3

5.5 V

1 mm

7 mm

2.5 V

40

260

+2.8V

7 mm

YES

PC33772ATP5

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

48

LQFP

SQUARE

YES

PLASTIC/EPOXY

1

7

SMARTMOS

UNSPECIFIED

24 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

125 Cel

-40 Cel

QUAD

S-PQFP-X48

30 V

5 V

+4.25V

NO

UBA20272T/N1

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

20

SOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

13 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

12.8 mm

YES

NE57600HD

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

COMMERCIAL

6

TSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G6

1.15 mm

1.6 mm

Not Qualified

2.85 mm

YES

PTN3380BBS,518

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

48

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

1

NO LEAD

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

3.6 V

1 mm

7 mm

3 V

e4

30

260

7 mm

NO

NE56632-29

NXP Semiconductors

MPF5020AVNA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

3

40

260

74LV4799PWDH

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

COMMERCIAL

16

TSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

CMOS

GULL WING

1.2 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

6 V

1.1 mm

4.4 mm

Not Qualified

.9 V

5 mm

NO

PFS8613BMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

60 V

4.5 V

NO

PFS8613BMDA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

60 V

4.5 V

NO

MVR5510AMBANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMBANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AVMALEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

MVR5510AMMA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMMALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMDANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMDALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMMANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

MVR5510AVMANEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

MVR5510AMBALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AVMA0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMDANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMMANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

MVR5510AMDALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMBALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMMALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

2.7 V

40

260

+7.5V

8 mm

YES

MVR5510AVMALEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

MVR5510AVMANEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N56

60 V

1 mm

8 mm

2.7 V

+7.5V

8 mm

YES

PCA9460AUK

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

42

RECTANGULAR

YES

PLASTIC/EPOXY

1

9

BALL

BGA42(UNSPEC)

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

5.5 V

2.7 V

NO

PCA9460BUK

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

42

RECTANGULAR

YES

PLASTIC/EPOXY

1

9

BALL

BGA42(UNSPEC)

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

1

5.5 V

2.7 V

260

NO

PCA9460AUKZ

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

42

RECTANGULAR

YES

PLASTIC/EPOXY

1

9

BALL

BGA42(UNSPEC)

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

1

5.5 V

2.7 V

260

NO

PCA9460BUKZ

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

42

RECTANGULAR

YES

PLASTIC/EPOXY

1

9

BALL

BGA42(UNSPEC)

85 Cel

-40 Cel

BOTTOM

R-PBGA-B42

1

5.5 V

2.7 V

260

NO

UJA1132HW/3V3,118

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935432787557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433093557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935432789557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433003557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

PPF5030BMMA4ES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935432769557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433084557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433086557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433075557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

PPF5030AMDA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935433079557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.