NXP Semiconductors Power Management ICs 2,400+

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Part RoHS Manufacturer Other IC type Temperature Grade No. of Terminals Package Code Package Shape Surface Mount Total Dose (V) Maximum Switching Frequency Package Body Material Maximum Supply Current (Isup) Maximum Output Current Trim or Adjustable Output (V) No. of Functions No. of Channels Technology Screening Level Nominal Bandwidth Terminal Form Main Out Ripple Voltage Control Technique Nominal Negative Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Power Supplies (V) Switcher Config Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output Voltage Control Mode Protection(s) Maximum Total Power Output Minimum Operating Temperature Terminal Finish Maximum Output Voltage Terminal Position JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width (mm) Qualification Normal Position (V) Minimum Supply Voltage (Vsup) Nominal Input Voltage Additional Features Minimum Input Voltage Maximum Negative Input Voltage JESD-609 Code Switching (V) Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Maximum Switch-on Time Maximum On-state Resistance (Ron) Nominal Threshold Voltage (V) Length Adjustable Threshold Nominal Output Voltage Maximum Input Voltage

MCZ33904B5EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935353765557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MCZ33904D5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

MM912I637TV1EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

MF1S5030XDA8

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

OTHER

14

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

NO LEAD

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

UNSPECIFIED

R-PXMA-N14

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

NO

935322212564

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935381904557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

40

260

935306521518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935358987557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935320368557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

935319854518

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935310974557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935384684557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

MF1S5030XDA8/V1

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MM912J637AM2EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

48

HVQCCN

SQUARE

YES

UNSPECIFIED

25 mA

1

1

BICMOS

NO LEAD

3.5/28

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Power Management Circuits

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

28 V

.9 mm

7 mm

Not Qualified

3.5 V

e3

40

260

7 mm

YES

MCZ33904B3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G32

28 V

2.45 mm

7.5 mm

5.5 V

11 mm

YES

935385412528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

MFS5600AMMA8ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

3

40

260

935289062518

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

COMMERCIAL EXTENDED

20

SOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

13 V

SMALL OUTLINE

1.27 mm

80 Cel

-25 Cel

DUAL

R-PDSO-G20

13.6 V

2.65 mm

7.5 mm

8.6 V

12.8 mm

NO

935315534557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

MF1S5031XDUD

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

OTHER

DIE

UNSPECIFIED

YES

UNSPECIFIED

1

1

NO LEAD

UNCASED CHIP

70 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

NO

935333163574

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

935315937557

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935315951528

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

TIN

3

e3

40

260

935382407528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

MM912I637AV1EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

48

HVQCCN

SQUARE

YES

UNSPECIFIED

25 mA

1

1

BICMOS

NO LEAD

3.5/28

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Power Management Circuits

.5 mm

125 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N48

3

28 V

.9 mm

7 mm

Not Qualified

3.5 V

e3

40

260

7 mm

YES

935384682528

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

935382409557

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

TIN

3

e3

40

260

MCZ33903CP5EKR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

MCZ33903D3EK

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

AUTOMOTIVE

32

HSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

MOS

GULL WING

10.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

28 V

2.45 mm

7.5 mm

5.5 V

e3

40

260

11 mm

YES

MC34PF1550A5EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

40

QCCN

SQUARE

YES

PLASTIC/EPOXY

1

7

NO LEAD

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

4.5 V

.9 mm

5 mm

2.5 V

e4

40

260

+6.5V

5 mm

YES

MMPF0100FCAEPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

56

HVQCCN

SQUARE

YES

UNSPECIFIED

1

14

NO LEAD

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

3

4.5 V

.9 mm

8 mm

2.8 V

40

260

8 mm

YES

MC33PF8200DEESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

12

NO LEAD

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQCC-N56

3

5.5 V

1 mm

8 mm

2.5 V

e3

40

260

+2.8V

8 mm

YES

MAX6352-LSD

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

5

LSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

.05 mA

1

1

CMOS

GULL WING

1.5/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP5/6,.11,37

Power Management Circuits

.95 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G5

5.5 V

1.35 mm

1.6 mm

Not Qualified

1.2 V

RESET THRESHOLD VOLTAGES ARE 4.63V AND 2.93V; MANUAL RESET INPUT

+2.93,4.63V

2.85 mm

NO

MC33PF8201A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

INDUSTRIAL

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

9

NO LEAD

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQCC-N56

3

5.5 V

1 mm

8 mm

2.7 V

e3

40

260

8 mm

YES

MAX6326-29W

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

3

VSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

SMALL OUTLINE, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G3

5.5 V

1 mm

1.25 mm

Not Qualified

1 V

2.9V RESET THRESHOLD VOLTAGE

+2.9V

2 mm

NO

MAX810SD-G

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

3

LSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.95 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G3

5.5 V

1.35 mm

1.6 mm

Not Qualified

1 V

2.85 mm

NO

MAX708SD-T

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

8

SOP

RECTANGULAR

YES

PLASTIC/EPOXY

1

1

GULL WING

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-45 Cel

DUAL

R-PDSO-G8

5.5 V

1.73 mm

3.9 mm

Not Qualified

1.2 V

4.875 mm

YES

MC33PF8200EMESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

12

NO LEAD

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQCC-N56

3

5.5 V

1 mm

8 mm

2.5 V

e3

40

260

+2.8V

8 mm

YES

MC33FS5502Y3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT

56

HVQCCN

SQUARE

YES

PLASTIC/EPOXY

1

4

AEC-Q100

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-PQCC-N56

3

60 V

1 mm

8 mm

e3

40

260

+7.5V

8 mm

YES

MC33771BSB2AE/R2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

64

HLFQFP

SQUARE

YES

PLASTIC/EPOXY

1

8

MOS

GULL WING

56 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

.5 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G64

61.6 V

1.6 mm

10 mm

9.6 V

10 mm

NO

MMPF0200F3ANES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

56

HVQCCN

SQUARE

YES

UNSPECIFIED

1

12

MOS

NO LEAD

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

4.5 V

.9 mm

8 mm

2.8 V

e3

40

260

8 mm

YES

TEA1103TD-T

NXP Semiconductors

BATTERY CHARGE CONTROLLER

OTHER

20

SOP

RECTANGULAR

YES

200 kHz

PLASTIC/EPOXY

.014 A

1

BICMOS

GULL WING

PULSE WIDTH MODULATION

SINGLE

SMALL OUTLINE

1.27 mm

85 Cel

VOLTAGE-MODE

-20 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

10 V

5.5 V

12.8 mm

11.5 V

MC33PF3000A7ES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

48

HVQCCN

SQUARE

YES

UNSPECIFIED

1

12

MOS

NO LEAD

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N48

3

4.5 V

.9 mm

7 mm

2.8 V

ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V

40

260

7 mm

YES

MAX6401-25UK

NXP Semiconductors

INDUSTRIAL

4

FBGA

SQUARE

YES

PLASTIC/EPOXY

.00175 mA

BALL

1.5/5

GRID ARRAY, FINE PITCH

BGA4,2X2,20

Power Management Circuits

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B4

Not Qualified

+2.5V

NO

MC33PF3000A3ES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

INDUSTRIAL

48

HVQCCN

SQUARE

YES

UNSPECIFIED

1

12

MOS

NO LEAD

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N48

3

4.5 V

.9 mm

7 mm

2.8 V

ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V

40

260

7 mm

YES

MAX6346-43W

NXP Semiconductors

INDUSTRIAL

6

TSSOP

RECTANGULAR

YES

PLASTIC/EPOXY

.00175 mA

CMOS

GULL WING

1.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

Power Management Circuits

.635 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G6

Not Qualified

+4.3V

NO

NX20P0407UKZ

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT

12

RECTANGULAR

YES

PLASTIC/EPOXY

1

4

BALL

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

1

260

NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.