NXP Semiconductors Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MC33FS8410G6ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC34PF8100EREP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																								3								40	260
MAX6405-46UK	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	4	VFBGA	SQUARE	YES	UNSPECIFIED	.00175 mA	1	1			BALL	3 V	1.5/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel		BOTTOM	S-XBGA-B4		5.5 V	.6096 mm	1.016 mm	Not Qualified	1.2 V					+4.63V	1.016 mm	NO
MAX6352-SZD	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	5	LSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.05 mA	1	1	CMOS		GULL WING		1.5/5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP5/6,.11,37	Power Management Circuits	.95 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G5		5.5 V	1.35 mm	1.6 mm	Not Qualified	1.2 V	RESET THRESHOLD VOLTAGES ARE 2.93V AND 2.32V; MANUAL RESET INPUT				+2.32,2.93V	2.85 mm	NO
MC33909Q3AD	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HLFQFP	SQUARE	YES	PLASTIC/EPOXY		1	3	MOS		GULL WING			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin (Sn)	QUAD	S-PQFP-G48	3	5 V	1.6 mm	7 mm		3.3 V		e3	40	260		7 mm	NO
MC34PF4210A4ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260	+2.4V	8 mm	YES
MAX6347-42W	NXP Semiconductors		INDUSTRIAL	6	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.00175 mA			CMOS		GULL WING		1.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Power Management Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified						+4.2V		NO
MC33FS8405G0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC34PF3001A4EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MC33PF8100F3ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																					TIN			3							e3	40	260
MC32PF3000A5EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC34PF8100CFEPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																								3								40	260
MAX6327-24D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS			3 V	3		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+2.4V		NO
MC33FS8415G0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V			40	260	+7.5V	8 mm	NO
MAX6348-39W	NXP Semiconductors		INDUSTRIAL	6	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.00175 mA			CMOS		GULL WING		1.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Power Management Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified						+3.9V		NO
MAX6347-34D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS				1.5/5		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+3.4V		NO
MAX6404-35UK	NXP Semiconductors		INDUSTRIAL	4	FBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA					BALL		1.5/5	GRID ARRAY, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4					Not Qualified						+3.5V		NO
MC32PF1510A7EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	40	HVQCCN	SQUARE	YES	UNSPECIFIED		1	8			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40	3	7 V	.9 mm	5 mm		3.8 V		e4	40	260		5 mm	YES
MC34PF1510A5EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	40	HVQCCN	SQUARE	YES	UNSPECIFIED		1	8			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40	3	7 V	.9 mm	5 mm		3.8 V		e4	40	260		5 mm	YES
MC33PF8200DEES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MAX6348-33D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS				1.5/5		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+3.3V		NO
MC33VR5500V1ESR2	NXP Semiconductors												AEC-Q100													3								40	260
MC33FS8430G0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MMPF0200NPAEP,557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	VQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		4.5 V	.9 mm	8 mm		2.8 V						8 mm	YES
MAX6347-39D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS				1.5/5		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+3.9V		NO
MC32BC3770CSR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	25	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1			BALL	5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B25		6.2 V	.656 mm	2.17 mm		4 V	RECHARGE THRESHOLD IS 0.1V				+0.1V	2.27 mm	YES
NX5P2553GU6Z	NXP Semiconductors		INDUSTRIAL	6	SON	RECTANGULAR	YES	PLASTIC/EPOXY	.225 mA					NO LEAD		3/5	SMALL OUTLINE	SOLCC6,.08,25	Power Management Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6					Not Qualified
MAX6405-36UK	NXP Semiconductors		INDUSTRIAL	4	FBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA					BALL		1.5/5	GRID ARRAY, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4					Not Qualified						+3.6V		NO
MC33FS8530A1ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
NX20P5090UK	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		15	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		AEC-Q100	BALL	5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA15,3X5,20		.5 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-B15		20 V	.595 mm	1.54 mm		2.5 V					+1.164V	2.56 mm	YES
MAX6348-46D	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	LSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1			GULL WING			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G3		5.5 V	1.35 mm	1.6 mm	Not Qualified	1 V	4.6V RESET THRESHOLD VOLTAGE				+4.6V	2.85 mm	NO
MAX6400-30UK	NXP Semiconductors		INDUSTRIAL	4	FBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA					BALL		1.5/5	GRID ARRAY, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4					Not Qualified						+3.0V		NO
MC33909D3ADR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HLFQFP	SQUARE	YES	PLASTIC/EPOXY		1	3	MOS		GULL WING			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin (Sn)	QUAD	S-PQFP-G48	3	5 V	1.6 mm	7 mm		3.3 V		e3	40	260		7 mm	NO
MAX6346-45W	NXP Semiconductors		INDUSTRIAL	6	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.00175 mA			CMOS		GULL WING		1.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Power Management Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified						+4.5V		NO
MAX810LD-G	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	LSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1			GULL WING	5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	105 Cel	-40 Cel		DUAL	R-PDSO-G3		5.5 V	1.35 mm	1.6 mm	Not Qualified	1 V						2.85 mm	NO
MC34PF1550A1EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MC33909L3ADR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HLFQFP	SQUARE	YES	PLASTIC/EPOXY		1	3	MOS		GULL WING			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin (Sn)	QUAD	S-PQFP-G48	3	5 V	1.6 mm	7 mm		3.3 V		e3	40	260		7 mm	NO
MAX6326-30W	NXP Semiconductors		INDUSTRIAL	6	TSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.00175 mA			CMOS		GULL WING	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Power Management Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G6					Not Qualified						+3V		NO
MC32PF4210A0ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260	+2.4V	8 mm	YES
MAX6346-40D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS				1.5/5		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+4V		NO
MC33772BTA1AER2	NXP Semiconductors																									3								40	260
MAX6328-28D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS			3 V	3		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+2.8V		NO
MAX809TD-G	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	LSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1			GULL WING	3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	105 Cel	-40 Cel		DUAL	R-PDSO-G3		5.5 V	1.35 mm	1.6 mm	Not Qualified	1 V						2.85 mm	NO
MAX6326-26D	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	LSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1			GULL WING			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G3		5.5 V	1.35 mm	1.6 mm	Not Qualified	1 V	2.6V RESET THRESHOLD VOLTAGE				+2.6V	2.85 mm	NO
MAX810MW	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	VSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	1	CMOS		GULL WING	5 V	5	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP3/6,.08	Power Management Circuits	.65 mm	105 Cel	-40 Cel		DUAL	R-PDSO-G3		5.5 V	1 mm	1.25 mm	Not Qualified	1 V					+4.38V	2 mm	NO
MAX6346-41D	NXP Semiconductors		INDUSTRIAL	3			YES	PLASTIC/EPOXY	.00175 mA			CMOS				1.5/5		TO-236	Power Management Circuits		85 Cel	-40 Cel								Not Qualified						+4.1V		NO
MC32PF1550A2EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MAX6402-24UK	NXP Semiconductors		INDUSTRIAL	4	FBGA	SQUARE	YES	PLASTIC/EPOXY	.00175 mA					BALL		1.5/5	GRID ARRAY, FINE PITCH	BGA4,2X2,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B4					Not Qualified						+2.4V		NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.