NXP Semiconductors Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MM912J637TV1EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MM912J637AV1EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HVQCCN	SQUARE	YES	UNSPECIFIED	25 mA	1	1	BICMOS	NO LEAD		3.5/28	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Power Management Circuits	.5 mm	125 Cel	-40 Cel	Tin (Sn)	QUAD	S-XQCC-N48	3	28 V	.9 mm	7 mm	Not Qualified	3.5 V	e3	40	260		7 mm	YES
935361507118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	10	SOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		GULL WING	5 V		SMALL OUTLINE			1.27 mm	105 Cel	-20 Cel		DUAL	R-PDSO-G10			1.75 mm	3.9 mm							6.2 mm	NO
935340782557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935371713557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				NICKEL PALLADIUM GOLD			3						e4	40	260
935384516528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
935308883118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		10	SOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		GULL WING	20 V		SMALL OUTLINE	SOP10,.24		1.27 mm	125 Cel	-25 Cel		DUAL	R-PDSO-G10			1.75 mm	3.9 mm						+9.9V	6.2 mm	NO
935310912518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
MCZ33905DD3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	54	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G54	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260		17.9 mm	YES
935318204528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935317536557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN SILVER			3						e2	40	260
935317944557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																				Tin (Sn)			3						e3
935324525574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
935315651557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935353765528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935315683528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																				TIN			3						e3	40	260
935371926557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				NICKEL PALLADIUM GOLD			3						e4	40	260
935318654528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																				TIN			3						e3	40	260
935312715557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935306517518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MF1S5030XDA8,118	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	14		RECTANGULAR	YES	PLASTIC/EPOXY		1	1		NO LEAD			MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel	Silver (Ag)	UNSPECIFIED	R-PXMA-N14							e4					NO
935355113557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935306523518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935375839557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
MM912J637AM2EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HVQCCN	SQUARE	YES	UNSPECIFIED	25 mA	1	1	BICMOS	NO LEAD		3.5/28	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Power Management Circuits	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	28 V	.9 mm	7 mm	Not Qualified	3.5 V	e3	40	260		7 mm	YES
MCZ33904D5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260		11 mm	YES
MCZ33905CS3EK,574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G32		28 V	2.45 mm	7.5 mm		5.5 V					11 mm	YES
935384684528	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935296236518	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935310937574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
935381902557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				NICKEL PALLADIUM GOLD			3						e4	40	260
935344309528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																				TIN			3						e3	40	260
935307148528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935318258557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935318807699	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				NICKEL PALLADIUM GOLD			3						e4	40	260
MF1S5030XDA4/V1A0J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16		RECTANGULAR	YES	PLASTIC/EPOXY		1	1		NO LEAD			MICROELECTRONIC ASSEMBLY				70 Cel	-25 Cel		UNSPECIFIED	R-PXMA-N16												NO
935312903557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MCZ33905CS3EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260		11 mm	YES
935376115557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
935320729564	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MCZ33903DP5EK	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260		11 mm	YES
935320703528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																				TIN			3						e3	40	260
935340925528	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT
935382407557	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
MCZ33905CS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS	GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V	e3	40	260		11 mm	YES
935315523564	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
935333165574	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																				TIN			3						e3	40	260
935313087557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																							3							40	260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.