NXP Semiconductors Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Adjustable Threshold
935385412557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935358981557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
MC13892EJVLR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																			3							40	260
MF1S5000XDA8/V1J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	14		RECTANGULAR	YES	PLASTIC/EPOXY	1	1		NO LEAD		MICROELECTRONIC ASSEMBLY		70 Cel	-25 Cel		UNSPECIFIED	R-PXMA-N14								NOT SPECIFIED	NOT SPECIFIED		NO
MF1S5001XDUF	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER		DIE	UNSPECIFIED	YES	UNSPECIFIED	1	1		NO LEAD		UNCASED CHIP		70 Cel	-25 Cel		UPPER	X-XUUC-N					Not Qualified						NO
935312927557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																TIN			3						e3	40	260
935382504557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935371934557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
935312026528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935294613518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935370635528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
MCZ33903BD3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		40	260	11 mm	YES
MCZ33903BD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		40	260	11 mm	YES
935333167518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935320599557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																TIN			3						e3	40	260
935333165518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935312083557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935320371557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935318395557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																TIN			3						e3	40	260
MCZ33903CP3EK,574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V				11 mm	YES
MF1S5000XDA8,118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	14		RECTANGULAR	YES	PLASTIC/EPOXY	1	1		NO LEAD		MICROELECTRONIC ASSEMBLY		70 Cel	-25 Cel	Silver (Ag)	UNSPECIFIED	R-PXMA-N14							e4				NO
935354255528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
MCZ33903BD5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V				11 mm	YES
935317731528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																Tin (Sn)			3						e3
935368343557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935320717528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935320821528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
935324525518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935371867557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
MCZ33903D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260	11 mm	YES
935359129528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935316316557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																			3							40	260
935315689528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																TIN			3						e3	40	260
935318205557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935333167574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935293825118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16		RECTANGULAR	YES	PLASTIC/EPOXY	1	1		NO LEAD		MICROELECTRONIC ASSEMBLY		70 Cel	-25 Cel		UNSPECIFIED	R-PXMA-N16											NO
935318807697	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
935386336557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935320599528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																TIN			3						e3	40	260
MCZ33905CD5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260	17.9 mm	YES
935384741528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935383795557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935310712557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																TIN			3						e3	40	260
935381904528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
935308113118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
MCZ33903D3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260	11 mm	YES
935371928557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																NICKEL PALLADIUM GOLD			3						e4	40	260
MCZ33905D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY	1	1	MOS	GULL WING	10.5 V	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G54		28 V	2.45 mm	7.5 mm		5.5 V				17.9 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.