NXP Semiconductors Power Management ICs 2,400+

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Part RoHS Manufacturer Other IC type Temperature Grade No. of Terminals Package Code Package Shape Surface Mount Total Dose (V) Maximum Switching Frequency Package Body Material Maximum Supply Current (Isup) Maximum Output Current Trim or Adjustable Output (V) No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Terminal Form Main Out Ripple Voltage Control Technique Nominal Negative Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Power Supplies (V) Switcher Config Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output Voltage Control Mode Protection(s) Maximum Total Power Output Minimum Operating Temperature Terminal Finish Maximum Output Voltage Terminal Position JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width (mm) Qualification Normal Position (V) Minimum Supply Voltage (Vsup) Nominal Input Voltage Additional Features Minimum Input Voltage Maximum Negative Input Voltage JESD-609 Code Switching (V) Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Maximum Switch-on Time Maximum On-state Resistance (Ron) Nominal Threshold Voltage (V) Length Adjustable Threshold Nominal Output Voltage Maximum Input Voltage

MFS8610BMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

60 V

4.5 V

NO

MFS8610BMDA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

3

60 V

4.5 V

40

260

NO

MFS8610BMBA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

3

60 V

4.5 V

40

260

NO

MFS8613BMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

60 V

4.5 V

NO

MFS8611BMBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

48

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

AEC-Q100

NO LEAD

LCC48(UNSPEC)

125 Cel

-40 Cel

QUAD

R-PQCC-N48

60 V

4.5 V

NO

935316139528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935370633528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935384741557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

CTN730HN/C101Y

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

64

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

250 mA

1

1

NO LEAD

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N64

1.95 V

1 mm

9 mm

1.65 V

9 mm

YES

MCZ33903C3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

MCZ33903CP3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

935315475557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935311658557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MF1S5009DUD

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

OTHER

DIE

RECTANGULAR

YES

UNSPECIFIED

1

1

NO LEAD

UNCASED CHIP

70 Cel

-25 Cel

UPPER

R-XUUC-N

Not Qualified

NO

935371715528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935371915557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

MCZ33905BD3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

54

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G54

3

28 V

2.45 mm

7.5 mm

5.5 V

40

260

17.9 mm

YES

935318793557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

3

40

260

MCZ33905S3EK/R2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

27 V

2.45 mm

7.5 mm

Not Qualified

5.5 V

11 mm

NO

MCZ33903CP5EKR2,518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935311952518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935359123528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935305883118

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

OTHER

16

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

NO LEAD

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

R-PXMA-N16

NO

MCZ33903B5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935375839528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

MCZ33903B5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935383913557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935317815518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935318662557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

MCZ33903CP3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

MCZ33903B3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935383793557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935312715528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935296238518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

MCZ33904C5EK,574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

MCZ33904D3EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

935320371528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935334933574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935383795528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935305702012

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN SILVER COPPER NICKEL

1

e2

30

260

MCZ34653EF

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MF1S5001XDUD/V1

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MM912I637AM2EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

48

HVQCCN

SQUARE

YES

UNSPECIFIED

25 mA

1

1

BICMOS

NO LEAD

3.5/28

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Power Management Circuits

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

28 V

.9 mm

7 mm

Not Qualified

3.5 V

e3

40

260

7 mm

YES

935383915557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935318866564

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935308266598

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MCZ33905CD5EK,574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

54

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G54

28 V

2.45 mm

7.5 mm

5.5 V

17.9 mm

YES

MC13892FJVLR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

3

40

260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.